loadpatents
name:-0.006986141204834
name:-0.0062580108642578
name:-0.001716136932373
Kim; OhSug Patent Filings

Kim; OhSug

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; OhSug.The latest application filed is for "stacked integrated circuit package-in-package system and method of manufacture thereof".

Company Profile
2.6.5
  • Kim; OhSug - AnYang-Si N/A KR
  • - AnYang-Si KR
  • Kim; OhSug - Kyungkido KR
  • Kim; OhSug - Singapore SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Stacked integrated circuit package-in-package system and method of manufacture thereof
Grant 8,617,924 - Kim , et al. December 31, 2
2013-12-31
Stacked integrated circuit package-in-package system and method of manufacture thereof
Grant 08617924 -
2013-12-31
Integrated circuit package with top pad
Grant 8,089,166 - Kim January 3, 2
2012-01-03
Semiconductor package system with cavity substrate
Grant 7,968,371 - Kim , et al. June 28, 2
2011-06-28
Integrated circuit package system with down-set die pad and method of manufacture thereof
Grant 7,833,840 - Ahn , et al. November 16, 2
2010-11-16
Stacked Integrated Circuit Package-in-package System And Method Of Manufacture Thereof
App 20100044849 - Kim; OhSug ;   et al.
2010-02-25
Stacked integrated circuit package-in-package system
Grant 7,635,913 - Kim , et al. December 22, 2
2009-12-22
Integrated Circuit Package With Top Pad
App 20080157401 - Kim; OhSug
2008-07-03
Stacked Integrated Circuit Package-in-package System
App 20080136007 - Kim; OhSug ;   et al.
2008-06-12
Integrated Circuit Package System With Down-set Die Pad
App 20080032456 - Ahn; Byung Hoon ;   et al.
2008-02-07
Semiconductor Package System With Cavity Substrate
App 20060170092 - Kim; OhSug ;   et al.
2006-08-03

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