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name:-0.0047810077667236
name:-0.0073800086975098
name:-0.0063619613647461
King; Wayne E. Patent Filings

King; Wayne E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for King; Wayne E..The latest application filed is for "additive manufacturing powder spreading technology to mitigate surface defects".

Company Profile
6.5.5
  • King; Wayne E. - Danville CA
  • King, Wayne E. - San Ramon CA
  • King; Wayne E. - Woodridge IL
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Additive manufacturing power map to mitigate overhang structure
Grant 11,433,480 - Khairallah , et al. September 6, 2
2022-09-06
Additive manufacturing powder spreading technology to mitigate surface defects
Grant 11,141,912 - Khairallah , et al. October 12, 2
2021-10-12
Controlling AM spatter and conduction
Grant 10,994,337 - Khairallah , et al. May 4, 2
2021-05-04
Additive Manufacturing Powder Spreading Technology To Mitigate Surface Defects
App 20210107214 - Khairallah; Saad A. ;   et al.
2021-04-15
Additive manufacturing power map to mitigate defects
Grant 10,974,456 - Khairallah , et al. April 13, 2
2021-04-13
Controlling Am Spatter And Conduction
App 20200189183 - Khairallah; Saad A. ;   et al.
2020-06-18
Additive Manufacturing Power Map To Mitigate Defects
App 20190291348 - Khairallah; Saad A. ;   et al.
2019-09-26
Additive Manufacturing Power Map To Mitigate Overhang Structure
App 20190291209 - Khairallah; Saad A. ;   et al.
2019-09-26
Intergranular degradation assessment via random grain boundary network analysis
App 20020002865 - Kumar, Mukul ;   et al.
2002-01-10
High-resolution, cryogenic, side-entry type specimen stage
Grant 4,162,401 - King , et al. July 24, 1
1979-07-24

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