KIM; Kyungmoon

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIM; Kyungmoon.The latest application filed is for "electronic device, method for providing personal information using same, and computer-readable recording medium for recording same".

Company Profile

4.10.13

KIM; Kyungmoon - Gyeonggi-do KR
Kim; Kyungmoon - Seosan-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic Device, Method For Providing Personal Information Using Same, And Computer-readable Recording Medium For Recording Same App 20210390209 - LEE; Jaeyoung ; et al.	2021-12-16
Nonvolatile memory device and memory system including nonvolatile memory device that controls the erase speeds of cell strings Grant 11,164,636 - Lee , et al. November 2, 2	2021-11-02
Nonvolatile Memory Device And Memory System Including Nonvolatile Memory Device App 20200303015 - LEE; SUNYEONG ; et al.	2020-09-24
Nonvolatile memory device and memory system including nonvolatile memory device that controls the erase speeds of cell strings Grant 10,699,789 - Lee , et al.	2020-06-30
Semiconductor device and method of forming partition fence and shielding layer around semiconductor components Grant 10,418,332 - Lee , et al. Sept	2019-09-17
Nonvolatile Memory Device And Memory System Including Nonvolatile Memory Device App 20190279719 - LEE; SUNYEONG ; et al.	2019-09-12
Semiconductor Device and Method of Forming Partition Fence and Shielding Layer Around Semiconductor Components App 20180261551 - Lee; Goo ; et al.	2018-09-13
Methods of forming conductive and insulating layers Grant 9,865,575 - Chi , et al. January 9, 2	2018-01-09
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form Grant 9,721,921 - Kim , et al. August 1, 2	2017-08-01
Electronic Device And Method For Authenticating Identification Information Thereof App 20170201378 - KIM; Kyungmoon ; et al.	2017-07-13
Methods of Forming Conductive and Insulating Layers App 20160329310 - Chi; HeeJo ; et al.	2016-11-10
Methods of forming conductive and insulating layers Grant 9,406,533 - Chi , et al. August 2, 2	2016-08-02
Semiconductor Device and Method of Bonding Semiconductor Die to Substrate in Reconstituted Wafer Form App 20160163675 - Kim; KyungMoon ; et al.	2016-06-09
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form Grant 9,287,204 - Kim , et al. March 15, 2	2016-03-15
Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding Grant 9,252,130 - Kim , et al. February 2, 2	2016-02-02
Semiconductor device and method of simultaneous molding and thermalcompression bonding Grant 9,245,770 - Kim , et al. January 26, 2	2016-01-26
Semiconductor device and method of making bumpless flipchip interconnect structures Grant 9,240,331 - Kim , et al. January 19, 2	2016-01-19
Methods of Forming Conductive Materials on Contact Pads App 20150004750 - Chi; HeeJo ; et al.	2015-01-01
Methods of Forming Conductive and Insulating Layers App 20150004756 - Chi; HeeJo ; et al.	2015-01-01
Methods of Manufacturing Flip Chip Semiconductor Packages Using Double-Sided Thermal Compression Bonding App 20140295618 - Kim; KyungMoon ; et al.	2014-10-02
Semiconductor Device and Method of Bonding Semiconductor Die to Substrate in Reconstituted Wafer Form App 20140175640 - Kim; KyungMoon ; et al.	2014-06-26
Semiconductor Device and Method of Making Bumpless Flipchip Interconnect Structures App 20140175661 - Kim; KyungMoon ; et al.	2014-06-26
Semiconductor Device and Method of Simultaneous Molding and Thermalcompression Bonding App 20140175639 - Kim; KyungMoon ; et al.	2014-06-26

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