KIM; Yeong Kwan

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIM; Yeong Kwan.The latest application filed is for "multi-step atomic layer deposition process for silicon nitride film formation".

Company Profile

0.17.16

KIM; Yeong Kwan - Dublin CA
Kim; Yeong Kwan - Pleasanton CA
Kim; Yeong-kwan - Suwon KR
Kim; Yeong-kwan - Kyungki-do KR
Kim; Yeong-Kwan - Dresden DE
Kim; Yeong-kwan - Seongnam KR
Kim, Yeong-kwan - Suwon-city KR
Kim, Yeong-Kwan - Seongnam-city KR
Kim; Yeong-kwan - Sungnam KR
Kim, Yeong-kwan - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-Step Atomic Layer Deposition Process for Silicon Nitride Film Formation App 20170107614 - LEE; Sang In ; et al.	2017-04-20
Method for hafnium nitride deposition Grant 7,547,952 - Metzner , et al. June 16, 2	2009-06-16
Semiconductor device having thin film formed by atomic layer deposition and method for fabricating the same Grant 7,544,607 - Kim , et al. June 9, 2	2009-06-09
Methods of fabricating integrated circuit devices that utilize doped poly-Si.sub.1-xGe.sub.x conductive plugs as interconnects Grant 7,316,954 - Oh , et al. January 8, 2	2008-01-08
Storage capacitor and method for producing such a storage capacitor App 20070210367 - Bernhardt; Henry ; et al.	2007-09-13
Method For Hafnium Nitride Deposition App 20060208215 - Metzner; Craig ; et al.	2006-09-21
Multi-layer film for thin film structure, capacitor using the same and fabrication method thereof Grant 7,052,918 - Lim , et al. May 30, 2	2006-05-30
Semiconductor device having thin film formed by atomic layer deposition and method for fabricating the same App 20050087828 - Kim, Yeong-kwan ; et al.	2005-04-28
Methods of fabricating integrated circuit devices that utilize doped poly-Si1-xGex conductive plugs as interconnects App 20050064660 - Oh, Sang-jeong ; et al.	2005-03-24
Semiconductor device having thin film formed by atomic layer deposition and method for fabricating the same Grant 6,833,310 - Kim , et al. December 21, 2	2004-12-21
Integrated circuit devices that utilize doped Poly-Si1-xGex conductive plugs as interconnects Grant 6,828,616 - Oh , et al. December 7, 2	2004-12-07
Method of forming a thin film using atomic layer deposition Grant 6,828,218 - Kim , et al. December 7, 2	2004-12-07
Method for hafnium nitride deposition App 20040198069 - Metzner, Craig ; et al.	2004-10-07
Multi-layer film for thin film structure, capacitor using the same and fabrication method thereof App 20030207529 - Lim, Jae-Soon ; et al.	2003-11-06
Method of forming thin film using atomic layer deposition method Grant 6,576,053 - Kim , et al. June 10, 2	2003-06-10
Atomic layer deposition apparatus and method for operating the same App 20030066483 - Lee, Joo-Won ; et al.	2003-04-10
Semiconductor memory device having capacitor protection layer and method for manufacturing the same Grant 6,509,601 - Lee , et al. January 21, 2	2003-01-21
Method of forming a thin film using atomic layer deposition App 20030013320 - Kim, Yeong-Kwan ; et al.	2003-01-16
Method for manufacturing thin film App 20030003230 - Kim, Yeong-kwan ; et al.	2003-01-02
Semiconductor device and method for manufacturing the same App 20020195683 - Kim, Yeong-kwan ; et al.	2002-12-26
Method for forming a capacitor of a semiconductor device Grant 6,489,214 - Kim , et al. December 3, 2	2002-12-03
Methods of forming thin films by atomic layer deposition Grant 6,468,924 - Lee , et al. October 22, 2	2002-10-22
Integrated circuit devices that utilize doped Poly-Si1-xGex conductive plugs as interconnects and methods of fabricating the same App 20020093042 - Oh, Sang-jeong ; et al.	2002-07-18
Methods of forming thin films by atomic layer deposition App 20020068466 - Lee, Seung-hwan ; et al.	2002-06-06
Method of forming silicon containing thin films by atomic layer deposition utilizing trisdimethylaminosilane Grant 6,391,803 - Kim , et al. May 21, 2	2002-05-21
Capacitor for a semiconductor device and method for forming the same App 20020058391 - Kim, Yeong-Kwan ; et al.	2002-05-16
Semiconductor device having thin film formed by atomic layer deposition and method for fabricating the same App 20020047151 - Kim, Yeong-Kwan ; et al.	2002-04-25
Method For Manufacturing Thin Film App 20020048635 - KIM, YEONG-KWAN ; et al.	2002-04-25
Capacitor for a semiconductor device and method for forming the same Grant 6,335,240 - Kim , et al. January 1, 2	2002-01-01
Method for manufacturing thin film using atomic layer deposition Grant 6,270,572 - Kim , et al. August 7, 2	2001-08-07
Method for forming dielectric film of capacitor having different thicknesses partly Grant 6,207,487 - Kim , et al. March 27, 2	2001-03-27
Method for manufacturing thin films of multi-element group oxide or nitride Grant 6,162,501 - Kim December 19, 2	2000-12-19
Integrated circuit devices having buffer layers therein which contain metal oxide stabilized by heat treatment under low temperature Grant 6,144,060 - Park , et al. November 7, 2	2000-11-07

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