Kim; Oh Han

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Oh Han.The latest application filed is for "integrated circuit packaging system with heat spreader and method of manufacture thereof".

Company Profile

1.21.14

Kim; Oh Han - Icheon-si N/A KR
Kim; Oh Han - Ichon-si KR
Kim; Oh Han - Icheon N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit packaging system with heat spreader and method of manufacture thereof Grant 9,093,415 - Kim , et al. July 28, 2	2015-07-28
Integrated Circuit Packaging System With Heat Spreader And Method Of Manufacture Thereof App 20150084178 - Kim; Oh Han ; et al.	2015-03-26
Integrated circuit packaging system with substrate mold gate and method of manufacture thereof Grant 8,859,342 - Kim , et al. October 14, 2	2014-10-14
Integrated circuit packaging system with underfill and method of manufacture thereof Grant 8,748,233 - Choi , et al. June 10, 2	2014-06-10
Electronic system with vertical intermetallic compound Grant 8,709,934 - Kim , et al. April 29, 2	2014-04-29
Mock bump system for flip chip integrated circuits Grant 8,633,586 - Kim , et al. January 21, 2	2014-01-21
Flip chip interconnection system having solder position control mechanism Grant 8,604,624 - Kim , et al. December 10, 2	2013-12-10
Integrated circuit packaging system with trenches and method of manufacture thereof Grant 8,536,718 - Ko , et al. September 17, 2	2013-09-17
Integrated circuit packaging system with routable underlayer and method of manufacture thereof Grant 8,513,057 - Kim , et al. August 20, 2	2013-08-20
Integrated Circuit Packaging System With Substrate Mold Gate And Method Of Manufacture Thereof App 20130154079 - Kim; Oh Han ; et al.	2013-06-20
Integrated circuit packaging system with stack interconnect and method of manufacture thereof Grant 8,466,567 - Choi , et al. June 18, 2	2013-06-18
Integrated circuit packaging system with underfill and method of manufacture thereof Grant 8,409,923 - Kim , et al. April 2, 2	2013-04-02
Integrated Circuit Packaging System With Routable Underlayer And Method Of Manufacture Thereof App 20130069224 - Kim; Oh Han ; et al.	2013-03-21
Integrated Circuit Packaging System With Underfill And Method Of Manufacture Thereof App 20120326291 - Choi; DaeSik ; et al.	2012-12-27
Integrated Circuit Packaging System With Underfill And Method Of Manufacture Thereof App 20120319300 - Kim; Oh Han ; et al.	2012-12-20
Integrated Circuit Packaging System With Stack Interconnect And Method Of Manufacture Thereof App 20120068319 - Choi; DaeSik ; et al.	2012-03-22
Integrated Circuit Packaging System With Trenches And Method Of Manufacture Thereof App 20110316162 - Ko; WonJun ; et al.	2011-12-29
Stacked integrated circuit package system Grant 7,956,449 - Lee , et al. June 7, 2	2011-06-07
Stacked Integrated Circuit Package System App 20090321907 - Lee; KyungHoon ; et al.	2009-12-31
Mock Bump System For Flip Chip Integrated Circuits App 20090243091 - Kim; Oh Han ; et al.	2009-10-01
Flip Chip Interconnection System App 20090236756 - Kim; Oh Han ; et al.	2009-09-24
Electronic System With Vertical Intermetallic Compound App 20080303142 - Kim; BaeYong ; et al.	2008-12-11

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