KIM; Tae Yeong

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIM; Tae Yeong.The latest application filed is for "spike spectrum output-type pressure sensor comprising electrolyte, and method for manufacturing same".

Company Profile

12.17.21

KIM; Tae Yeong - Pohang-si KR
Kim; Tae-Yeong - Yongin-si KR
Kim; Tae Yeong - Seoul KR
Kim; Tae Yeong - Suwon-si KR
Kim; Tae Yeong - Hwaseong-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Spike Spectrum Output-type Pressure Sensor Comprising Electrolyte, And Method For Manufacturing Same App 20220136919 - JEONG; Unyong ; et al.	2022-05-05
Semiconductor laser device Grant 11,283,235 - Kang , et al. March 22, 2	2022-03-22
Sparse-coded ambient backscatter communication method and system Grant 10,999,848 - Kim , et al. May 4, 2	2021-05-04
Wafer bonding apparatus and wafer bonding system using the same Grant 10,971,379 - Kim , et al. April 6, 2	2021-04-06
Wafer bonding apparatus for directly bonding wafers and a wafer bonding system having the same Grant 10,906,283 - Kim , et al. February 2, 2	2021-02-02
Wafer Bonding Apparatuses App 20200373186 - Kim; Hoe Chul ; et al.	2020-11-26
Apparatuses of bonding substrates and methods of bonding substrates Grant 10,833,047 - Kim , et al. November 10, 2	2020-11-10
Substrate bonding apparatus Grant 10,763,243 - Kim , et al. Sep	2020-09-01
Apparatuses Of Bonding Substrates And Methods Of Bonding Substrates App 20200152596 - KIM; Hoe Chul ; et al.	2020-05-14
Wafer bonding apparatus and wafer bonding system including the same Grant 10,639,875 - Kim , et al.	2020-05-05
Semiconductor Laser Device App 20200136341 - KANG; Pil-Kyu ; et al.	2020-04-30
Sparse-coded Ambient Backscatter Communication Method And System App 20200107324 - KIM; Tae Yeong ; et al.	2020-04-02
Apparatus For Bonding Substrates And Method Of Bonding Substrates App 20200075360 - KIM; Jun-hyung ; et al.	2020-03-05
Wafer Bonding Apparatus For Directly Bonding Wafers And A Wafer Bonding System Having The Same App 20200055296 - KIM; Tae-Yeong ; et al.	2020-02-20
Wafer Bonding Apparatus And Wafer Bonding System Using The Same App 20200013643 - KIM; Jun-hyung ; et al.	2020-01-09
Apparatus and method for selecting beam pattern in communication system supporting beamforming scheme Grant 10,523,302 - Lee , et al. Dec	2019-12-31
Method of manufacturing substrate structure Grant 10,468,400 - Kang , et al. No	2019-11-05
Substrate Bonding Apparatus App 20190189593 - KIM; Jun-Hyung ; et al.	2019-06-20
Method for receiving signal using distribution storage cache retention auxiliary node in wireless communication system, and apparatus therefor Grant 10,200,889 - Seo , et al. Fe	2019-02-05
Wafer Bonding Apparatus And Wafer Bonding System Including The Same App 20180370210 - Kim; Tae-yeong ; et al.	2018-12-27
Apparatus And Method For Selecting Beam Pattern In Communication System Supporting Beamforming Scheme App 20180262255 - LEE; Inkyu ; et al.	2018-09-13
Method Of Manufacturing Substrate Structure App 20180226390 - KANG; Pil Kyu ; et al.	2018-08-09
Wafer-to-wafer bonding structure Grant 9,941,243 - Kim , et al. April 10, 2	2018-04-10
Multi-stacked device having TSV structure Grant 9,935,037 - Kang , et al. April 3, 2	2018-04-03
Method For Receiving Signal Using Distribution Storage Cache Retention Auxiliary Node In Wireless Communication System, And Apparatus Therefor App 20180054747 - SEO; Hanbyul ; et al.	2018-02-22
Method of fabricating multi-substrate semiconductor devices Grant 9,865,581 - Jang , et al. January 9, 2	2018-01-09
Wafer-to-wafer Bonding Structure App 20170358553 - KIM; TAE-YEONG ; et al.	2017-12-14
Wafer processing methods Grant 9,773,660 - Kim , et al. September 26, 2	2017-09-26
Multi-stacked Device Having Tsv Structure App 20170207158 - KANG; Pil-kyu ; et al.	2017-07-20
Semiconductor devices Grant 9,520,361 - Kang , et al. December 13, 2	2016-12-13
Method Of Fabricating Multi-substrate Semiconductor Devices App 20160141282 - Jang; Joo-Hee ; et al.	2016-05-19
Semiconductor Devices App 20160141249 - Kang; Pil-Kyu ; et al.	2016-05-19
Method of manufacturing a semiconductor device Grant 9,287,251 - Kang , et al. March 15, 2	2016-03-15
Method of Manufacturing a Semiconductor Device App 20160020197 - Kang; Pil-Kyu ; et al.	2016-01-21
Semiconductor device including through via structures and redistribution structures Grant 9,236,349 - Lee , et al. January 12, 2	2016-01-12
Methods for Forming Semiconductor Devices Using Sacrificial Layers App 20140199810 - Park; Jin-Ho ; et al.	2014-07-17
Wafer Processing Methods App 20140106649 - KIM; Tae-yeong ; et al.	2014-04-17
Semiconductor Device Including Through Via Structures And Redistribution Structures App 20140048952 - Lee; Kyu-Ha ; et al.	2014-02-20

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