Kim; Min-Il
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kim; Min-Il.The latest application filed is for "semiconductor chip package having an adhesive tape attached on bonding wires".
- Kim; Min-Il - Cheonan KR
- Kim; Min-Il - Cheonan-city KR
- Kim; Min-Il - Chungcheongnam-do KR
| Patent | Date |
|---|---|
| Semiconductor chip package having an adhesive tape attached on bonding wires Grant 7,410,832 - Lee , et al. August 12, 2 | 2008-08-12 |
| Semiconductor chip package having an adhesive tape attached on bonding wires App 20070190693 - Lee; Sang-Yeop ; et al. | 2007-08-16 |
| Semiconductor chip package having an adhesive tape attached on bonding wires Grant 7,227,086 - Lee , et al. June 5, 2 | 2007-06-05 |
| Apparatus for bonding a chip using an insulating adhesive tape Grant 7,096,914 - Kim , et al. August 29, 2 | 2006-08-29 |
| Semiconductor chip package having an adhesive tape attached on bonding wires App 20060108138 - Lee; Sang-Yeop ; et al. | 2006-05-25 |
| Semiconductor chip package having an adhesive tape attached on bonding wires Grant 7,005,577 - Lee , et al. February 28, 2 | 2006-02-28 |
| Semiconductor chip package having an adhesive tape attached on bonding wires App 20040050571 - Lee, Sang-Yeop ; et al. | 2004-03-18 |
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