Kim; Joong-do
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kim; Joong-do.The latest application filed is for "semiconductor lead frame, semiconductor package having the same, and method of plating the same".
- Kim; Joong-do - Yongin-si KR
- Kim; Joong-Do - Kyungki-do KR
- Kim; Joong-do - Yongin KR
| Patent | Date |
|---|---|
| Semiconductor lead frame, semiconductor package having the same, and method of plating the same Grant 7,501,692 - Choi , et al. March 10, 2 | 2009-03-10 |
| Semiconductor lead frame, semiconductor package having the same, and method of plating the same App 20060071310 - Choi; Woo-suk ; et al. | 2006-04-06 |
| Lead frame containing leads plated with tin alloy for increased wettability and method for plating the leads Grant 6,087,712 - Kim , et al. July 11, 2 | 2000-07-11 |
| Semiconductor lead frame having multi-layered plating layer including copper-nickel plating layer Grant 6,037,653 - Kim , et al. March 14, 2 | 2000-03-14 |
| Method of forming a plating layer of a lead frame Grant 6,017,777 - Kim , et al. January 25, 2 | 2000-01-25 |
| Lead frame having a Ni-Mn alloy layer and a Pd layer Grant 5,977,620 - Kim , et al. November 2, 1 | 1999-11-02 |
| Lead frame for semiconductor device Grant 5,958,607 - Kim , et al. September 28, 1 | 1999-09-28 |
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