| Patent | Date |
|---|
Method For Etching Features Using A Targeted Deposition For Selective Passivation
App 20220301853 - LIU; Wenchi ; et al. | 2022-09-22 |
Distance measuring device, distance measuring method, and non-transitory computer-readable storage medium for storing program
Grant 11,428,522 - Kimura , et al. August 30, 2 | 2022-08-30 |
Reducing Roughness Of Extreme Ultraviolet Lithography Resists
App 20220157617 - Zhou; Xiang ; et al. | 2022-05-19 |
Atomic layer deposition and etch in a single plasma chamber for critical dimension control
Grant 11,211,253 - Zhou , et al. December 28, 2 | 2021-12-28 |
Atomic layer deposition and etch for reducing roughness
Grant 11,170,997 - Zhou , et al. November 9, 2 | 2021-11-09 |
Integrated Atomic Layer Passivation In Tcp Etch Chamber And In-situ Etch-alp Method
App 20210287909 - Zhou; Xiang ; et al. | 2021-09-16 |
Gas delivery system
Grant 10,957,561 - Drewery , et al. March 23, 2 | 2021-03-23 |
Integrated atomic layer passivation in TCP etch chamber and in-situ etch-ALP method
Grant 10,950,454 - Zhou , et al. March 16, 2 | 2021-03-16 |
Atomic Layer Deposition And Etch In A Single Plasma Chamber For Critical Dimension Control
App 20200328087 - Zhou; Xiang ; et al. | 2020-10-15 |
Atomic layer deposition and etch in a single plasma chamber for critical dimension control
Grant 10,734,238 - Zhou , et al. | 2020-08-04 |
Atomic Layer Deposition And Etch For Reducing Roughness
App 20200243326 - Zhou; Xiang ; et al. | 2020-07-30 |
Atomic layer deposition and etch for reducing roughness
Grant 10,658,174 - Zhou , et al. | 2020-05-19 |
Atomic layer deposition and etch in a single plasma chamber for fin field effect transistor formation
Grant 10,515,815 - Zhou , et al. Dec | 2019-12-24 |
Distance Measuring Device, Distance Measuring Method, And Non-transitory Computer-readable Storage Medium For Storing Program
App 20190178633 - Kimura; Yoshie ; et al. | 2019-06-13 |
Atomic Layer Deposition And Etch In A Single Plasma Chamber For Critical Dimension Control
App 20190157095 - Zhou; Xiang ; et al. | 2019-05-23 |
Atomic Layer Deposition And Etch In A Single Plasma Chamber For Fin Field Effect Transistor Formation
App 20190157096 - Zhou; Xiang ; et al. | 2019-05-23 |
Atomic Layer Deposition And Etch For Reducing Roughness
App 20190157066 - Zhou; Xiang ; et al. | 2019-05-23 |
Integrated Atomic Layer Passivation In Tcp Etch Chamber And In-situ Etch-alp Method
App 20190043728 - Zhou; Xiang ; et al. | 2019-02-07 |
Internal plasma grid applications for semiconductor fabrication
Grant 9,633,846 - Paterson , et al. April 25, 2 | 2017-04-25 |
Method of planarizing an upper surface of a semiconductor substrate in a plasma etch chamber
Grant 9,589,853 - Titus , et al. March 7, 2 | 2017-03-07 |
Gas Delivery System
App 20170032982 - Drewery; John ; et al. | 2017-02-02 |
Air gap spacer integration for improved fin device performance
Grant 9,515,156 - Besser , et al. December 6, 2 | 2016-12-06 |
Air Gap Spacer Integration For Improved Fin Device Performance
App 20160111515 - Besser; Paul Raymond ; et al. | 2016-04-21 |
Internal Plasma Grid Applications For Semiconductor Fabrication
App 20160086795 - Paterson; Alex ; et al. | 2016-03-24 |
Internal plasma grid applications for semiconductor fabrication in context of ion-ion plasma processing
Grant 9,230,819 - Paterson , et al. January 5, 2 | 2016-01-05 |
Method Of Planarizing An Upper Surface Of A Semiconductor Substrate In A Plasma Etch Chamber
App 20150249016 - Titus; Monica ; et al. | 2015-09-03 |
Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basis
Grant 9,012,243 - Kimura , et al. April 21, 2 | 2015-04-21 |
Controlling Cd And Cd Uniformity With Trim Time And Temperature On A Wafer By Wafer Basis
App 20150053347 - Kimura; Yoshie ; et al. | 2015-02-26 |
Internal Plasma Grid Applications For Semiconductor Fabrication
App 20140302678 - Paterson; Alex ; et al. | 2014-10-09 |
Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basis
Grant 8,852,964 - Kimura , et al. October 7, 2 | 2014-10-07 |
Controlling Cd And Cd Uniformity With Trim Time And Temperature On A Wafer By Wafer Basis
App 20140220709 - Kimura; Yoshie ; et al. | 2014-08-07 |
In-situ Metal Residue Clean
App 20140179106 - ZHONG; Qinghua ; et al. | 2014-06-26 |
Etch With Mixed Mode Pulsing
App 20140051256 - ZHONG; Qinghua ; et al. | 2014-02-20 |
Silicon nitride dry trim without top pulldown
Grant 8,431,461 - Zhong , et al. April 30, 2 | 2013-04-30 |
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