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Patent applications and USPTO patent grants for Kim; Yungi.The latest application filed is for "die bonding apparatus and mehod and substrate bonding apparatus and mehod".
Patent | Date |
---|---|
Vehicle hood Grant D903,555 - Choi , et al. December 1, 2 | 2020-12-01 |
Die Bonding Apparatus And Mehod And Substrate Bonding Apparatus And Mehod App 20200126948 - LEE; HANGLIM ;   et al. | 2020-04-23 |
Interconnection architecture for semiconductor device Grant 8,558,385 - Yoon , et al. October 15, 2 | 2013-10-15 |
Interconnection architecture for semiconductor device App 20120013015 - Yoon; Jaeman ;   et al. | 2012-01-19 |
Interconnection architecture for semiconductor device Grant 8,058,169 - Yoon , et al. November 15, 2 | 2011-11-15 |
Gate electrode structure Grant 8,008,155 - Yoon , et al. August 30, 2 | 2011-08-30 |
Plasma display panel having main and quxiliary barrier ribs Grant 7,569,990 - Kim , et al. August 4, 2 | 2009-08-04 |
Interconnection Architecture For Semiconductor Device App 20080017997 - Yoon; Jaeman ;   et al. | 2008-01-24 |
Gate electrode structure App 20080017913 - Yoon; Jaeman ;   et al. | 2008-01-24 |
Plasma display panel App 20060125367 - Kim; Hongyeol ;   et al. | 2006-06-15 |
Semiconductor device and method for making the same Grant 5,308,784 - Kim , et al. May 3, 1 | 1994-05-03 |
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