loadpatents
name:-0.030680894851685
name:-0.011775016784668
name:-0.0035078525543213
Kim; Joondong Patent Filings

Kim; Joondong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Joondong.The latest application filed is for "display device".

Company Profile
3.9.10
  • Kim; Joondong - Gyeonggi-do KR
  • Kim; Joondong - Incheon KR
  • Kim; Joondong - Paju-si KR
  • Kim; JoonDong - Kyunggi-Do KR
  • Kim; JoonDong - Kyoungbuk KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Display device
Grant 10,714,561 - Gang , et al.
2020-07-14
High-efficiency photoelectric element and method for manufacturing same
Grant 10,566,475 - Kim , et al. Feb
2020-02-18
Display device and method of driving the same
Grant 10,431,172 - Kim , et al. O
2019-10-01
Display device
Grant 10,366,676 - Kim , et al. July 30, 2
2019-07-30
Display Device
App 20180323251 - GANG; Byeonguk ;   et al.
2018-11-08
Display device
Grant 10,038,049 - Gang , et al. July 31, 2
2018-07-31
Display Device
App 20180144717 - Kim; Dongik ;   et al.
2018-05-24
Display Device and Method of Driving the Same
App 20180061343 - KIM; Joondong ;   et al.
2018-03-01
Display Device
App 20180033850 - GANG; Byeonguk ;   et al.
2018-02-01
High-efficiency Photoelectric Element And Method For Manufacturing Same
App 20160372614 - Kim; Joondong ;   et al.
2016-12-22
Single input level shifter
Grant 9,035,688 - Pi , et al. May 19, 2
2015-05-19
Semiconductor device and method of forming adjacent channel and dam material around die attach area of substrate to control outward flow of underfill material
Grant 9,030,030 - Lee , et al. May 12, 2
2015-05-12
Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP Coating
App 20140159236 - Kim; BaeYong ;   et al.
2014-06-12
Single Input Level Shifter
App 20140062572 - PI; Jae-Eun ;   et al.
2014-03-06
Semiconductor Device and Method of Forming Adjacent Channel and Dam Material Around Die Attach Area of Substrate to Control Outward Flow of Underfill Material
App 20130147065 - Lee; KyungHoon ;   et al.
2013-06-13
Semiconductor device and method of forming adjacent channel and DAM material around die attach area of substrate to control outward flow of underfill material
Grant 8,399,300 - Lee , et al. March 19, 2
2013-03-19
Semiconductor Device and Method of Forming Adjacent Channel and DAM Material Around Die Attach Area of Substrate to Control Outward Flow of Underfill Material
App 20110260338 - Lee; KyungHoon ;   et al.
2011-10-27
Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP Coating
App 20090233436 - Kim; BaeYong ;   et al.
2009-09-17

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