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Patent applications and USPTO patent grants for Kimura; Katsuichi.The latest application filed is for "solder ball and electronic member".
Patent | Date |
---|---|
Solder ball and electronic member Grant 9,320,152 - Terashima , et al. April 19, 2 | 2016-04-19 |
Solder Ball And Electronic Member App 20150146394 - Terashima; Shinichi ;   et al. | 2015-05-28 |
Solder ball for semiconductor packaging and electronic member using the same Grant 9,024,442 - Terashima , et al. May 5, 2 | 2015-05-05 |
Solder alloy, solder ball and electronic member having solder bump Grant 8,501,088 - Kobayashi , et al. August 6, 2 | 2013-08-06 |
Solder Ball For Semiconductor Packaging And Electronic Member Using The Same App 20120223430 - Terashima; Shinichi ;   et al. | 2012-09-06 |
Lead-free Solder Alloy, Solder Ball, And Electronic Member Comprising Solder Bump App 20120038042 - Sasaki; Tsutomu ;   et al. | 2012-02-16 |
Solder Alloy, Solder Ball And Electronic Member Having Solder Bump App 20090196789 - Kobayashi; Takayuki ;   et al. | 2009-08-06 |
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