Kim; Sang Duck

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Sang Duck.The latest application filed is for "pharmaceutical composition for treating scars on the skin, and method for treating scars on the skin using same".

Company Profile

0.16.20

Kim; Sang Duck - Seoul N/A KR
Kim; Sang-Duck - Chingjoo-si N/A KR
Kim; Sang Duck - Cheongju KR
Kim; Sang-Duck - Chungjoo-si N/A KR
Kim; Sang Duck - Chungcheongbuk-do KR
Kim; Sang Duck - Suwon KR
Kim; Sang-Duck - Suwon-si N/A KR
Kim; Sang-Duck - Heungduk-gu KR
Kim; Sang-Duck - Gangnam-gu Seoul KR
Kim; Sang-Duck - Daegu KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Botulinum toxin in aerosol form and method of facial contouring using the same Grant 9,884,001 - Kim February 6, 2	2018-02-06
Pharmaceutical Composition for Treating Scars on the Skin, and Method for Treating Scars on the Skin Using Same App 20160106653 - Kim; Sang Duck	2016-04-21
Composition For Facial Contouring Comprising Mixture Of Botulinum Toxin And Air And Method Of Facial Contouring Using The Same App 20160038395 - KIM; Sang Duck	2016-02-11
Method for treating atrophic skin scars using a mixture of botulinum toxin and air Grant 9,050,337 - Kim June 9, 2	2015-06-09
Method of manufacturing printed circuit board having bump Grant 8,986,555 - Kim , et al. March 24, 2	2015-03-24
Method of manufacturing a ball grid array substrate or a semiconductor chip package Grant 8,945,993 - Park , et al. February 3, 2	2015-02-03
Single-layered printed circuit board and manufacturing method thereof Grant 8,889,994 - Kim , et al. November 18, 2	2014-11-18
Pharmaceutical Composition For Treating Scars On The Skin, And Method For Treating Scars On The Skin Using Same App 20140127186 - Kim; Sang Duck	2014-05-08
Method Of Manufacturing A Ball Grid Array Substrate Or A Semiconductor Chip Package App 20140017855 - PARK; Jung Hyun ; et al.	2014-01-16
Ball grid array substrate with insulating layer and semiconductor chip package Grant 8,546,943 - Park , et al. October 1, 2	2013-10-01
Semiconductor Package And Method Of Manufacturing Semiconductor Package App 20130161808 - Kim; Min Sung ; et al.	2013-06-27
Method for manufacturing circuit board Grant 8,418,355 - Kim , et al. April 16, 2	2013-04-16
Board On Chip Package Substrate And Manufacturing Method Thereof App 20120244662 - KIM; Ji-Eun ; et al.	2012-09-27
Substrate For A Semiconductor Package And Manufacturing Method Thereof App 20110266671 - Youm; Kwang Seop ; et al.	2011-11-03
Single-layered Printed Circuit Board And Manufacturing Method Thereof App 20110186342 - KIM; Young-Ji ; et al.	2011-08-04
Board On Chip Package Substrate And Manufacturing Method Thereof App 20110110058 - KIM; Ji-Eun ; et al.	2011-05-12
Method Of Manufacturing Printed Circuit Board Having Bump App 20110100952 - KIM; Ji-Eun ; et al.	2011-05-05
Ball grid array substrate, semiconductor chip package and method of manufacturing the same App 20110095425 - Park; Jung Hyun ; et al.	2011-04-28
Realtime service system using the interactive data communication and method thereof Grant 7,559,079 - Kim July 7, 2	2009-07-07
Carrier and method for manufacturing printed circuit board App 20090011220 - Park; Jung-Hyun ; et al.	2009-01-08
Substrate for mounting flip chip and the manufacturing method thereof App 20080105458 - Kang; Myung-Sam ; et al.	2008-05-08
Method for forming transcriptional circuit and method for manufacturing circuit board App 20080098596 - Kim; Sang-Duck ; et al.	2008-05-01
Method of manufacturing printed circuit board App 20080102410 - Kim; Ji-Eun ; et al.	2008-05-01
Printed circuit board having weak magnetic field sensor and method of manufacturing the same Grant 7,348,772 - Kang , et al. March 25, 2	2008-03-25
Printed circuit board having weak magnetic field sensor and method of manufacturing the same App 20060017435 - Kang; Myung-Sam ; et al.	2006-01-26
Realtime service system using the interactive data communication and method thereof App 20050240976 - Kim, Sang-Duck	2005-10-27

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