KINUTA; Takafumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for KINUTA; Takafumi.The latest application filed is for "substrate processing method".

Company Profile

4.5.9

KINUTA; Takafumi - Kakegawa JP
KINUTA; Takafumi - Kakegawa-shi JP
Kinuta; Takafumi - Shizuoka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate Processing Method App 20220076941 - YOSHIDA; Yukifumi ; et al.	2022-03-10
Substrate processing method and substrate processing apparatus Grant 11,260,431 - Yoshida , et al. March 1, 2	2022-03-01
Substrate Cleaning Solution, And Using The Same, Method For Manufacturing Cleaned Substrate And Method For Manufacturing Device App 20220059344 - KINUTA; Takafumi ; et al.	2022-02-24
Substrate Cleaning Solution And Method For Manufacturing Device App 20220056383 - KINUTA; Takafumi ; et al.	2022-02-24
Substrate processing method and substrate processing apparatus Grant 11,211,241 - Yoshida , et al. December 28, 2	2021-12-28
Substrate Processing Method And Substrate Processing Apparatus App 20200384510 - YOSHIDA; Yukifumi ; et al.	2020-12-10
Substrate processing method and substrate processing apparatus Grant 10,792,712 - Yoshida , et al. October 6, 2	2020-10-06
Substrate Processing Method And Substrate Processing Apparatus App 20190366394 - YOSHIDA; Yukifumi ; et al.	2019-12-05
Substrate Processing Method And Substrate Processing Apparatus App 20190371599 - YOSHIDA; Yukifumi ; et al.	2019-12-05
Void forming composition, semiconductor device provided with voids formed using composition, and method for manufacturing semiconductor device using composition Grant 10,435,555 - Nakasugi , et al. O	2019-10-08
Sacrificial Film Composition, Method For Preparing Same, Semiconductor Device Having Voids Formed Using Said Composition, And Method For Manufacturing Semiconductor Device Using Said Composition App 20170218227 - NAKASUGI; Shigemasa ; et al.	2017-08-03
Void Forming Composition, Semiconductor Device Provided With Voids Formed Using Composition, And Method For Manufacturing Semiconductor Device Using Composition App 20170210896 - NAKASUGI; Shigemasa ; et al.	2017-07-27
Composition for forming topcoat layer and resist pattern formation method employing the same Grant 9,482,952 - Wang , et al. November 1, 2	2016-11-01
Composition For Forming Topcoat Layer And Resist Pattern Formation Method Employing The Same App 20160011510 - WANG; Xiaowei ; et al.	2016-01-14

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