King; Jinn-Shing

Patent Applications and Registrations

Patent applications and USPTO patent grants for King; Jinn-Shing.The latest application filed is for "polyimide copolymers and method for fabricating patterned metal oxide layers".

Company Profile

0.19.21

King; Jinn-Shing - Hsinchu N/A TW
King; Jinn-Shing - Hsinchu County TW
KING; Jinn-Shing - Hsinchu City TW
King; Jinn-Shing - Hsinchu Hsien TW
King; Jinn-Shing - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polyimide copolymers and method for fabricating patterned metal oxide layers Grant 9,169,357 - Jeng , et al. October 27, 2	2015-10-27
Polyamic acid resin composition and method for forming polyimide resin Grant 9,051,429 - Chang , et al. June 9, 2	2015-06-09
Polyimide film laminate and metal laminate employing the same Grant 8,652,622 - Lu , et al. February 18, 2	2014-02-18
Thermally curable solder resist composition Grant 8,420,745 - Jeng , et al. April 16, 2	2013-04-16
Polyimide Copolymers And Method For Fabricating Patterned Metal Oxide Layers App 20130029049 - JENG; Jhy-Long ; et al.	2013-01-31
Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof Grant 8,304,666 - Ko , et al. November 6, 2	2012-11-06
Polyimide Film Laminate And Metal Laminate Employing The Same App 20120156459 - Lu; Charng-Shing ; et al.	2012-06-21
Adhesive Composition App 20120121913 - CHANG; Li-Ming ; et al.	2012-05-17
Double-sided metal clad laminate and fabrication method thereof Grant 8,101,038 - Lu , et al. January 24, 2	2012-01-24
Thermally Curable Solder Resist Composition App 20110306703 - JENG; Jhy-Long ; et al.	2011-12-15
Polyamic Acid Resin Composition And Polyimide Film Prepared Therefrom App 20110091732 - Lu; Charng-Shing ; et al.	2011-04-21
Polyamic Acid Resin Composition And Method For Forming Polyimide Resin App 20110054124 - Chang; Li-Ming ; et al.	2011-03-03
Gas Sensing Material And Gas Sensor Employing The Same App 20100163429 - Chiu; Kuo-Chuang ; et al.	2010-07-01
Structure Of Multiple Coaxial Leads Within Single Via In Substrate And Manufacturing Method Thereof App 20100163296 - Ko; Cheng-Ta ; et al.	2010-07-01
Thermally Curable Solder Resist Composition App 20100167205 - JENG; Jhy-Long ; et al.	2010-07-01
Double-sided Metal Clad Laminate And Fabrication Method Thereof App 20100035066 - Lu; Charng-Shing ; et al.	2010-02-11
Organic/inorganic Hybrid Composition With Electrostatic Discharge Protection Property App 20090236132 - Hong; Ming-Tsung ; et al.	2009-09-24
Thermoplastic polyimide composition Grant 7,459,518 - Shih , et al. December 2, 2	2008-12-02
Negative photoresist composition Grant 7,374,861 - Jeng , et al. May 20, 2	2008-05-20
Thermoplastic polyimide composition App 20070276086 - Shih; Shu-Chu ; et al.	2007-11-29
Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof Grant 7,271,206 - Liu , et al. September 18, 2	2007-09-18
Thermoplastic polyimide composition and double-sided flexible copper clad laminate using the same App 20070166535 - Lu; Charng-Shing ; et al.	2007-07-19
Negative photoresist composition App 20070141509 - Jeng; Jyh-Long ; et al.	2007-06-21
Structure of an interleaving striped capacitor substrate Grant 7,102,876 - Lee , et al. September 5, 2	2006-09-05
Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof Grant 7,008,981 - Liu , et al. March 7, 2	2006-03-07
Coating composition of positive photosensitive polyimide App 20050282958 - Jeng, Jyh-Long ; et al.	2005-12-22
Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof App 20050154092 - Liu, Shur-Fen ; et al.	2005-07-14
Structure of an interleaving striped capacitor substrate App 20050146840 - Lee, Min-Lin ; et al.	2005-07-07
Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof App 20050137293 - Liu, Shur-Fen ; et al.	2005-06-23
Composition of barbituric acid-modified BMI and PPE chain-broken in phenol resin Grant 6,780,943 - Liu , et al. August 24, 2	2004-08-24
Positive working photosensitive composition, article and process for forming a relief pattern Grant 6,670,090 - Hsu , et al. December 30, 2	2003-12-30
Structure of an interleaving striped capacitor substrate App 20030184953 - Lee, Min-Lin ; et al.	2003-10-02
Resin composition for circuit boards App 20030144430 - Liu, Shur-Fen ; et al.	2003-07-31
Method for synthesizing polyamic acid for manufacturing flexible amorphous silicon solar cell Grant 5,693,745 - Kuo , et al. December 2, 1	1997-12-02
Method for manufacturing flexible amorphous silicon solar cell Grant 5,356,656 - Kuo , et al. October 18, 1	1994-10-18

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