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name:-0.012537956237793
name:-0.011924028396606
name:-0.0021400451660156
Kim; Min Gyum Patent Filings

Kim; Min Gyum

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Min Gyum.The latest application filed is for "phosphonium-based compound, epoxy resin composition containing same, semiconductor device manufactured using same".

Company Profile
2.14.16
  • Kim; Min Gyum - Suwon-si KR
  • Kim; Min Gyum - Uiwang-si KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Phosphonium-based compound, epoxy resin composition containing same, semiconductor device manufactured using same
Grant 10,385,161 - Kim , et al. A
2019-08-20
Compound containing phosphonium ion, epoxy resin composition containing same, and device manufactured by using same
Grant 10,047,191 - Cheon , et al. August 14, 2
2018-08-14
Pyridiniuivi-based compound, epoxy resin composition comprising same, and apparatus manufactured using same
Grant 9,957,348 - Lee , et al. May 1, 2
2018-05-01
Phosphonium compound, preparation method thereof, epoxy resin composition including the same, and semiconductor device prepared by using the same
Grant 9,896,465 - Lee , et al. February 20, 2
2018-02-20
Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared using the same
Grant 9,890,307 - Kwon , et al. February 13, 2
2018-02-13
Curing catalyst for epoxy resin composition, epoxy resin composition comprising same, and apparatus manufactured by using same
Grant 9,890,238 - Kim , et al. February 13, 2
2018-02-13
Epoxy resin composition for encapsulating a semiconductor device and semiconductor device prepared using the same
Grant 9,870,971 - Chung , et al. January 16, 2
2018-01-16
Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared from the same
Grant 9,868,751 - Kim , et al. January 16, 2
2018-01-16
Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared using the same
Grant 9,850,390 - Cheon , et al. December 26, 2
2017-12-26
Phosphonium-based Compound, Epoxy Resin Composition Containing Same, Semiconductor Device Manufactured Using Same
App 20170306079 - KIM; Min Gyum ;   et al.
2017-10-26
Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same
Grant 9,695,294 - Kim , et al. July 4, 2
2017-07-04
Resist underlayer composition, method of forming patterns, and semiconductor integrated circuit device including the pattern
Grant 9,606,438 - Kim , et al. March 28, 2
2017-03-28
Phosphonium Compound, Epoxy Resin Composition Including The Same And Semiconductor Device Prepared Using The Same
App 20170018473 - KWON; Ki Hyeok ;   et al.
2017-01-19
Epoxy Resin Composition For Encapsulating A Semiconductor Device And Semiconductor Device Prepared Using The Same
App 20170002192 - CHUNG; Joo Young ;   et al.
2017-01-05
Epoxy Resin Composition For Encapsulating Semiconductor Device And Semiconductor Device Prepared Using The Same
App 20160379909 - CHEON; Jin Min ;   et al.
2016-12-29
Phosphonium Compound, Preparation Method Thereof, Epoxy Resin Composition Including The Same, And Semiconductor Device Prepared By Using The Same
App 20160368937 - LEE; Dong Hwan ;   et al.
2016-12-22
Pyridinium-based Compound, Epoxy Resin Composition Comprising Same, And Apparatus Manufactured Using Same
App 20160333136 - LEE; Dong Hwan ;   et al.
2016-11-17
Curing Catalyst For Epoxy Resin Composition, Epoxy Resin Composition Comprising Same, And Apparatus Manufactured By Using Same
App 20160326303 - KIM; Jung Seob ;   et al.
2016-11-10
Compound Containing Phosphonium Ion, Epoxy Resin Composition Containing Same, And Device Manufactured By Using Same
App 20160159971 - CHEON; Jin Min ;   et al.
2016-06-09
Phosphonium Compound, Epoxy Resin Composition Including The Same And Semiconductor Device Prepared From The Same
App 20160115184 - KIM; Min Gyum ;   et al.
2016-04-28
Resist Underlayer Composition, Method Of Forming Patterns, And Semiconductor Integrated Circuit Device Including The Pattern
App 20160041470 - KIM; Min-Gyum ;   et al.
2016-02-11
Resist underlayer composition, method of forming patterns and semiconductor integrated circuit device including the patterns
Grant 9,195,136 - Kwon , et al. November 24, 2
2015-11-24
Resist Underlayer Composition, Method Of Forming Patterns And Semiconductor Integrated Circuit Device Including The Patterns
App 20140319659 - KWON; Hyo-Young ;   et al.
2014-10-30
Quaternary Phosphonium Salt, Epoxy Resin Composition For Encapsulating Semiconductor Device And Including The Quaternary Phosphonium Salt, And Semiconductor Device Encapsulated With The Epoxy Resin Composition
App 20140179827 - KIM; Min Gyum ;   et al.
2014-06-26
Epoxy Resin Composition For Encapsulating Semiconductor Device And Semiconductor Device Encapsulated Using The Same
App 20140179835 - KIM; Min Gyum ;   et al.
2014-06-26

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