KIM; Myeong Seob
Patent Applications and Registrations
Patent applications and USPTO patent grants for KIM; Myeong Seob.The latest application filed is for "methods of fabricating package substrates having embedded circuit patterns".
- KIM; Myeong Seob - Icheon-si Gyeonggi-do KR
- Kim; Myeong Seob - Icheon-si KR
| Patent | Date |
|---|---|
| Methods Of Fabricating Package Substrates Having Embedded Circuit Patterns App 20190027378 - KIM; Myeong Seob ; et al. | 2019-01-24 |
| Semiconductor packages having EMI shielding parts and methods of fabricating the same Grant 9,842,809 - Moon , et al. December 12, 2 | 2017-12-12 |
| Methods Of Fabricating Package Substrates Having Embedded Circuit Patterns App 20170053813 - KIM; Myeong Seob ; et al. | 2017-02-23 |
| Semiconductor Packages Having Emi Shielding Parts And Methods Of Fabricating The Same App 20170047293 - MOON; Ki Ill ; et al. | 2017-02-16 |
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