Kim; Youngchul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Youngchul.The latest application filed is for "apparatus and method for inspecting ventilation".

Company Profile

7.41.37

Kim; Youngchul - Gimpo-si KR
KIM; Youngchul - Gyeonggi-do KR
Kim; Youngchul - Gwangmyeong-si KR
Kim; Youngchul - Osan-si KR
KIM; Youngchul - Gwangju KR
Kim; YoungChul - Kyoungki-do KR
Kim; YoungChul - Youngin-si N/A KR
Kim; YoungChul - Kyoungki-di KR
Kim; YoungChul - Kyonggi-do KR
KIM; Youngchul - Seongnam-si KR
KIM; Youngchul - Daejeon KR
Kim; YoungChul - Yongin-si KR
Kim; Youngchul - Gwangmyeong KR
Kim; Youngchul - Daejeon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrostatic discharge handling for sense IGBT using Zener diode Grant 11,201,144 - Kim , et al. December 14, 2	2021-12-14
Apparatus And Method For Inspecting Ventilation App 20210148777 - HWANG; Seunghyun ; et al.	2021-05-20
Electrostatic Discharge Handling For Sense Igbt Using Zener Diode App 20210111171 - KIM; Hye-Mi ; et al.	2021-04-15
Hydraulic pressure supply system of automatic transmission for hybrid vehicle and cooling the jacket of a motor with low pressure supply to low pressure part Grant 10,604,003 - Kim , et al.	2020-03-31
Reverse power reducing method and plasma power apparatus using the same Grant 10,410,834 - Ryu , et al. Sept	2019-09-10
Pharmaceutical Composition Comprising Tha As Active Ingredient For Treating Breast Cancer App 20190262281 - KANG; Keon Wook ; et al.	2019-08-29
Power Transmission System Of Hybrid Electric Vehicle App 20190202278 - Kim; Wan Soo ; et al.	2019-07-04
High-frequency power generator with enhanced pulse function Grant 10,276,351 - Kim , et al.	2019-04-30
Solenoid valve Grant 10,035,152 - Lee , et al. July 31, 2	2018-07-31
Hydraulic Pressure Supply System Of Automatic Transmission For Hybrid Vehicle App 20180086197 - KIM; Jong Hyun ; et al.	2018-03-29
Solenoid Valve App 20170282191 - LEE; June Ho ; et al.	2017-10-05
Solenoid Valve App 20170284558 - LEE; June Ho ; et al.	2017-10-05
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form Grant 9,721,921 - Kim , et al. August 1, 2	2017-08-01
Oil supply system Grant 9,631,614 - Kim , et al. April 25, 2	2017-04-25
Semiconductor device and method of forming a fan-in package-on-package structure using through silicon vias Grant 9,559,046 - Bae , et al. January 31, 2	2017-01-31
Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding Grant 9,524,958 - Choi , et al. December 20, 2	2016-12-20
Integrated circuit packaging system with surface treatment and method of manufacture thereof Grant 9,385,100 - Lee , et al. July 5, 2	2016-07-05
Semiconductor Device and Method of Bonding Semiconductor Die to Substrate in Reconstituted Wafer Form App 20160163675 - Kim; KyungMoon ; et al.	2016-06-09
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form Grant 9,287,204 - Kim , et al. March 15, 2	2016-03-15
Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding Grant 9,252,130 - Kim , et al. February 2, 2	2016-02-02
Semiconductor device and method of simultaneous molding and thermalcompression bonding Grant 9,245,770 - Kim , et al. January 26, 2	2016-01-26
Stackable package by using internal stacking modules Grant 9,245,772 - Yang , et al. January 26, 2	2016-01-26
Semiconductor device and method of making bumpless flipchip interconnect structures Grant 9,240,331 - Kim , et al. January 19, 2	2016-01-19
Integrated circuit packaging system with connection structure and method of manufacture thereof Grant 9,202,715 - Kim , et al. December 1, 2	2015-12-01
Defective Pixel Managing Circuit, Image Sensor Module Including The Same, And Defective Pixel Management Method App 20150341575 - KIM; Youngchul ; et al.	2015-11-26
Integrated circuit packaging system with heat spreader and method of manufacture thereof Grant 9,093,415 - Kim , et al. July 28, 2	2015-07-28
Integrated Circuit Packaging System With Heat Spreader And Method Of Manufacture Thereof App 20150084178 - Kim; Oh Han ; et al.	2015-03-26
Semiconductor Device and Method of Individual Die Bonding Followed by Simultaneous Multiple Die Thermal Compression Bonding App 20150001703 - Choi; JoonYoung ; et al.	2015-01-01
Integrated circuit packaging system having dual sided connection and method of manufacture thereof Grant 8,906,740 - Ko , et al. December 9, 2	2014-12-09
Method for diagnosing and controlling an unusual hydraulic state of hybrid vehicle transmission Grant 8,900,096 - Jeong , et al. December 2, 2	2014-12-02
Oil Supply System App 20140334955 - Kim; Youngchul ; et al.	2014-11-13
Stackable Package by Using Internal Stacking Modules App 20140319702 - Yang; JoungIn ; et al.	2014-10-30
Method Of Distributing And Storing File-based Data App 20140317056 - KIM; Youngchul ; et al.	2014-10-23
Methods of Manufacturing Flip Chip Semiconductor Packages Using Double-Sided Thermal Compression Bonding App 20140295618 - Kim; KyungMoon ; et al.	2014-10-02
Integrated circuit packaging system with package-in-package and method of manufacture thereof Grant 8,816,487 - Bae , et al. August 26, 2	2014-08-26
Hydraulic control system of automatic transmission for hybrid vehicle Grant 8,790,207 - Shin , et al. July 29, 2	2014-07-29
Cooling system for cooling driving motor of hybrid vehicle and method for controlling the same Grant 8,774,996 - Shin , et al. July 8, 2	2014-07-08
Semiconductor Device and Method of Making Bumpless Flipchip Interconnect Structures App 20140175661 - Kim; KyungMoon ; et al.	2014-06-26
Semiconductor Device and Method of Simultaneous Molding and Thermalcompression Bonding App 20140175639 - Kim; KyungMoon ; et al.	2014-06-26
Semiconductor Device and Method of Bonding Semiconductor Die to Substrate in Reconstituted Wafer Form App 20140175640 - Kim; KyungMoon ; et al.	2014-06-26
Method for manufacture of inline integrated circuit system Grant 8,501,540 - Yee , et al. August 6, 2	2013-08-06
Method for Diagnosing and Controlling an Unusual Hydraulic State of Hybrid Vehicle Transmission App 20130150209 - JEONG; SANGHYUN ; et al.	2013-06-13
Method for determining operating state of element of transmission Grant 8,406,962 - Kim , et al. March 26, 2	2013-03-26
Hydraulic control system of power train for hybrid vehicle Grant 8,403,787 - Kim , et al. March 26, 2	2013-03-26
Transmission for hybrid vehicle Grant 8,313,401 - Kim , et al. November 20, 2	2012-11-20
Cooling System For Cooling Driving Motor Of Hybrid Vehicle And Method For Controlling The Same App 20120143414 - Shin; Gwang Seob ; et al.	2012-06-07
Integrated Circuit Packaging System With Connection Structure And Method Of Manufacture Thereof App 20120119360 - Kim; YoungChul ; et al.	2012-05-17
Method For Determining Operating State Of Element Of Transmission App 20120116622 - Kim; Youngchul ; et al.	2012-05-10
Hydraulic Control System Of Automatic Transmission For Hybrid Vehicle App 20120090950 - SHIN; Gwang Seob ; et al.	2012-04-19
Method For Manufacture Of Inline Integrated Circuit System App 20110244635 - Yee; Jae Hak ; et al.	2011-10-06
Integrated Circuit Packaging System Having Dual Sided Connection And Method Of Manufacture Thereof App 20110186994 - Ko; Chan Hoon ; et al.	2011-08-04
Inline integrated circuit system Grant 7,968,981 - Yee , et al. June 28, 2	2011-06-28
Hydraulic Control System Of Power Train For Hybrid Vehicle App 20110136608 - Kim; Youngchul ; et al.	2011-06-09
Transmission For Hybrid Vehicle App 20110111906 - Kim; Baekyu ; et al.	2011-05-12
Integrated circuit packaging system having dual sided connection and method of manufacture thereof Grant 7,923,290 - Ko , et al. April 12, 2	2011-04-12
Stackable Package By Using Internal Stacking Modules App 20110024890 - Yang; JoungIn ; et al.	2011-02-03
Integrated Circuit Packaging System Having Dual Sided Connection And Method Of Manufacture Thereof App 20100244221 - Ko; Chan Hoon ; et al.	2010-09-30
Stackable package by using internal stacking modules Grant 7,800,211 - Yang , et al. September 21, 2	2010-09-21
Semiconductor Device and Method of Forming a Fan-In Package-on-Package Structure Using Through-Silicon Vias App 20100065948 - Bae; Hyunil ; et al.	2010-03-18
Inline Integrated Circuit System App 20090258494 - Yee; Jae Hak ; et al.	2009-10-15
Integrated Circuit Packaging System With Package-in-package And Method Of Manufacture Thereof App 20090236723 - Bae; Hyunil ; et al.	2009-09-24
Assembling Structure Of Temperature-adjusting Door App 20090197517 - Wang; Yoonho ; et al.	2009-08-06
Stackable Package by Using Internal Stacking Modules App 20090001540 - YANG; JoungIn ; et al.	2009-01-01

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