loadpatents
name:-0.033980846405029
name:-0.031588792800903
name:-0.02886700630188
Kimura; Wataru Patent Filings

Kimura; Wataru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kimura; Wataru.The latest application filed is for "sliding components".

Company Profile
35.31.39
  • Kimura; Wataru - Tokyo JP
  • Kimura; Wataru - Hanno JP
  • KIMURA; Wataru - Hanno-shi JP
  • Kimura; Wataru - Miyagi-ken JP
  • KIMURA; Wataru - Minato-ku Tokyo
  • Kimura; Wataru - Kawasaki JP
  • KIMURA; Wataru - Kawasaki-shi JP
  • Kimura; Wataru - Miyagi JP
  • Kimura; Wataru - Fujisawa JP
  • Kimura; Wataru - Kanagawa JP
  • Kimura; Wataru - Ise JP
  • Kimura; Wataru - Nagoya JP
  • Kimura; Wataru - Ise-shi JP
  • KIMURA; Wataru - Nagoya-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Seal device
Grant 11,428,324 - Tokunaga , et al. August 30, 2
2022-08-30
Seal ring
Grant 11,293,553 - Kimura , et al. April 5, 2
2022-04-05
Sliding Components
App 20220099191 - SUZUKI; Hiroshi ;   et al.
2022-03-31
Sliding component
Grant 11,125,335 - Kimura , et al. September 21, 2
2021-09-21
Seal device
Grant 11,085,539 - Tokunaga , et al. August 10, 2
2021-08-10
Seal device
Grant 11,078,919 - Tokunaga , et al. August 3, 2
2021-08-03
Semiconductor module
Grant 11,056,422 - Urushihata , et al. July 6, 2
2021-07-06
Seal Ring
App 20210164571 - KIMURA; Wataru ;   et al.
2021-06-03
Sliding component
Grant 11,009,072 - Kimura , et al. May 18, 2
2021-05-18
Semiconductor Module
App 20210134709 - URUSHIHATA; Hiroyoshi ;   et al.
2021-05-06
Seal Ring
App 20210116032 - KIMURA; Wataru ;   et al.
2021-04-22
Seal Ring
App 20210116030 - KIMURA; Wataru ;   et al.
2021-04-22
Seal Ring
App 20210116029 - KIMURA; Wataru ;   et al.
2021-04-22
Brush seal
Grant 10,975,712 - Kimura , et al. April 13, 2
2021-04-13
Input device
Grant 10,953,750 - Uenomachi , et al. March 23, 2
2021-03-23
Seal Ring
App 20210080009 - KIMURA; Wataru ;   et al.
2021-03-18
Sliding Component
App 20210054935 - KIMURA; Wataru ;   et al.
2021-02-25
Seal Device
App 20210054936 - TOKUNAGA; Yuichiro ;   et al.
2021-02-25
Sliding part
Grant 10,907,684 - Kimura , et al. February 2, 2
2021-02-02
Input device
Grant 10,901,451 - Uenomachi , et al. January 26, 2
2021-01-26
Vehicle-to-vehicle communication device, vehicle-to-vehicle communication system and vehicle-to-vehicle communication method
Grant 10,880,709 - Sugiyama , et al. December 29, 2
2020-12-29
Input Device
App 20200379500 - UENOMACHI; Takashi ;   et al.
2020-12-03
Input Device
App 20200376963 - UENOMACHI; Takashi ;   et al.
2020-12-03
Semiconductor module
Grant 10,784,186 - Urushihata , et al. Sept
2020-09-22
Semiconductor module
Grant 10,777,489 - Urushihata , et al. Sept
2020-09-15
Sliding component having fluid introduction groove and dynamic pressure generation groove
Grant 10,704,417 - Tokunaga , et al.
2020-07-07
Sliding Part
App 20200182299 - KIMURA; Wataru ;   et al.
2020-06-11
Slide component
Grant 10,598,286 - Tokunaga , et al.
2020-03-24
Semiconductor module having a grooved clip frame
Grant 10,600,725 - Urushihata , et al.
2020-03-24
Seal Device
App 20200063873 - TOKUNAGA; Yuichiro ;   et al.
2020-02-27
Seal Device
App 20200063871 - TOKUNAGA; Yuichiro ;   et al.
2020-02-27
Seal Device
App 20200032912 - TOKUNAGA; Yuichiro ;   et al.
2020-01-30
Seal Device
App 20200018401 - TOKUNAGA; Yuichiro ;   et al.
2020-01-16
Seal Device
App 20200018400 - TOKUNAGA; Yuichiro ;   et al.
2020-01-16
Seal Device
App 20200011342 - TOKUNAGA; Yuichiro ;   et al.
2020-01-09
Seal Device
App 20200011425 - TOKUNAGA; Yuichiro ;   et al.
2020-01-09
Vehicle-To-Vehicle Communication Device, Vehicle-To-Vehicle Communication System and Vehicle-To-Vehicle Communication Method
App 20190387379 - SUGIYAMA; Yoshikazu ;   et al.
2019-12-19
Sliding Component
App 20190376558 - KIMURA; Wataru ;   et al.
2019-12-12
Semiconductor Module
App 20190371712 - Urushihata; Hiroyoshi ;   et al.
2019-12-05
Semiconductor Module Having A Grooved Clip Frame
App 20190371710 - URUSHIHATA; Hiroyoshi ;   et al.
2019-12-05
Semiconductor Module
App 20190371709 - URUSHIHATA; Hiroyoshi ;   et al.
2019-12-05
Slide component
Grant 10,473,220 - Tokunaga , et al. Nov
2019-11-12
Electromechanical device provided with controlled motor and rotation control method
Grant 10,454,400 - Miyako , et al. Oc
2019-10-22
Sliding component
Grant 10,337,620 - Tokunaga , et al.
2019-07-02
Sliding component
Grant 10,337,560 - Tokunaga , et al.
2019-07-02
Brush Seal
App 20180371928 - KIMURA; Wataru ;   et al.
2018-12-27
Electromechanical Device Provided With Controlled Motor, Motor Controller, And Rotation Control Method
App 20180254723 - MIYAKO; Ikuyasu ;   et al.
2018-09-06
Slide Component
App 20180172162 - TOKUNAGA; Yuichiro ;   et al.
2018-06-21
Sliding Component
App 20180135699 - TOKUNAGA; Yuichiro ;   et al.
2018-05-17
Slide Component
App 20180128377 - TOKUNAGA; Yuichiro ;   et al.
2018-05-10
Sliding Component
App 20180128378 - TOKUNAGA; Yuichiro ;   et al.
2018-05-10
Sliding Component
App 20180073394 - TOKUNAGA; Yuichiro ;   et al.
2018-03-15
STO bias control for MAMR head reliability
Grant 9,672,846 - Tanaka , et al. June 6, 2
2017-06-06
Perpendicular magnetic write head having a controlled magnetization state shield
Grant 9,230,566 - Iwakura , et al. January 5, 2
2016-01-05
Perpendicular magnetic recording write head with plate having coil regions and heat-sink regions
Grant 9,070,384 - Kimura , et al. June 30, 2
2015-06-30
Head-slider including thin-film magnetic-recording head having reduced thermal protrusion
Grant 8,786,986 - Fujita , et al. July 22, 2
2014-07-22
Perpendicular magnetic recording head
Grant 8,270,111 - Okada , et al. September 18, 2
2012-09-18
Perpendicular recording magnetic head
Grant 8,054,580 - Kimura , et al. November 8, 2
2011-11-08
Head-slider Including Thin-film Magnetic-recording Head Having Reduced Thermal Protrusion
App 20110116192 - FUJITA; Shigeo ;   et al.
2011-05-19
Ultrasonic transducer which is either crimped or welded during assembly
Grant 7,876,030 - Taki , et al. January 25, 2
2011-01-25
Ultrasonic transducer and ultrasonic apparatus having the same
Grant 7,847,468 - Kimura , et al. December 7, 2
2010-12-07
Magnetic Head For Perpendicular Recording And Magnetic Recording Apparatus
App 20090290257 - Kimura; Wataru ;   et al.
2009-11-26
Perpendicular magnetic recording head
App 20090073608 - Ookawa; Norihiro ;   et al.
2009-03-19
Ultrasonic Transducer And Method Of Producing The Same
App 20090066192 - TAKI; Hideaki ;   et al.
2009-03-12
Ultrasonic Transducer And Ultrasonic Apparatus Having The Same
App 20090015104 - KIMURA; Wataru ;   et al.
2009-01-15
Magnetoresistive head, with second magnetic domain control layers and manufacturing method thereof
Grant 7,468,870 - Arasawa , et al. December 23, 2
2008-12-23
Perpendicular recording magnetic head
App 20080231994 - Kimura; Wataru ;   et al.
2008-09-25
Perpendicular magnetic recording head and method for production thereof
App 20060221497 - Okada; Tomohiro ;   et al.
2006-10-05
Magnetoresistive head, manufacturing method thereof, and read write separation type head
App 20060158793 - Arasawa; Masatoshi ;   et al.
2006-07-20

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