loadpatents
name:-0.0096960067749023
name:-0.0092170238494873
name:-0.0057070255279541
KIM; Seokbong Patent Filings

KIM; Seokbong

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIM; Seokbong.The latest application filed is for "electronic package and method for manufacturing the same".

Company Profile
3.7.9
  • KIM; Seokbong - Gyeonggi-Do KR
  • Kim; Seokbong - Paju-Si KR
  • Kim; Seokbong - Kyunggi-Do KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electronic Package And Method For Manufacturing The Same
App 20220020698 - KIM; Seokbong ;   et al.
2022-01-20
Semiconductor Device Package And Method Of Manufacturing The Same
App 20220013452 - KIM; Seokbong ;   et al.
2022-01-13
Semiconductor package device and method of manufacturing the same
Grant 10,854,556 - Yu , et al. December 1, 2
2020-12-01
Semiconductor package device and method of manufacturing the same
Grant 10,622,318 - Kim , et al.
2020-04-14
Semiconductor package device and method of manufacturing the same
Grant 10,388,586 - Kim , et al. A
2019-08-20
Semiconductor Package Device And Method Of Manufacturing The Same
App 20190057943 - KIM; Seokbong ;   et al.
2019-02-21
Semiconductor Package Device And Method Of Manufacturing The Same
App 20180315719 - KIM; Seokbong ;   et al.
2018-11-01
Semiconductor Package Device And Method Of Manufacturing The Same
App 20180102325 - YU; Kyungsic ;   et al.
2018-04-12
Semiconductor device packages with electromagnetic interference shielding
Grant 8,368,185 - Lee , et al. February 5, 2
2013-02-05
Semiconductor package structure and package process
Grant 8,178,961 - Han , et al. May 15, 2
2012-05-15
Semiconductor Package Structure And Package Process
App 20110260266 - Han; Ingyu ;   et al.
2011-10-27
Semiconductor device packages with electromagnetic interference shielding
Grant 8,030,750 - Kim , et al. October 4, 2
2011-10-04
Leadframe Structure, Advanced Quad Flat No Lead Package Structure Using the Same, and Manufacturing Methods Thereof
App 20110163430 - Lee; Yuyong ;   et al.
2011-07-07
Semiconductor Device Packages with Electromagnetic Interference Shielding
App 20110115059 - Lee; Yuyong ;   et al.
2011-05-19
Semiconductor Device Packages With Electromagnetic Interference Shielding
App 20110115066 - Kim; Seokbong ;   et al.
2011-05-19

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