| Patent | Date |
|---|
Integrated circuit with adaptability to a process-voltage-temperature (PVT) variation
Grant 11,086,345 - Lee , et al. August 10, 2 | 2021-08-10 |
Integrated Circuit With Adaptability To A Process-voltage-temperature (pvt) Variation
App 20210011506 - LEE; Seok-won ; et al. | 2021-01-14 |
Integrated circuit with adaptability to a process-voltage-temperature (PVT) variation
Grant 10,747,250 - Lee , et al. A | 2020-08-18 |
Wide-range local oscillator (LO) generators and apparatuses including the same
Grant 10,715,159 - Kim , et al. | 2020-07-14 |
Frequency divider and a transceiver including the same
Grant 10,547,315 - Choi , et al. Ja | 2020-01-28 |
Integrated Circuit With Adaptability To A Process-voltage-temperature (pvt) Variation
App 20200012301 - LEE; Seek-won ; et al. | 2020-01-09 |
Wide-range Local Oscillator (lo) Generators And Apparatuses Including The Same
App 20190253060 - Kim; Nam-seog ; et al. | 2019-08-15 |
Wide-range local oscillator (LO) generators and apparatuses including the same
Grant 10,326,460 - Kim , et al. | 2019-06-18 |
Frequency Divider And A Transceiver Including The Same
App 20190165790 - Choi; Jae-won ; et al. | 2019-05-30 |
Digital-to-time converter and operating method thereof
Grant 10,122,378 - Kim November 6, 2 | 2018-11-06 |
Digital-to-time Converter And Operating Method Thereof
App 20180269895 - KIM; Nam-seog | 2018-09-20 |
Wide-range Local Oscillator (lo) Generators And Apparatuses Including The Same
App 20180205386 - KIM; Nam-seog ; et al. | 2018-07-19 |
3D semiconductor device
Grant 9,245,827 - Kang , et al. January 26, 2 | 2016-01-26 |
Semiconductor module
Grant 8,928,154 - Kang , et al. January 6, 2 | 2015-01-06 |
3d Semiconductor Device
App 20140233292 - Kang; Uk-song ; et al. | 2014-08-21 |
Wafer level package and methods of fabricating the same
Grant 8,779,576 - Park , et al. July 15, 2 | 2014-07-15 |
3D semiconductor device
Grant 8,743,582 - Kang , et al. June 3, 2 | 2014-06-03 |
Semiconductor devices having redistribution structures and packages, and methods of forming the same
Grant 8,431,479 - Kim , et al. April 30, 2 | 2013-04-30 |
Chip stack package and method of fabricating the same
Grant 8,373,261 - Kim , et al. February 12, 2 | 2013-02-12 |
Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the same
Grant 8,362,621 - Lee , et al. January 29, 2 | 2013-01-29 |
Semiconductor Module
App 20120104631 - Kang; Sun-Won ; et al. | 2012-05-03 |
Semiconductor module
Grant 8,115,324 - Kang , et al. February 14, 2 | 2012-02-14 |
Method of manufacturing the semiconductor device
Grant 8,114,772 - Lee , et al. February 14, 2 | 2012-02-14 |
Method of manufacturing a chip stack package
Grant 8,088,648 - Jo , et al. January 3, 2 | 2012-01-03 |
3d Semiconductor Device
App 20110292708 - Kang; Uk-song ; et al. | 2011-12-01 |
Wafer Level Package And Methods Of Fabricating The Same
App 20110272819 - Park; Sang-wook ; et al. | 2011-11-10 |
Chip stack package and method of fabricating the same
Grant 7,948,089 - Chung , et al. May 24, 2 | 2011-05-24 |
Flip Chip Package
App 20110115078 - JEONG; Se-Young ; et al. | 2011-05-19 |
Semiconductor Devices Having Redistribution Structures And Packages, And Methods Of Forming The Same
App 20110104888 - KIM; Ki-Hyuk ; et al. | 2011-05-05 |
Method of Manufacturing the Semiconductor Device
App 20110097891 - Lee; Kyu-Ha ; et al. | 2011-04-28 |
Method of fabricating electronic device having stacked chips
Grant 7,923,291 - Yu , et al. April 12, 2 | 2011-04-12 |
Chip Stack Package And Method Of Manufacturing The Chip Stack Package
App 20100285635 - Jo; Cha-Jea ; et al. | 2010-11-11 |
Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package
Grant 7,830,017 - Lee , et al. November 9, 2 | 2010-11-09 |
Delay-locked loop circuits and method for generating transmission core clock signals
Grant 7,825,710 - Kim , et al. November 2, 2 | 2010-11-02 |
Semiconductor packages and methods of fabricating the same
Grant 7,807,512 - Lee , et al. October 5, 2 | 2010-10-05 |
Chip stack package and method of fabricating the same
App 20100244233 - Kim; Pyoung-wan ; et al. | 2010-09-30 |
Semiconductor device having through electrode and method of fabricating the same
Grant 7,777,345 - Lee , et al. August 17, 2 | 2010-08-17 |
Microelectronic Devices Including Multiple Through-silicon Via Structures On A Conductive Pad And Methods Of Fabricating The Same
App 20100090338 - Lee; Ho Jin ; et al. | 2010-04-15 |
Data line layout and line driving method in semiconductor memory device
Grant 7,697,314 - Kim , et al. April 13, 2 | 2010-04-13 |
Semiconductor memory device with hierarchical bit line structure
Grant 7,656,723 - Kim , et al. February 2, 2 | 2010-02-02 |
Method of fabricating electronic device having stacked chips
App 20100022051 - Yu; Hae-Jung ; et al. | 2010-01-28 |
Stacked chip package and method for forming the same
Grant 7,638,365 - Jeong , et al. December 29, 2 | 2009-12-29 |
Method Of Fabricating Semiconductor Chip Package, Semiconductor Wafer, And Method Of Sawing The Semiconductor Wafer
App 20090298234 - Lee; Teak-hoon ; et al. | 2009-12-03 |
Probe Card Having Redistributed Wiring Probe Needle Structure And Probe Card Module Using The Same
App 20090278561 - Jo; Cha-jea ; et al. | 2009-11-12 |
Semiconductor memory device with hierarchical bit line structure
Grant 7,616,512 - Kim , et al. November 10, 2 | 2009-11-10 |
Semiconductor packages with enhanced joint reliability and methods of fabricating the same
Grant 7,598,607 - Chung , et al. October 6, 2 | 2009-10-06 |
Semiconductor packages and methods of fabricating the same
App 20090239336 - Lee; Teak-Hoon ; et al. | 2009-09-24 |
Semiconductor device packages and methods of fabricating the same
App 20090186446 - Kwon; Yong-Chai ; et al. | 2009-07-23 |
Method of forming solder bump with reduced surface defects
Grant 7,553,751 - Jeong , et al. June 30, 2 | 2009-06-30 |
Phase interpolation circuit and method of generating phase interpolation signal
Grant 7,551,013 - Kim , et al. June 23, 2 | 2009-06-23 |
Semiconductor Memory Device With Hierarchical Bit Line Structure
App 20090154265 - KIM; Nam-Seog ; et al. | 2009-06-18 |
Semiconductor Memory Device With Hierarchical Bit Line Structure
App 20090154213 - KIM; Nam-Seog ; et al. | 2009-06-18 |
Semiconductor Device And Method Of Fabricating The Same
App 20090149016 - PARK; Jin-Woo ; et al. | 2009-06-11 |
Semiconductor Package, Electronic Device Including The Semiconductor Package, And Method Of Manufacturing The Semiconductor Package
App 20090134528 - LEE; Teak-Hoon ; et al. | 2009-05-28 |
Semiconductor module
App 20090127717 - Kang; Sun-Won ; et al. | 2009-05-21 |
Semiconductor memory device with hierarchical bit line structure
Grant 7,489,570 - Kim , et al. February 10, 2 | 2009-02-10 |
Semiconductor Device Having Through Electrode And Method Of Fabricating The Same
App 20090008790 - LEE; Ho-Jin ; et al. | 2009-01-08 |
Semiconductor Packages With Enhanced Joint Reliability And Methods Of Fabricating The Same
App 20080290492 - CHUNG; Hyun-Soo ; et al. | 2008-11-27 |
Chip Stack Package And Method Of Fabricating The Same
App 20080251939 - Chung; Hyun-Soo ; et al. | 2008-10-16 |
Chip Stack Package And Method Of Manufacturing The Chip Stack Package
App 20080230923 - JO; Cha-Jea ; et al. | 2008-09-25 |
Semiconductor Package Having Wire Redistribution Layer And Method Of Fabricating The Same
App 20080230877 - Chung; Hyun-soo ; et al. | 2008-09-25 |
Stack Package And Method Of Manufacturing The Same
App 20080173999 - CHUNG; Hyun-Soo ; et al. | 2008-07-24 |
Amplifier circuit having constant output swing range and stable delay time
Grant 7,400,177 - Kim , et al. July 15, 2 | 2008-07-15 |
Data line layout and line driving method in semiconductor memory device
App 20080165559 - Kim; Nam-Seog ; et al. | 2008-07-10 |
Wafer Level Chip Scale Package, Method Of Manufacturing The Same, And Semiconductor Chip Module Including The Wafer Level Chip Scale Package
App 20080128905 - LEE; In-Young ; et al. | 2008-06-05 |
Stacked Chip Package And Method For Forming The Same
App 20080096315 - JEONG; Se-Young ; et al. | 2008-04-24 |
Programmable impedance controller and method for operating
Grant 7,288,966 - Choi , et al. October 30, 2 | 2007-10-30 |
Reinforced solder bump structure and method for forming a reinforced solder bump
Grant 7,271,084 - Jeong , et al. September 18, 2 | 2007-09-18 |
Method Of Fabricating Ultra Thin Flip-chip Package
App 20070200251 - KIM; Soon-Bum ; et al. | 2007-08-30 |
Amplifier Circuit Having Constant Output Swing Range And Stable Delay Time
App 20070139084 - KIM; Nam-Seog ; et al. | 2007-06-21 |
Semiconductor memory device with hierarchical bit line structure
App 20070115710 - Kim; Nam-Seog ; et al. | 2007-05-24 |
Method of fabricating ultra thin flip-chip package
Grant 7,214,604 - Kim , et al. May 8, 2 | 2007-05-08 |
Amplifier circuit having constant output swing range and stable delay time
Grant 7,187,214 - Kim , et al. March 6, 2 | 2007-03-06 |
Impedance controller and impedance control method
Grant 7,170,318 - Kim , et al. January 30, 2 | 2007-01-30 |
Method of forming solder bump with reduced surface defects
App 20070020913 - Jeong; Se-Young ; et al. | 2007-01-25 |
Apparatus for generating internal clock signal
Grant 7,154,312 - Kim , et al. December 26, 2 | 2006-12-26 |
Phase interpolation circuit and method of generating phase interpolation signal
App 20060256205 - Kim; Nam-Seog ; et al. | 2006-11-16 |
Method of forming solder bump with reduced surface defects
Grant 7,132,358 - Jeong , et al. November 7, 2 | 2006-11-07 |
Delay-locked loop circuits and method for generating transmission core clock signals
App 20060238227 - Kim; Nam-Seog ; et al. | 2006-10-26 |
Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip package
App 20060151878 - Jeong; Se-Young ; et al. | 2006-07-13 |
Reinforced solder bump structure and method for forming a reinforced solder bump
App 20060113681 - Jeong; Se-young ; et al. | 2006-06-01 |
Reinforced solder bump structure and method for forming a reinforced solder bump
Grant 7,015,590 - Jeong , et al. March 21, 2 | 2006-03-21 |
Semiconductor memory device capable of generating variable clock signals according to modes of operation
Grant 7,016,257 - Kim , et al. March 21, 2 | 2006-03-21 |
Synchronous mirror delay circuit and semiconductor integrated circuit device having the same
Grant 6,992,514 - Kim , et al. January 31, 2 | 2006-01-31 |
Programmable impedance controller and method for operating
App 20060006903 - Choi; Myung-Hun ; et al. | 2006-01-12 |
Solder bump structure and method for forming a solder bump
Grant 6,959,856 - Oh , et al. November 1, 2 | 2005-11-01 |
Solder bump structure and method for forming a solder bump
App 20050208751 - Oh, Se-Yong ; et al. | 2005-09-22 |
Semiconductor device with impedance control circuit
Grant 6,947,336 - Kim , et al. September 20, 2 | 2005-09-20 |
Amplifier circuit having constant output swing range and stable delay time
App 20050194995 - Kim, Nam-Seog ; et al. | 2005-09-08 |
Synchronous mirror delay circuit with adjustable locking range
Grant 6,933,758 - Kim , et al. August 23, 2 | 2005-08-23 |
Integrated circuit with on-chip termination
Grant 6,930,508 - Kim , et al. August 16, 2 | 2005-08-16 |
Method of forming solder bump with reduced surface defects
App 20050164483 - Jeong, Se-Young ; et al. | 2005-07-28 |
Apparatus for generating internal clock signal
App 20050146365 - Kim, Nam-Seog ; et al. | 2005-07-07 |
Impedance controller and impedance control method
App 20050146350 - Kim, Tae-Hyoung ; et al. | 2005-07-07 |
Chip scale packages manufactured at wafer level
Grant 6,903,451 - Kim , et al. June 7, 2 | 2005-06-07 |
Flip chip device having supportable bar and mounting structure thereof
App 20050104222 - Jeong, Se-Young ; et al. | 2005-05-19 |
Method of fabricating ultra thin flip-chip package
App 20050090090 - Kim, Soon-Bum ; et al. | 2005-04-28 |
Method of outputting internal information through test pin of semiconductor memory and output circuit thereof
Grant 6,834,366 - Kim , et al. December 21, 2 | 2004-12-21 |
Semiconductor device bonding pad resistant to stress and method of fabricating the same
Grant 6,812,578 - Kim , et al. November 2, 2 | 2004-11-02 |
Programmable reference voltage generating circuit
Grant 6,806,763 - Kim , et al. October 19, 2 | 2004-10-19 |
Reinforced solder bump structure and method for forming a reinforced solder bump
App 20040197979 - Jeong, Se-young ; et al. | 2004-10-07 |
Synchronous mirror delay circuit and semiconductor integrated circuit device having the same
App 20040178836 - Kim, Nam-Seog ; et al. | 2004-09-16 |
Integrated circuit with on-chip termination
App 20040145393 - Kim, Nam-Seog ; et al. | 2004-07-29 |
Solder bump structure and method for forming a solder bump
App 20040134974 - Oh, Se-Yong ; et al. | 2004-07-15 |
Programmable impedance control circuit
Grant 6,661,250 - Kim , et al. December 9, 2 | 2003-12-09 |
Digitally controllable internal clock generating circuit of semiconductor memory device and method for same
Grant 6,661,272 - Kim , et al. December 9, 2 | 2003-12-09 |
Semiconductor device with impedance control circuit
App 20030218914 - Kim, Tae-Hyoung ; et al. | 2003-11-27 |
Programmable termination circuit and method
Grant 6,642,740 - Kim , et al. November 4, 2 | 2003-11-04 |
Internal clock generating circuit of semiconductor memory device and method thereof
Grant 6,628,155 - Park , et al. September 30, 2 | 2003-09-30 |
Circuits and methods for generating internal clock signal of intermediate phase relative to external clock
Grant 6,617,894 - Yoon , et al. September 9, 2 | 2003-09-09 |
Synchronous mirror delay circuit with adjustable locking range
App 20030122598 - Kim, Tae-Hyoung ; et al. | 2003-07-03 |
Programmable impedance control circuit
App 20030116810 - Kim, Nam-Seog ; et al. | 2003-06-26 |
Method for generating internal clock of semiconductor memory device and circuit thereof
Grant 6,577,175 - Kim , et al. June 10, 2 | 2003-06-10 |
Impedance control circuit
Grant 6,573,746 - Kim , et al. June 3, 2 | 2003-06-03 |
Signal converting system having level converter for use in high speed semiconductor device and method therefor
App 20030067323 - Kim, Nam-Seog ; et al. | 2003-04-10 |
Digitally controllable internal clock generating circuit of semiconductor memory device and method for same
App 20030067338 - Kim, Nam-Seog ; et al. | 2003-04-10 |
Programmable impedance control circuit
Grant 6,525,558 - Kim , et al. February 25, 2 | 2003-02-25 |
Ag-pre-plated lead frame for semiconductor package
Grant 6,518,508 - Park , et al. February 11, 2 | 2003-02-11 |
Internal clock generating circuit of semiconductor memory device and method thereof
App 20030016063 - Park, Jung-Woo ; et al. | 2003-01-23 |
Programmable reference voltage generating circuit
App 20030001661 - Kim, Nam-Seog ; et al. | 2003-01-02 |
Method for generating internal clock of semiconductor memory device and circuit thereof
App 20020180499 - Kim, Nam-Seog ; et al. | 2002-12-05 |
Method of outputting internal information through test pin of semiconductor memory and output circuit thereof
App 20020152439 - Kim, Nam-Seog ; et al. | 2002-10-17 |
Impedance updating apparatus of termination circuit and impedance updating method thereof
App 20020118037 - Kim, Nam-Seog ; et al. | 2002-08-29 |
Semiconductor device bonding pad resistant to stress and method of fabricating the same
App 20020113313 - Kim, Shin ; et al. | 2002-08-22 |
Ag-pre-plated lead frame for semiconductor package
App 20020104682 - Park, Se-Chul ; et al. | 2002-08-08 |
Programmable impedance control circuit and method thereof
Grant 6,429,679 - Kim , et al. August 6, 2 | 2002-08-06 |
Delay circuit using current source
App 20020093370 - Park, Jung-Woo ; et al. | 2002-07-18 |
Impedance control circuit
App 20020063575 - Kim, Nam-Seog ; et al. | 2002-05-30 |
Programmable impedance control circuit
App 20020063576 - Kim, Nam-Seog ; et al. | 2002-05-30 |
Programmable termination circuit and method
App 20020053923 - Kim, Nam-Seog ; et al. | 2002-05-09 |
Programmable impedance control circuit and method thereof
App 20020050838 - Kim, Nam-Seog ; et al. | 2002-05-02 |
method for manufacturing a semiconductor package
Grant 6,376,279 - Kwon , et al. April 23, 2 | 2002-04-23 |
Method For Manufacturing A Semiconductor Package
App 20020022301 - Kwon, Yong Hwan ; et al. | 2002-02-21 |
Semiconductor package
App 20020017711 - Kwon, Yong Hwan ; et al. | 2002-02-14 |
Apparatus and method for containing semiconductor chips to identify known good dies
Grant 6,340,838 - Chung , et al. January 22, 2 | 2002-01-22 |
Chip scale packages and methods for manufacturing the chip scale packages at wafer level
Grant 6,187,615 - Kim , et al. February 13, 2 | 2001-02-13 |
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