KIM; Sung Hyup

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIM; Sung Hyup.The latest application filed is for "semiconductor device and a manufacturing method thereof".

Company Profile

14.9.15

KIM; Sung Hyup - Hwaseong-si KR
Kim; Sung-hyup - Suwon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device And A Manufacturing Method Thereof App 20210384107 - LIM; Kyeong Bin ; et al.	2021-12-09
Semiconductor device and a manufacturing method thereof Grant 11,127,654 - Lim , et al. September 21, 2	2021-09-21
Wafer bonding apparatus and wafer bonding system using the same Grant 10,971,379 - Kim , et al. April 6, 2	2021-04-06
Megasonic cleaner Grant 10,937,670 - Park , et al. March 2, 2	2021-03-02
Wafer to wafer bonding method and wafer to wafer bonding system Grant 10,811,381 - Lee , et al. October 20, 2	2020-10-20
Spin coater and substrate treating apparatus having the same Grant 10,811,287 - Jeon , et al. October 20, 2	2020-10-20
Substrate bonding apparatus Grant 10,763,243 - Kim , et al. Sep	2020-09-01
Jig For Cleaning A Bowl Of A Spin Coater And Apparatus For Cleaning A Bowl Of A Spin Coater Including The Same App 20200070223 - JEON; Hyun-Joo ; et al.	2020-03-05
Chemical Mechanical Polishing Apparatus And Method Of Manufacturing Semiconductor Device App 20200070300 - HONG; Eun Kyung ; et al.	2020-03-05
Apparatus For Bonding Substrates And Method Of Bonding Substrates App 20200075360 - KIM; Jun-hyung ; et al.	2020-03-05
Wafer To Wafer Bonding Method And Wafer To Wafer Bonding System App 20200043884 - LEE; JOON-HO ; et al.	2020-02-06
Semiconductor Device And A Manufacturing Method Thereof App 20200020610 - LIM; KYEONG BIN ; et al.	2020-01-16
Vacuum Chuck For Bonding Substrates, Apparatus For Bonding Substrates Including The Same, And Method Of Bonding Substrates Using App 20200020562 - SOHN; Ki-Ju ; et al.	2020-01-16
Wafer Bonding Apparatus And Wafer Bonding System Using The Same App 20200013643 - KIM; Jun-hyung ; et al.	2020-01-09
Substrate Bonding Apparatus App 20190189593 - KIM; Jun-Hyung ; et al.	2019-06-20
Spin Coater And Substrate Treating Apparatus And System Having The Same App 20190157116 - JEON; HYUN-JOO ; et al.	2019-05-23
Apparatus for clamping a probe card and probe card including the same Grant 10,295,564 - Park , et al.	2019-05-21
Megasonic Cleaner App 20190013218 - Park; Sung-Yong ; et al.	2019-01-10
Apparatus For Clamping A Probe Card And Probe Card Including The Same App 20180017595 - PARK; Sung-Yong ; et al.	2018-01-18
Semiconductor process management system, semiconductor manufacturing system including the same, and method of manufacturing semiconductor Grant 9,791,855 - Han , et al. October 17, 2	2017-10-17
Semiconductor Process Management System, Semiconductor Manufacturing System Including The Same, And Method Of Manufacturing Semiconductor App 20150346709 - Han; Dong-hoon ; et al.	2015-12-03
Image forming apparatus with opening/closing member Grant 7,792,453 - Baek , et al. September 7, 2	2010-09-07
Image forming apparatus with opening/closing member App 20090052924 - Baek; Sung Ku ; et al.	2009-02-26
Method of cooling electronic device and electronic device with improved cooling efficiency App 20070115644 - Kim; Sung-Hyup ; et al.	2007-05-24

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