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Patent applications and USPTO patent grants for Kimbaras; Dziugas.The latest application filed is for "laser processing method and a system for wafer dicing or cutting by use of a multi-segment focusing lens".
Patent | Date |
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Multi-segment focusing lens and the laser processing for wafer dicing or cutting Grant 11,253,955 - Vanagas , et al. February 22, 2 | 2022-02-22 |
Method of laser scribing of semiconductor workpiece using divided laser beams Grant 10,916,461 - Vanagas , et al. February 9, 2 | 2021-02-09 |
Laser Processing Method And A System For Wafer Dicing Or Cutting By Use Of A Multi-segment Focusing Lens App 20190217420 - VANAGAS; Egidijus ;   et al. | 2019-07-18 |
Method Of Laser Scribing Of Semiconductor Workpiece Using Divided Laser Beams App 20190139799 - VANAGAS; Egidijus ;   et al. | 2019-05-09 |
Method of laser processing for substrate cleaving or dicing through forming "spike-like" shaped damage structures Grant 10,074,565 - Vanagas , et al. September 11, 2 | 2018-09-11 |
Method Of Laser Processing For Substrate Cleaving Or Dicing Through Forming "spike-like" Shaped Damage Structures App 20170250113 - VANAGAS; Egidijus ;   et al. | 2017-08-31 |
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