KIM; Jongyoun

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIM; Jongyoun.The latest application filed is for "semiconductor package and method of fabricating the same".

Company Profile

15.13.22

KIM; Jongyoun - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package And Method Of Fabricating The Same App 20220310496 - KIM; Jongyoun ; et al.	2022-09-29
Semiconductor package Grant 11,456,241 - Lee , et al. September 27, 2	2022-09-27
Connection structure and method of forming the same Grant 11,437,310 - Kim September 6, 2	2022-09-06
Semiconductor package Grant 11,387,192 - Kim July 12, 2	2022-07-12
Semiconductor package Grant 11,373,954 - Kim June 28, 2	2022-06-28
Semiconductor Package Including Substrate With Outer Insulating Layer App 20220084924 - KIM; EUNGKYU ; et al.	2022-03-17
Semiconductor Package App 20220077066 - KIM; Jongyoun ; et al.	2022-03-10
Semiconductor Package And Method Of Fabricating The Same App 20220059444 - KIM; JONGYOUN ; et al.	2022-02-24
Semiconductor Package And Method Of Manufacturing The Same App 20210407940 - Kim; Jongyoun ; et al.	2021-12-30
Semiconductor Package App 20210375810 - KIM; JONGYOUN	2021-12-02
Semiconductor package and method of manufacturing the same Grant 11,145,611 - Kim , et al. October 12, 2	2021-10-12
Semiconductor package and method of manufacturing the semiconductor package Grant 11,094,636 - Jang , et al. August 17, 2	2021-08-17
Semiconductor Package App 20210202402 - KIM; Jongyoun	2021-07-01
Redistribution Substrate, Method Of Fabricating The Same, And Semiconductor Package Including The Same App 20210183766 - Kim; Jongyoun ; et al.	2021-06-17
Method of fabricating semiconductor package Grant 11,018,108 - Min , et al. May 25, 2	2021-05-25
Semiconductor Package And Method Of Manufacturing The Same App 20210125908 - JANG; Yeonho ; et al.	2021-04-29
Semiconductor Package App 20210111114 - LEE; Seokhyun ; et al.	2021-04-15
Redistribution substrate, method of fabricating the same, and semiconductor package including the same Grant 10,950,539 - Kim , et al. March 16, 2	2021-03-16
Semiconductor Package App 20210057344 - Kim; Jongyoun	2021-02-25
Connection Structure And Method Of Forming The Same App 20210050292 - KIM; Jongyoun	2021-02-18
Method Of Manufacturing A Semiconductor Package App 20210020505 - Jang; Jaegwon ; et al.	2021-01-21
Semiconductor Package And Method Of Manufacturing The Same App 20200411458 - Kim; Jongyoun ; et al.	2020-12-31
Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20200373243 - JANG; Jaegwon ; et al.	2020-11-26
Connection structure and method of forming the same Grant 10,833,002 - Kim November 10, 2	2020-11-10
Method Of Fabricating Semiconductor Package App 20200328175 - Min; Youn Ji ; et al.	2020-10-15
Method of fabricating semiconductor package Grant 10,741,518 - Min , et al. A	2020-08-11
Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same Grant 10,685,890 - Kim , et al.	2020-06-16
Connection Structure And Method Of Forming The Same App 20200185314 - KIM; Jongyoun	2020-06-11
Method Of Fabricating Semiconductor Package App 20200098716 - MIN; Youn Ji ; et al.	2020-03-26
Redistribution Substrate, Method Of Fabricating The Same, And Semiconductor Package Including The Same App 20200091066 - KIM; Jongyoun ; et al.	2020-03-19
Method of fabricating semiconductor package Grant 10,546,829 - Min , et al. Ja	2020-01-28
Semiconductor Package Having Redistribution Pattern And Passivation Patterns And Method Of Fabricating The Same App 20190181064 - Kim; Jongyoun ; et al.	2019-06-13
Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the same Grant 10,319,650 - Kim , et al.	2019-06-11
Method Of Fabricating Semiconductor Package App 20190035756 - MIN; YOUN JI ; et al.	2019-01-31
Semiconductor Package And Method Of Fabricating Redistribution Pattern App 20180076123 - KIM; Jongyoun ; et al.	2018-03-15

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