Kim; Min-Ill

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Min-Ill.The latest application filed is for "method of interconnecting chips using capillary motion".

Company Profile

0.4.7

Kim; Min-Ill - Cheonan-si KR
KIM; Min-Ill - Chungcheongnam-do KR
KIM; Min-Ill - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
In-line package apparatuses and methods Grant 8,796,597 - Kim , et al. August 5, 2	2014-08-05
Method Of Interconnecting Chips Using Capillary Motion App 20100144137 - LEE; Kwang-yong ; et al.	2010-06-10
Reflow Apparatus And Method App 20090134202 - KIM; Min-Ill ; et al.	2009-05-28
In-line Package Apparatuses And Methods App 20090127314 - KIM; Min-Ill ; et al.	2009-05-21
Apparatus For Stacking Semiconductor Chips, Method For Manufacturing Semiconductor Package Using The Same And Semiconductor Package Manufactured Thereby App 20080191364 - KIM; Min-Ill ; et al.	2008-08-14
Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby Grant 7,374,966 - Kim , et al. May 20, 2	2008-05-20
Apparatus For Stacking Semiconductor Chips, Method For Manufacturing Semiconductor Package Using The Same And Semiconductor Package Manufactured Thereby App 20070018295 - KIM; Min-Ill ; et al.	2007-01-25
Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby Grant 7,135,353 - Kim , et al. November 14, 2	2006-11-14
Device and method for manufacturing wafer-level package App 20060105477 - Lim; Suk-Kun ; et al.	2006-05-18
Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby App 20050054140 - Kim, Min-Ill ; et al.	2005-03-10

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