| Patent | Date |
|---|
Cooling device and process for cooling double-sided SiP devices during sputtering
Grant 11,434,561 - Kim , et al. September 6, 2 | 2022-09-06 |
Semiconductor device and method of forming an integrated SiP module with embedded inductor or package
Grant 11,367,690 - Yang , et al. June 21, 2 | 2022-06-21 |
Semiconductor device and method of forming protrusion e-bar for 3D SiP
Grant 11,342,294 - Yang , et al. May 24, 2 | 2022-05-24 |
Semiconductor device and method of forming SIP module over film layer
Grant 11,309,193 - Kim , et al. April 19, 2 | 2022-04-19 |
Cooling Device and Process for Cooling Double-Sided SiP Devices During Sputtering
App 20210301390 - Kim; OhHan ; et al. | 2021-09-30 |
Semiconductor Device and Method of Forming SIP Module Over Film Layer
App 20200402817 - Kim; OhHan ; et al. | 2020-12-24 |
Semiconductor Device and Method of Forming a 3D Interposer System-in-Package Module
App 20200373289 - Yang; DeokKyung ; et al. | 2020-11-26 |
Method of forming SIP module over film layer
Grant 10,804,119 - Kim , et al. October 13, 2 | 2020-10-13 |
Semiconductor device and method of forming a 3D interposer system-in-package module
Grant 10,797,039 - Yang , et al. October 6, 2 | 2020-10-06 |
Semiconductor Device and Method of Forming an Integrated SIP Module with Embedded Inductor or Package
App 20200286835 - Yang; DeokKyung ; et al. | 2020-09-10 |
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
App 20200219835 - Yang; DeokKyung ; et al. | 2020-07-09 |
Semiconductor device and method of forming an integrated SIP module with embedded inductor or package
Grant 10,700,011 - Yang , et al. | 2020-06-30 |
Semiconductor device and method of forming protrusion E-bar for 3D SIP
Grant 10,636,756 - Yang , et al. | 2020-04-28 |
Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant
Grant 10,629,565 - Jung , et al. | 2020-04-21 |
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
App 20200013738 - Yang; DeokKyung ; et al. | 2020-01-09 |
Semiconductor Device and Method of Forming SIP with Electrical Component Terminals Extending Out from Encapsulant
App 20190355695 - Jung; JinHee ; et al. | 2019-11-21 |
Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant
Grant 10,418,341 - Jung , et al. Sept | 2019-09-17 |
Semiconductor device and method of forming a 3D interposer system-in-package module
Grant 10,388,637 - Kim , et al. A | 2019-08-20 |
Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structure
Grant 10,163,744 - Kim , et al. Dec | 2018-12-25 |
Semiconductor Device and Method of Forming SIP Module Over Film Layer
App 20180269195 - Kim; OhHan ; et al. | 2018-09-20 |
Semiconductor Device and Method of Forming a 3D Interposer System-in-Package Module
App 20180261569 - Yang; DeokKyung ; et al. | 2018-09-13 |
Semiconductor Device and Method of Forming a 3D Interposer System-In-Package Module
App 20180158768 - Kim; OhHan ; et al. | 2018-06-07 |
Semiconductor Device and Method of Forming an Integrated SIP Module with Embedded Inductor or Package
App 20180158779 - Yang; DeokKyung ; et al. | 2018-06-07 |
Semiconductor Device and Method of Forming SIP with Electrical Component Terminals Extending Out from Encapsulant
App 20180061806 - Jung; JinHee ; et al. | 2018-03-01 |
Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield
Grant 9,543,258 - Kim , et al. January 10, 2 | 2017-01-10 |
Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV
Grant 9,478,486 - Kim , et al. October 25, 2 | 2016-10-25 |
Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties
Grant 9,373,578 - Choi , et al. June 21, 2 | 2016-06-21 |
Semiconductor Device and Method of Forming Holes in Substrate to Interconnect Top Shield and Ground Shield
App 20160148882 - Kim; OhHan ; et al. | 2016-05-26 |
Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage
Grant 9,279,673 - Ko , et al. March 8, 2 | 2016-03-08 |
Semiconductor device and method of forming shielding layer grounded through metal pillars formed in peripheral region of the semiconductor
Grant 9,123,663 - Kim , et al. September 1, 2 | 2015-09-01 |
Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV
Grant 8,900,921 - Kim , et al. December 2, 2 | 2014-12-02 |
Semiconductor device with bump formed on substrate to prevent ELK ILD delamination during reflow process
Grant 8,884,339 - Jang , et al. November 11, 2 | 2014-11-11 |
Semiconductor Device and Method of Calibrating Warpage Testing System to Accurately Measure Semiconductor Package Warpage
App 20140269810 - Ko; WonJun ; et al. | 2014-09-18 |
Semiconductor Device and Method of Forming Topside and Bottom-side Interconnect Structures Around Core Die with TSV
App 20140239509 - Kim; Sun Mi ; et al. | 2014-08-28 |
Semiconductor device and method of forming a thermally reinforced semiconductor die
Grant 8,786,076 - Kim , et al. July 22, 2 | 2014-07-22 |
Semiconductor Device and Method of Forming Interconnect Structure with Conductive Pads Having Expanded Interconnect Surface Area for Enhanced Interconnection Properties
App 20140175642 - Choi; DaeSik ; et al. | 2014-06-26 |
Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties
Grant 8,709,935 - Choi , et al. April 29, 2 | 2014-04-29 |
Semiconductor Device and Method of Forming Bump on Substrate to Prevent ELK ILD Delamination During Reflow Process
App 20130264705 - Jang; KiYoun ; et al. | 2013-10-10 |
Semiconductor device including bump formed on substrate to prevent extremely-low dielectric constant (ELK) interlayer dielectric layer (ILD) delamination during reflow process
Grant 8,519,536 - Jang , et al. August 27, 2 | 2013-08-27 |
Semiconductor device and method of forming WLCSP structure using protruded MLP
Grant 8,519,544 - Kim , et al. August 27, 2 | 2013-08-27 |
Semiconductor Device and Method of Forming Interconnect Structure with Conductive Pads Having Expanded Interconnect Surface Area for Enhanced Interconnection Properties
App 20130154090 - Choi; DaeSik ; et al. | 2013-06-20 |
Semiconductor Device and Method of Forming Bump on Substrate to Prevent ELK ILD Delamination During Reflow Process
App 20130087913 - Jang; KiYoun ; et al. | 2013-04-11 |
Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties
Grant 8,409,979 - Choi , et al. April 2, 2 | 2013-04-02 |
Semiconductor Device and Method of Forming a Low Profile Dual-Purpose Shield and Heat-Dissipation Structure
App 20130056862 - Kim; OhHan ; et al. | 2013-03-07 |
Semiconductor Device and Method of Forming TIM Within Recesses of MUF Material
App 20130049188 - Choi; DaeSik ; et al. | 2013-02-28 |
Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process
Grant 8,367,467 - Jang , et al. February 5, 2 | 2013-02-05 |
Semiconductor Device and Method of Forming WLCSP Structure using Protruded MLP
App 20120306097 - Kim; OhHan ; et al. | 2012-12-06 |
Semiconductor Device and Method of Forming Interconnect Structure With Conductive Pads Having Expanded Interconnect Surface Area for Enhanced Interconnection Properties
App 20120306104 - Choi; DaeSik ; et al. | 2012-12-06 |
Semiconductor Device and Method of Forming Holes in Substrate to Interconnect Top Shield and Ground Shield
App 20120292751 - Kim; OhHan ; et al. | 2012-11-22 |
Semiconductor Device and Method of Forming a Thermally Reinforced Semiconductor Die
App 20120241941 - Kim; OhHan ; et al. | 2012-09-27 |
Semiconductor device and method of forming WLCSP structure using protruded MLP
Grant 8,273,604 - Kim , et al. September 25, 2 | 2012-09-25 |
Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield
Grant 8,264,059 - Kim , et al. September 11, 2 | 2012-09-11 |
Semiconductor Device and Method of Forming WLCSP Structure Using Protruded MLP
App 20120211892 - Kim; OhHan ; et al. | 2012-08-23 |
Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect Structures
App 20120153452 - Kim; OhHan ; et al. | 2012-06-21 |
Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structures
Grant 8,137,995 - Kim , et al. March 20, 2 | 2012-03-20 |
Semiconductor Device and Method of Forming Bump on Substrate to Prevent ELK ILD Delamination During Reflow Process
App 20110260316 - Jang; KiYoun ; et al. | 2011-10-27 |
Semiconductor Device and Method of Forming Holes In Substrate to Interconnect Top Shield and Ground Shield
App 20110121432 - Kim; OhHan ; et al. | 2011-05-26 |
Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield
Grant 7,906,371 - Kim , et al. March 15, 2 | 2011-03-15 |
Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect Structures
App 20100148353 - Kim; OhHan ; et al. | 2010-06-17 |
Semiconductor Device and Method of Forming Topside and Bottom-side Interconnect Structures Around Core Die with TSV
App 20100148316 - Kim; Sun Mi ; et al. | 2010-06-17 |
Semiconductor Device and Method of Forming Shielding Layer Grounded Through Metal Pillars Formed in Peripheral Region of the Semiconductor
App 20090302436 - Kim; OhHan ; et al. | 2009-12-10 |
Semiconductor Device and Method of Forming Holes In Substrate to Interconnect Top Shield and Ground Shield
App 20090294928 - Kim; OhHan ; et al. | 2009-12-03 |
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