loadpatents
name:-0.010766983032227
name:-0.0087950229644775
name:-0.0004420280456543
Kim; Oh Sug Patent Filings

Kim; Oh Sug

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Oh Sug.The latest application filed is for "light emitting diode package".

Company Profile
0.10.9
  • Kim; Oh Sug - Ansan-si KR
  • Kim; Oh Sug - Ansan N/A KR
  • KIM; Oh Sug - Ansan-city KR
  • Kim; Oh Sug - An Yang-Si KR
  • Kim; Oh Sug - AnYang-Si KR
  • Kim; Oh Sug - Ichon-Si KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Light emitting diode package
Grant 9,786,827 - Jung , et al. October 10, 2
2017-10-10
Light Emitting Diode Package
App 20170018696 - JUNG; Jung Hwa ;   et al.
2017-01-19
Light emitting diode package
Grant 9,472,743 - Jung , et al. October 18, 2
2016-10-18
Light Emitting Diode Package
App 20160118563 - JUNG; Jung Hwa ;   et al.
2016-04-28
Light emitting diode package
Grant 9,257,624 - Jung , et al. February 9, 2
2016-02-09
Light Emitting Diode Package
App 20150214453 - JUNG; Jung Hwa ;   et al.
2015-07-30
Backlight Module, Method For Driving Same And Display Device Using Same
App 20150154917 - Jung; Hye Man ;   et al.
2015-06-04
Light emitting diode package
Grant 9,048,391 - Jung , et al. June 2, 2
2015-06-02
Light emitting diode package
Grant 8,994,061 - Kang , et al. March 31, 2
2015-03-31
Light Emitting Diode Package
App 20140312380 - Jung; Jung Hwa ;   et al.
2014-10-23
Light emitting diode package
Grant 8,796,706 - Jung , et al. August 5, 2
2014-08-05
Light Emitting Diode Package
App 20120223343 - KANG; Do Hyoung ;   et al.
2012-09-06
Light Emitting Diode Package
App 20120056217 - Jung; Jung Hwa ;   et al.
2012-03-08
Method of manufacture for semiconductor package with flow controller
Grant 8,129,231 - Chow , et al. March 6, 2
2012-03-06
Method Of Manufacture For Semiconductor Package With Flow Controller
App 20100009468 - Chow; Seng Guan ;   et al.
2010-01-14
Semiconductor package with flow controller
Grant 7,612,444 - Chow , et al. November 3, 2
2009-11-03
Semiconductor Package System With Die Carrier Having Mold Flow Restricting Elements
App 20080164618 - Chow; Seng Guan ;   et al.
2008-07-10

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