| Patent | Date |
|---|
Semiconductor Package Including Processor Chip And Memory Chip
App 20220216193 - KIM; Kil-soo | 2022-07-07 |
Semiconductor device package
Grant 11,309,280 - Kim , et al. April 19, 2 | 2022-04-19 |
Semiconductor package including processor chip and memory chip
Grant 11,309,300 - Kim April 19, 2 | 2022-04-19 |
Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics
Grant 11,205,637 - Kim , et al. December 21, 2 | 2021-12-21 |
Semiconductor Packages Having Improved Thermal Discharge And Electromagnetic Shielding Characteristics
App 20200402952 - KIM; Won-keun ; et al. | 2020-12-24 |
Semiconductor Device Package
App 20200343219 - KIM; Yong-hoon ; et al. | 2020-10-29 |
Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics
Grant 10,797,021 - Kim , et al. October 6, 2 | 2020-10-06 |
Electronic device including semiconductor device package
Grant 10,727,199 - Kim , et al. | 2020-07-28 |
Semiconductor package
Grant 10,699,983 - Kim , et al. | 2020-06-30 |
Semiconductor Packages Having Improved Thermal Discharge And Electromagnetic Shielding Characteristics
App 20200075545 - KIM; Won-keun ; et al. | 2020-03-05 |
Semiconductor Package
App 20190295917 - KIM; Kil-soo ; et al. | 2019-09-26 |
Semiconductor Package
App 20190148349 - KIM; Kil-soo | 2019-05-16 |
Electronic Device Including Semiconductor Device Package
App 20190148337 - KIM; Yong-hoon ; et al. | 2019-05-16 |
Semiconductor Package
App 20170243855 - KIM; Kil Soo | 2017-08-24 |
Semiconductor device
Grant 9,691,737 - Kim June 27, 2 | 2017-06-27 |
Multi-chip package having a logic chip disposed in a package substrate opening and connecting to an interposer
Grant 9,299,685 - Kim March 29, 2 | 2016-03-29 |
Semiconductor Device
App 20150357310 - KIM; Kil-Soo | 2015-12-10 |
Combinable electrode needle base structure
Grant 9,072,525 - Shin , et al. July 7, 2 | 2015-07-07 |
Multi-chip Package
App 20150035142 - KIM; Kil-Soo | 2015-02-05 |
Integrated circuit packages having redistribution structures
Grant 8,791,580 - Park , et al. July 29, 2 | 2014-07-29 |
Multi-channel package and electronic system including the same
Grant 8,643,175 - Kim , et al. February 4, 2 | 2014-02-04 |
Semiconductor package having a stacked structure
Grant 8,487,452 - Lee , et al. July 16, 2 | 2013-07-16 |
Integrated Circuit Packages Having Redistribution Structures
App 20130168842 - PARK; Chul ; et al. | 2013-07-04 |
Emi Shielded Semiconductor Package And Emi Shielded Substrate Module
App 20130082368 - KIM; Tae-hoon ; et al. | 2013-04-04 |
Multi-channel Package And Electronic System Including The Same
App 20130021760 - KIM; KIL-SOO ; et al. | 2013-01-24 |
Wound Healing Device, Method for Making the Same and Method for Treating a Wound
App 20120251612 - Karim; Mohammad Rezaul ; et al. | 2012-10-04 |
Packet switched radio telecommunication system supporting hard handover and method for hard handover
Grant 8,249,023 - Kim , et al. August 21, 2 | 2012-08-21 |
Combinable Electrode Needle Base Structure
App 20120179152 - Shin; Kyung-Min ; et al. | 2012-07-12 |
Semiconductor Package Having A Stacked Structure
App 20120001347 - LEE; Jin-Yang ; et al. | 2012-01-05 |
Stacked structure using semiconductor devices and semiconductor device package including the same
Grant 8,018,071 - Kim September 13, 2 | 2011-09-13 |
Packet Switched Radio Telecommunication System Supporting Hard Handover And Method For Hard Handover
App 20110206008 - Kim; Kil Soo ; et al. | 2011-08-25 |
Packet switched radio telecommunication system supporting hard handover and method for hard handover
Grant 7,953,043 - Kim , et al. May 31, 2 | 2011-05-31 |
Semiconductor Package, Stack Module, Card, And Electronic System
App 20100314740 - CHOI; Keun-ho ; et al. | 2010-12-16 |
Stacked Structure Using Semiconductor Devices And Semiconductor Device Package Including The Same
App 20080185732 - KIM; Kil-Soo | 2008-08-07 |
Packet Switched Radio Telecommunication System Supporting Hard Handover And Method For Hard Handover
App 20070230402 - Kim; Kil Soo ; et al. | 2007-10-04 |
Circuit board, semiconductor package having the same, and method of manufacturing the circuit board
App 20070176279 - Kim; Kil-Soo | 2007-08-02 |
Rubber Liquid Spray Lid Having Embedded Pumping Device
App 20070158365 - KIM; Kil-Soo | 2007-07-12 |
Bump land structure of circuit substrate for semiconductor package
App 20060220246 - Kim; Kil-Soo ; et al. | 2006-10-05 |
Semiconductor package with improved ball land structure
Grant 7,064,435 - Chung , et al. June 20, 2 | 2006-06-20 |
Semiconductor package with improved ball land structure
App 20050023683 - Chung, Myung-Kee ; et al. | 2005-02-03 |
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