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Kim; Jun Hyeon Patent Filings

Kim; Jun Hyeon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Jun Hyeon.The latest application filed is for "multilayer capacitor and board having the same mounted thereon".

Company Profile
5.4.10
  • Kim; Jun Hyeon - Suwon-si KR
  • KIM; Jun Hyeon - Suwon KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multilayer Capacitor And Board Having The Same Mounted Thereon
App 20220301783 - Kyeong; San ;   et al.
2022-09-22
Multilayer capacitor and board having the same mounted thereon
Grant 11,393,633 - Kyeong , et al. July 19, 2
2022-07-19
Multilayer Electronic Component
App 20220189696 - YI; Young Soo ;   et al.
2022-06-16
Multilayer Electronic Component
App 20220051853 - Kim; Jun Hyeon ;   et al.
2022-02-17
Mlcc Module And Method Of Manufacturing The Same
App 20220037087 - YI; Jae Seok ;   et al.
2022-02-03
Multilayer electronic component
Grant 11,189,424 - Kim , et al. November 30, 2
2021-11-30
MLCC module and method of manufacturing the same
Grant 11,183,331 - Yi , et al. November 23, 2
2021-11-23
Multilayer Electronic Component
App 20210065981 - Kim; Jun Hyeon ;   et al.
2021-03-04
Multilayer Capacitor And Board Having The Same Mounted Thereon
App 20210057160 - Kyeong; San ;   et al.
2021-02-25
Multilayer ceramic capacitor and method of manufacturing the same
Grant 10,770,230 - Koo , et al. Sep
2020-09-08
Mlcc Module And Method Of Manufacturing The Same
App 20200273621 - YI; Jae Seok ;   et al.
2020-08-27
Multilayer Ceramic Capacitor And Method Of Manufacturing The Same
App 20190013150 - KOO; Kun Hoi ;   et al.
2019-01-10
Printed Circuit Board And Method Of Manufacturing The Same
App 20170094786 - OH; Yu Hong ;   et al.
2017-03-30
Composite Material, Method For Preparing Thereof, And Substrate Using The Same
App 20140377544 - PARK; Ye Jun ;   et al.
2014-12-25

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