| Patent | Date |
|---|
Biochar Containment Boom And Blanket
App 20210108386 - Kinsman; Larry ; et al. | 2021-04-15 |
Method of chemically delaying peroxygen based viscosity reduction reactions
Grant 10,767,460 - Mohs , et al. Sep | 2020-09-08 |
Chip scale package and related methods
Grant 10,770,492 - Su , et al. Sep | 2020-09-08 |
Image Sensor Semiconductor Packages And Related Methods
App 20190229144 - KINSMAN; Larry ; et al. | 2019-07-25 |
Image sensor semiconductor packages and related methods
Grant 10,290,672 - Kinsman , et al. | 2019-05-14 |
Chip Scale Package And Related Methods
App 20180342549 - SU; Bingzhi ; et al. | 2018-11-29 |
Chip scale package and related methods
Grant 10,079,254 - Su , et al. September 18, 2 | 2018-09-18 |
Method of chemically increasing the efficiency of peroxygen based viscosity reduction reactions
Grant 10,053,617 - Mohs , et al. August 21, 2 | 2018-08-21 |
Method and composition for the remediation of contaminants
Grant 9,878,301 - Kinsman , et al. January 30, 2 | 2018-01-30 |
Chip Scale Package And Related Methods
App 20180019275 - SU; Bingzhi ; et al. | 2018-01-18 |
Method Of Chemically Delaying Peroxygen Based Viscosity Reduction Reactions
App 20170362924 - Mohs; Adam ; et al. | 2017-12-21 |
Image Sensor Semiconductor Packages And Related Methods
App 20170345864 - KINSMAN; Larry ; et al. | 2017-11-30 |
Semiconductor Package With Interposer
App 20170345862 - KINSMAN; Larry ; et al. | 2017-11-30 |
Method of chemically delaying peroxygen based viscosity reduction reactions
Grant 9,771,782 - Mohs , et al. September 26, 2 | 2017-09-26 |
Chip scale package and related methods
Grant 9,754,983 - Su , et al. September 5, 2 | 2017-09-05 |
Method for the in situ remediation of contaminants
Grant 9,561,530 - Kinsman , et al. February 7, 2 | 2017-02-07 |
Method Of Chemically Increasing The Efficiency Of Peroxygen Based Viscosity Reduction Reactions
App 20170022409 - Mohs; Adam ; et al. | 2017-01-26 |
Method Of Chemically Delaying Peroxygen Based Viscosity Reduction Reactions
App 20150275064 - Mohs; Adam ; et al. | 2015-10-01 |
Stacked sensor packaging structure and method
Grant 8,791,536 - Kinsman , et al. July 29, 2 | 2014-07-29 |
Stacked Sensor Packaging Structure And Method
App 20120273908 - KINSMAN; LARRY ; et al. | 2012-11-01 |
Packaging methods for imager devices
Grant 7,919,410 - England , et al. April 5, 2 | 2011-04-05 |
Methods for installing a plurality of circuit devices
Grant 7,600,314 - Kinsman , et al. October 13, 2 | 2009-10-13 |
Packaging Methods For Imager Devices
App 20080224192 - England; Luke ; et al. | 2008-09-18 |
Transfer mold semiconductor packaging processes
Grant 7,384,805 - Kinsman , et al. June 10, 2 | 2008-06-10 |
Transfer mold semiconductor packaging processes
Grant 7,148,083 - Kinsman , et al. December 12, 2 | 2006-12-12 |
Circuit substrates, semiconductor packages, and ball grid arrays
Grant 7,095,115 - Kinsman , et al. August 22, 2 | 2006-08-22 |
Methods for installing a circuit device
Grant 7,065,868 - Kinsman , et al. June 27, 2 | 2006-06-27 |
Method and apparatus for installing a circuit device
App 20060048382 - Kinsman; Larry ; et al. | 2006-03-09 |
Method and apparatus for a semiconductor package for vertical surface mounting
Grant 6,903,465 - Farnworth , et al. June 7, 2 | 2005-06-07 |
Transfer mold semiconductor packaging processes, circuit substrates, semiconductor packages, and ball grid arrays
App 20050101061 - Kinsman, Larry ; et al. | 2005-05-12 |
Method for treating recalcitrant organic compounds
App 20050056598 - Chowdhury, Ajit K. ; et al. | 2005-03-17 |
Method and apparatus for a semiconductor package for vertical surface mounting
Grant 6,777,261 - Farnworth , et al. August 17, 2 | 2004-08-17 |
Method and apparatus for installing a circuit device
App 20040139604 - Kinsman, Larry ; et al. | 2004-07-22 |
Circuit substrates, semiconductor packages, and ball grid arrays
App 20040097011 - Kinsman, Larry ; et al. | 2004-05-20 |
Method and apparatus for installing a circuit device
Grant 6,681,480 - Kinsman , et al. January 27, 2 | 2004-01-27 |
Low profile semiconductor package
Grant 6,669,738 - Akram , et al. December 30, 2 | 2003-12-30 |
Circuit Substrates, Semiconductor Packages, And Ball Grid Arrays
App 20030205828 - Kinsman, Larry ; et al. | 2003-11-06 |
Transfer mold semiconductor packaging processes
App 20030104657 - Kinsman, Larry ; et al. | 2003-06-05 |
Heak sink chip package
Grant 6,563,712 - Akram , et al. May 13, 2 | 2003-05-13 |
Low profile semiconductor package
App 20030085459 - Akram, Salman ; et al. | 2003-05-08 |
Method and apparatus for a semiconductor package for vertical surface mounting
App 20030082856 - Farnworth, Warren ; et al. | 2003-05-01 |
Method and apparatus for a semiconductor package for vertical surface mounting
Grant 6,511,863 - Farnworth , et al. January 28, 2 | 2003-01-28 |
Heat sink chip package
Grant 6,493,229 - Akram , et al. December 10, 2 | 2002-12-10 |
Transfer mold semiconductor packaging processes, circuit substrates, semiconductor packages, and ball grid arrays
App 20020145208 - Kinsman, Larry ; et al. | 2002-10-10 |
Heat sink chip package
App 20020126452 - Akram, Salman ; et al. | 2002-09-12 |
Heat sink chip package
App 20020114135 - Akram, Salman ; et al. | 2002-08-22 |
Heat sink chip package
Grant 6,426,875 - Akram , et al. July 30, 2 | 2002-07-30 |
Method and apparatus for a semiconductor package for vertical surface mounting
App 20020030284 - Farnworth, Warren ; et al. | 2002-03-14 |
Semiconductor device comprising a socket and method for forming same
App 20020031858 - Kinsman, Larry ; et al. | 2002-03-14 |
Semiconductor device comprising a socket and method for forming same
Grant 6,320,253 - Kinsman , et al. November 20, 2 | 2001-11-20 |
Method and apparatus for a semiconductor package for vertical surface mounting
Grant 6,291,894 - Farnworth , et al. September 18, 2 | 2001-09-18 |
Method and apparatus for a semiconductor package for vertical surface mounting
App 20010017407 - Farnworth, Warren ; et al. | 2001-08-30 |
Heat sink chip package and method of making
Grant 6,122,171 - Akram , et al. September 19, 2 | 2000-09-19 |
Packaging means for a semiconductor die having particular shelf structure
Grant 5,107,328 - Kinsman April 21, 1 | 1992-04-21 |
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