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Patent applications and USPTO patent grants for Kim; Min Hyang.The latest application filed is for "multilayer electronic component".
Patent | Date |
---|---|
Multilayer ceramic electronic component Grant 11,437,193 - Kim , et al. September 6, 2 | 2022-09-06 |
Multilayer Electronic Component App 20220208469 - KIM; Min Hyang ;   et al. | 2022-06-30 |
Multilayer Ceramic Electronic Component App 20220139627 - KIM; Je Jung ;   et al. | 2022-05-05 |
Multilayer Ceramic Electronic Component App 20220130609 - KIM; Min Hyang ;   et al. | 2022-04-28 |
Multilayer ceramic electronic component Grant 11,257,621 - Kim , et al. February 22, 2 | 2022-02-22 |
Multilayer Ceramic Electronic Component App 20210090807 - JEONG; Eun Hee ;   et al. | 2021-03-25 |
Multilayer ceramic electronic component Grant 10,923,285 - Kim February 16, 2 | 2021-02-16 |
Multilayer Ceramic Electronic Component App 20210020373 - KIM; Je Jung ;   et al. | 2021-01-21 |
Multilayer Ceramic Electronic Component App 20200411243 - KIM; Je Jung ;   et al. | 2020-12-31 |
Multilayer Ceramic Electronic Component App 20200161053 - KIM; Min Hyang | 2020-05-21 |
Multilayer ceramic electronic component Grant 10,529,491 - Kim J | 2020-01-07 |
Electronic component and circuit board having the same Grant 9,997,294 - Chung , et al. June 12, 2 | 2018-06-12 |
Electronic Component And Circuit Board Having The Same App 20170223832 - CHUNG; Hae Suk ;   et al. | 2017-08-03 |
Chip component Grant 9,646,768 - Lee , et al. May 9, 2 | 2017-05-09 |
Multilayer ceramic electronic component and board having the same Grant 9,633,785 - Lee , et al. April 25, 2 | 2017-04-25 |
Chip Component App 20160111216 - LEE; Sun Cheol ;   et al. | 2016-04-21 |
Multilayer Ceramic Electronic Component And Board Having The Same App 20160099107 - LEE; Sun Cheol ;   et al. | 2016-04-07 |
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