KIM; Jun Youp
Patent Applications and Registrations
Patent applications and USPTO patent grants for KIM; Jun Youp.The latest application filed is for "high-rigidity and high-heat resistance thermoplastic composite material composition and molded product manufactured therefrom".
- KIM; Jun Youp - Gimcheon KR
- Kim; Jun Youp - Daejeon KR
- Kim; Jun-Youp - Gyeonggi-do KR
| Patent | Date |
|---|---|
| High-rigidity And High-heat Resistance Thermoplastic Composite Material Composition And Molded Product Manufactured Therefrom App 20220220309 - KIM; Jun Youp ; et al. | 2022-07-14 |
| Lower Cross Member Of Vehicle App 20210179190 - Kim; Hyun Sik ; et al. | 2021-06-17 |
| Semiconductor memory device Grant 10,777,520 - Lee , et al. Sept | 2020-09-15 |
| Semiconductor Memory Device App 20200006270 - LEE; Go-Hyun ; et al. | 2020-01-02 |
| Semiconductor memory device Grant 10,446,570 - Lee , et al. Oc | 2019-10-15 |
| Semiconductor Memory Device App 20190139976 - LEE; Go-Hyun ; et al. | 2019-05-09 |
| Bumper system for vehicle Grant 10,106,112 - So , et al. October 23, 2 | 2018-10-23 |
| Bumper System For Vehicle App 20170327065 - SO; Choul Won ; et al. | 2017-11-16 |
| Vehicle front structure Grant 9,771,039 - Yoon , et al. September 26, 2 | 2017-09-26 |
| Vehicle Front Structure App 20170096116 - Yoon; Jin Young ; et al. | 2017-04-06 |
| Bumper beam assembly system Grant 9,211,857 - So , et al. December 15, 2 | 2015-12-15 |
| Bumper Beam Assembly System App 20150137539 - SO; Choul Won ; et al. | 2015-05-21 |
| Bumper Beam Assembly System App 20140054907 - SO; Choul Won ; et al. | 2014-02-27 |
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