Kim; Kyusang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Kyusang.The latest application filed is for "packaging technologies for temperature sensing in health care products".

Company Profile

3.4.11

Kim; Kyusang - Singapore SG
Kim; Kyusang - Seongnam-si KR
KIM; Kyusang - Richmond TX
Kim; Kyusang - Atlanta GA
Kim; KyuSang - Suwon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Packaging Technologies for Temperature Sensing in Health Care Products App 20220270955 - Lupo; Pierpaolo ; et al.	2022-08-25
Packaging technologies for temperature sensing in health care products Grant 11,313,741 - Lupo , et al. April 26, 2	2022-04-26
Miniaturization of Optical Sensor Modules through Wirebonded Ball Stacks App 20210405313 - Kani; Bilal Mohamed Ibrahim ; et al.	2021-12-30
Fabric-Mounted Components App 20210337671 - Ibrahim Kani; Bilal Mohamed ; et al.	2021-10-28
Peeling solution composition for dry film resist Grant 11,092,895 - Choi , et al. August 17, 2	2021-08-17
Packaging Technologies for Temperature Sensing in Health Care Products App 20210181039 - Lupo; Pierpaolo ; et al.	2021-06-17
Beverage Vending Device Networking App 20210110365 - WELCH; Dick P. ; et al.	2021-04-15
Embedded Packaging Concepts for Integration of ASICs and Optical Components App 20210090908 - Renjan; Kishore N. ; et al.	2021-03-25
Peeling Solution Composition For Dry Film Resist App 20200272056 - CHOI; HOSUNG ; et al.	2020-08-27
Dispenser connectivity Grant 10,602,334 - Kim	2020-03-24
Selecting And Dispensing Blended Beverages From A Post-mix Beverage Dispenser App 20190172297 - Schwarber; Joshua ; et al.	2019-06-06
Dispenser Connectivity App 20180288594 - KIM; Kyusang	2018-10-04
Integrated circuit packaging system with interposer support structure mechanism and method of manufacture thereof Grant 9,859,200 - Park , et al. January 2, 2	2018-01-02
Integrated Circuit Packaging System With Interposer Support Structure Mechanism And Method Of Manufacture Thereof App 20160190054 - Park; SooSan ; et al.	2016-06-30

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