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Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof Grant 8,304,666 - Ko , et al. November 6, 2 | 2012-11-06 |
Polyimide Film Laminate And Metal Laminate Employing The Same App 20120156459 - Lu; Charng-Shing ;   et al. | 2012-06-21 |
Adhesive Composition App 20120121913 - CHANG; Li-Ming ;   et al. | 2012-05-17 |
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Double-sided Metal Clad Laminate And Fabrication Method Thereof App 20100035066 - Lu; Charng-Shing ;   et al. | 2010-02-11 |
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Thermoplastic polyimide composition Grant 7,459,518 - Shih , et al. December 2, 2 | 2008-12-02 |
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Thermoplastic polyimide composition App 20070276086 - Shih; Shu-Chu ;   et al. | 2007-11-29 |
Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof Grant 7,271,206 - Liu , et al. September 18, 2 | 2007-09-18 |
Thermoplastic polyimide composition and double-sided flexible copper clad laminate using the same App 20070166535 - Lu; Charng-Shing ;   et al. | 2007-07-19 |
Negative photoresist composition App 20070141509 - Jeng; Jyh-Long ;   et al. | 2007-06-21 |
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Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof Grant 7,008,981 - Liu , et al. March 7, 2 | 2006-03-07 |
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