Kim; Jungyup

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Jungyup.The latest application filed is for "conductive pvd stack-up design to improve reliability of deposited electrodes".

Company Profile

1.5.9

Kim; Jungyup - Palo Alto CA
Kim; Jungyup - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Conductive Pvd Stack-up Design To Improve Reliability Of Deposited Electrodes App 20220151094 - Liang; Jiahui ; et al.	2022-05-12
Conductive PVD stack-up design to improve reliability of deposited electrodes Grant 11,272,631 - Liang , et al. March 8, 2	2022-03-08
Conductive Pvd Stack-up Design To Improve Reliability Of Deposited Electrodes App 20210076525 - Liang; Jiahui ; et al.	2021-03-11
Multi-Step Atomic Layer Deposition Process for Silicon Nitride Film Formation App 20170107614 - LEE; Sang In ; et al.	2017-04-20
System and method for wet cleaning a semiconductor wafer Grant 7,306,002 - Kim , et al. December 11, 2	2007-12-11
Apparatus and method for treating surfaces of semiconductor wafers using ozone Grant 7,258,124 - Jeong , et al. August 21, 2	2007-08-21
Apparatus and method for treating surfaces of semiconductor wafers using ozone App 20060112980 - Jeong; In Kwon ; et al.	2006-06-01
Apparatus and method for cleaning surfaces of semiconductor wafers using ozone Grant 7,051,743 - Kim , et al. May 30, 2	2006-05-30
Apparatus and method for treating surfaces of semiconductor wafers using ozone Grant 7,022,193 - Jeong , et al. April 4, 2	2006-04-04
Apparatus and method for treating surfaces of semiconductor wafers using ozone App 20050056306 - Jeong, In Kwon ; et al.	2005-03-17
System and method for wet cleaning a semiconductor wafer App 20040132318 - Kim, Yong Bae ; et al.	2004-07-08
Apparatus and method for treating surfaces of semiconductor wafers using ozone App 20040079396 - Jeong, In Kwon ; et al.	2004-04-29
Apparatus and method for cleaning surfaces of semiconductor wafers using ozone App 20040079395 - Kim, Yong Bae ; et al.	2004-04-29
Nozzle assembly, system and method for wet processing a semiconductor wafer App 20040062874 - Kim, Yong Bae ; et al.	2004-04-01

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