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name:-0.0051219463348389
name:-0.0072910785675049
KIM; Mi Seon Patent Filings

KIM; Mi Seon

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIM; Mi Seon.The latest application filed is for "adhesive composition for dicing film, dicing film and dicing die bond film".

Company Profile
5.4.11
  • KIM; Mi Seon - Daejeon KR
  • KIM; Mi Seon - Seongnam-si KR
  • Kim; Mi Seon - Seoul KR
  • KIM; Mi Seon - Yongin-si KR
  • KIM; Mi-Seon - Incheon-si KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Adhesive Composition For Dicing Film, Dicing Film And Dicing Die Bond Film
App 20220154043 - HAN; Ji Ho ;   et al.
2022-05-19
Coating Composition
App 20220002566 - Park; Jun Hyoung ;   et al.
2022-01-06
Methods, Systems And Computer Readable Mediums For Providing A Rich Menu For Instant Messaging Services
App 20210377194 - KIM; Mi Seon ;   et al.
2021-12-02
Methods, systems and computer readable mediums for providing a rich menu for instant messaging services
Grant 11,128,584 - Kim , et al. September 21, 2
2021-09-21
Automatic ventilation system and method for vehicles
Grant 10,967,707 - Lee , et al. April 6, 2
2021-04-06
Priority Control Circuit For Operation Of Vehicle Lamps
App 20210029805 - KIM; Mi Seon
2021-01-28
Thermosetting resin composition for semiconductor package and prepreg using the same
Grant 10,294,341 - Moon , et al.
2019-05-21
Methods, Systems And Computer Readable Mediums For Providing A Rich Menu For Instant Messaging Services
App 20190116143 - KIM; Mi Seon ;   et al.
2019-04-18
Methods, systems and computer readable mediums for providing a rich menu for instant messaging services
Grant 10,187,335 - Kim , et al. Ja
2019-01-22
Automatic Ventilation System And Method For Vehicles
App 20180178625 - LEE; Jang Yong ;   et al.
2018-06-28
Thermosetting resin composition for semiconductor package and prepreg using the same
App 20180148555 - MOON; Hwa Yeon ;   et al.
2018-05-31
Thermosetting Resin Composition For Semiconductor Package And Prepreg And Metal Clad Laminate Using The Same
App 20160369099 - MOON; Hwa Yeon ;   et al.
2016-12-22
Methods, Systems And Computer Readable Mediums For Providing A Rich Menu For Instant Messaging Services
App 20160234141 - KIM; Mi Seon ;   et al.
2016-08-11
Method And Portable Device For Controlling Permission Settings For Application
App 20130055378 - CHANG; Youn-Joo ;   et al.
2013-02-28

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