KIRBS; Andreas

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIRBS; Andreas.The latest application filed is for "aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy".

Company Profile

5.6.7

KIRBS; Andreas - Berlin DE
Kirbs; Andreas - Potsdam N/A DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Aqueous Indium Or Indium Alloy Plating Bath And Process For Deposition Of Indium Or An Indium Alloy App 20200392637 - SPERLING; Jan ; et al.	2020-12-17
Aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy Grant 10,793,962 - Sperling , et al. October 6, 2	2020-10-06
Process for indium or indium alloy deposition and article Grant 10,753,007 - Vazhenin , et al. A	2020-08-25
Method For Monitoring The Total Amount Of Sulphur Containing Compounds In A Metal Plating Bath App 20200255949 - KIRBS; Andreas ; et al.	2020-08-13
Method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath and controlled process for plating Grant 10,494,732 - Muglali , et al. De	2019-12-03
Method For Monitoring The Total Amount Of Brighteners In An Acidic Copper/copper Alloy Plating Bath And Controlled Process For Plating App 20190078229 - MUGLALI; Mutlu-Iskender ; et al.	2019-03-14
Aqueous Indium Or Indium Alloy Plating Bath And Process For Deposition Of Indium Or An Indium Alloy App 20180355500 - SPERLING; Jan ; et al.	2018-12-13
Process For Indium Or Indium Alloy Deposition And Article App 20180298511 - VAZHENIN; Grigory ; et al.	2018-10-18
Copper plating bath composition Grant 9,551,080 - Brunner , et al. January 24, 2	2017-01-24
Copper Plating Bath Composition App 20150299883 - BRUNNER; Heiko ; et al.	2015-10-22
Electroplating additive for the deposition of metal, a binary, ternary, quaternary or pentanary alloy of elements of group 11 (IB)--group 13 (IIIA)--Group 16 (VIA) Grant 8,828,278 - Voss , et al. September 9, 2	2014-09-09
Electroplating Additive For The Deposition Of Metal, A Binary, Ternary, Quaternary Or Pentanary Alloy Of Elements Of Group 11 (ib)-group 13 (iiia)-group 16 (via) App 20110094583 - Voss; Torsten ; et al.	2011-04-28

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