| Patent | Date |
|---|
Compound Semiconductor And Complementary Metal Oxide Semiconductor (cmos) Transistor Integration
App 20220302107 - DUTTA; Ranadeep ; et al. | 2022-09-22 |
Three-dimensional (3D) integrated circuit device having a backside power delivery network
Grant 11,444,068 - Song , et al. September 13, 2 | 2022-09-13 |
Stacked Inductor Having A Discrete Metal-stack Pattern
App 20220285080 - KIM; Jonghae ; et al. | 2022-09-08 |
Field-effect transistors (FET) circuits employing topside and backside contacts for topside and backside routing of FET power and logic signals, and related complementary metal oxide semiconductor (CMOS) circuits
Grant 11,437,379 - Song , et al. September 6, 2 | 2022-09-06 |
Heterogeneous integrated wideband high electron mobility transistor power amplifier with a single-crystal acoustic resonator/filter
Grant 11,437,367 - Lan , et al. September 6, 2 | 2022-09-06 |
Stacked decoupling capacitors with integration in a substrate
Grant 11,417,637 - Kim , et al. August 16, 2 | 2022-08-16 |
Advanced integrated passive device (IPD) with thin-film heat spreader (TF-HS) layer for high power handling filters in transmit (TX) path
Grant 11,404,345 - Lan , et al. August 2, 2 | 2022-08-02 |
Surface Acoustic Wave (saw) Devices With A Diamond Bridge Enclosed Wave Propagation Cavity
App 20220231660 - Dutta; Ranadeep ; et al. | 2022-07-21 |
Resonator device
Grant 11,394,360 - Lan , et al. July 19, 2 | 2022-07-19 |
Stacked circuits of III-V devices over silicon with high quality integrated passives with hybrid bonding
Grant 11,393,789 - Lan , et al. July 19, 2 | 2022-07-19 |
Trench Capacitor Assembly For High Capacitance Density
App 20220223585 - KIM; Jonghae ; et al. | 2022-07-14 |
Metamorphic high electron mobility transistor-heterojunction bipolar transistor integration
Grant 11,380,678 - Dutta , et al. July 5, 2 | 2022-07-05 |
Electronic Device Including Flexible Display
App 20220182477 - KIM; Jonghae ; et al. | 2022-06-09 |
Multi-terminal integrated passive devices embedded on die and a method for fabricating the multi-terminal integrated passive devices
Grant 11,342,246 - Patil , et al. May 24, 2 | 2022-05-24 |
Device with 3D inductor and magnetic core in substrate
Grant 11,336,251 - Lan , et al. May 17, 2 | 2022-05-17 |
Hybrid Reconstituted Substrate For Electronic Packaging
App 20220148953 - KIM; Jonghae ; et al. | 2022-05-12 |
Voltage regulation integrated circuit (IC) with circuit components in an integrated three-dimensional (3D) inductor core and related methods of fabrication
Grant 11,320,847 - Kim , et al. May 3, 2 | 2022-05-03 |
Package Structure For Passive Component To Die Critical Distance Reduction
App 20220130741 - PATIL; Aniket ; et al. | 2022-04-28 |
Three-dimensional (3D) integrated circuit (IC) integration of an embedded chip and a preformed metal routing structure
Grant 11,310,911 - Song , et al. April 19, 2 | 2022-04-19 |
Integrated Circuit Assembly With Hybrid Bonding
App 20220108968 - KIM; Jonghae ; et al. | 2022-04-07 |
Foldable Electronic Device Comprising Integrated-adhesive Layer And Adhesion Prevention Part
App 20220107666 - KIM; Seonghoon ; et al. | 2022-04-07 |
Nested interconnect structure in concentric arrangement for improved package architecture
Grant 11,296,024 - Patil , et al. April 5, 2 | 2022-04-05 |
Impedance matching transceiver
Grant 11,296,670 - Kim , et al. April 5, 2 | 2022-04-05 |
Field-effect Transistors (fet) Circuits Employing Topside And Backside Contacts For Topside And Backside Routing Of Fet Power And Logic Signals, And Related Complementary Metal Oxide Semiconductor (cmos) Circuits
App 20220093594 - SONG; Stanley Seungchul ; et al. | 2022-03-24 |
Mim Capacitor With Adjustable Capacitance Via Electronic Fuses
App 20220084883 - KIM; Jonghae ; et al. | 2022-03-17 |
Capacitor Interposer Layer (cil) Chiplet Design With Conformal Die Edge Pattern Around Bumps
App 20220084922 - LAN; Je-Hsiung ; et al. | 2022-03-17 |
Integrated Circuit (ic) With Reconstituted Die Interposer For Improved Connectivity, And Related Methods Of Fabrication
App 20220084947 - Kim; Jonghae ; et al. | 2022-03-17 |
Stacked Die Integrated With Package Voltage Regulators
App 20220077109 - CHAVA; Bharani ; et al. | 2022-03-10 |
Foldable Electronic Device
App 20220075413 - PARK; Myeongsil ; et al. | 2022-03-10 |
Substrate Comprising Acoustic Resonators Configured As At Least One Acoustic Filter
App 20220069797 - KIM; Jonghae ; et al. | 2022-03-03 |
Multi-terminal Integrated Passive Devices Embedded On Die And A Method For Fabricating The Multi-terminal Integrated Passive Devices
App 20220028756 - PATIL; Aniket ; et al. | 2022-01-27 |
Backside Power Distribution Network (pdn) Processing
App 20220028758 - SONG; Stanley Seungchul ; et al. | 2022-01-27 |
Three-dimensional (3d) Integrated Circuit (ic) Integration Of An Embedded Chip And A Preformed Metal Routing Structure
App 20220022315 - SONG; Stanley Seungchul ; et al. | 2022-01-20 |
Three-dimensional (3d) Integrated Circuit Device Having A Backside Power Delivery Network
App 20220020735 - SONG; Stanley Seungchul ; et al. | 2022-01-20 |
High Performance Tunable Filter
App 20220014176 - LAN; Je-Hsiung ; et al. | 2022-01-13 |
Substrate Comprising An Inductor And A Capacitor Located In An Encapsulation Layer
App 20220013444 - KIM; Jonghae ; et al. | 2022-01-13 |
MIM capacitor with adjustable capacitance via electronic fuses
Grant 11,211,290 - Kim , et al. December 28, 2 | 2021-12-28 |
Antenna On Glass With Air Cavity Structure
App 20210399404 - LAN; Je-Hsiung ; et al. | 2021-12-23 |
Three-dimensional (3d) Integrated Circuit With Passive Elements Formed By Hybrid Bonding
App 20210398957 - LAN; Je-Hsiung ; et al. | 2021-12-23 |
Advanced Integrated Passive Device (ipd) With Thin-film Heat Spreader (tf-hs) Layer For High Power Handling Filters In Transmit (tx) Path
App 20210391234 - LAN; Je-Hsiung ; et al. | 2021-12-16 |
Metamorphic High Electron Mobility Transistor-heterojunction Bipolar Transistor Integration
App 20210391321 - DUTTA; Ranadeep ; et al. | 2021-12-16 |
Device comprising contact to contact coupling of packages
Grant 11,201,127 - Kim , et al. December 14, 2 | 2021-12-14 |
Package Comprising Stacked Filters With A Shared Substrate Cap
App 20210376810 - KIM; Jonghae ; et al. | 2021-12-02 |
Thermal Mitigation Die Using Back Side Etch
App 20210375712 - PATIL; Aniket ; et al. | 2021-12-02 |
Integrated device coupled to a capacitor structure comprising a trench capacitor
Grant 11,189,686 - Kim , et al. November 30, 2 | 2021-11-30 |
Nested Interconnect Structure In Concentric Arrangement For Improved Package Architecture
App 20210358839 - PATIL; Aniket ; et al. | 2021-11-18 |
Stacked Decoupling Capacitors With Integration In A Substrate
App 20210343684 - KIM; Jonghae ; et al. | 2021-11-04 |
Capacitor Interposer Layer (cil) In A Die-to-wafer Three-dimensional (3d) Integrated Circuit (ic) (3dic)
App 20210335738 - Lan; Je-Hsiung ; et al. | 2021-10-28 |
Capacitor interposer layer (CIL) in a die-to-wafer three-dimensional (3D) integrated circuit (IC) (3DIC)
Grant 11,158,590 - Lan , et al. October 26, 2 | 2021-10-26 |
Heterogeneous Integrated Wideband High Electron Mobility Transistor Power Amplifier With A Single-crystal Acoustic Resonator/filter
App 20210327873 - LAN; Je-Hsiung ; et al. | 2021-10-21 |
Electronic Device With Coating For Protection Of Window
App 20210323275 - Ahn; Sungho ; et al. | 2021-10-21 |
Die-to-wafer hybrid bonding with forming glass
Grant 11,152,272 - Lan , et al. October 19, 2 | 2021-10-19 |
Trench capacitor component with reduced equivalent series resistance and equivalent series inductance
Grant 11,145,768 - Kim , et al. October 12, 2 | 2021-10-12 |
Mim Capacitor With Adjustable Capacitance Via Electronic Fuses
App 20210296170 - KIM; Jonghae ; et al. | 2021-09-23 |
Wideband filter with resonators and inductors
Grant 11,121,699 - Liu , et al. September 14, 2 | 2021-09-14 |
Hybrid Three Dimensional Inductor
App 20210281234 - KIM; Jonghae ; et al. | 2021-09-09 |
Device Comprising Contact To Contact Coupling Of Packages
App 20210280540 - KIM; Jonghae ; et al. | 2021-09-09 |
Voltage Regulation Integrated Circuit (ic) With Circuit Components In An Integrated Three-dimensional (3d) Inductor Core And Related Methods Of Fabrication
App 20210271275 - Kim; Jonghae ; et al. | 2021-09-02 |
Integrated circuit package with a magnetic core
Grant 11,101,228 - Kim , et al. August 24, 2 | 2021-08-24 |
Wideband Filter With Resonators And Inductors
App 20210257989 - LIU; Kai ; et al. | 2021-08-19 |
Integrated Circuit Package With A Magnetic Core
App 20210257321 - KIM; Jonghae ; et al. | 2021-08-19 |
Trench Capacitor Component With Reduced Equivalent Series Resistance And Equivalent Series Inductance
App 20210242353 - KIM; Jonghae ; et al. | 2021-08-05 |
Impedance Matching Transceiver
App 20210234526 - KIM; Jonghae ; et al. | 2021-07-29 |
Electronic device with coating for protection of window
Grant 11,073,869 - Ahn , et al. July 27, 2 | 2021-07-27 |
Integrated Passive Device (ipd) Coupled To Front Side Of Integrated Device
App 20210210452 - LANGARI; Abdolreza ; et al. | 2021-07-08 |
Integrated Device With Electromagnetic Shield
App 20210175181 - KIM; Jonghae ; et al. | 2021-06-10 |
High performance inductors
Grant 11,024,454 - Kim , et al. June 1, 2 | 2021-06-01 |
Resonator Device
App 20210159873 - LAN; Je-Hsiung ; et al. | 2021-05-27 |
Integration Of Heterogeneous Transistors On Diamond Substrate By Layer Transfer
App 20210151428 - DUTTA; Ranadeep ; et al. | 2021-05-20 |
Die-to-wafer Hybrid Bonding With Forming Glass
App 20210143071 - LAN; Je-Hsiung ; et al. | 2021-05-13 |
Silicon On Diamond Thermal And Shielding Mitigation
App 20210104447 - KIM; Jonghae ; et al. | 2021-04-08 |
Device With 3d Inductor And Magnetic Core In Substrate
App 20210099149 - LAN; Je-Hsiung ; et al. | 2021-04-01 |
Device On Ceramic Substrate
App 20210098319 - LAN; Je-Hsiung ; et al. | 2021-04-01 |
Integrated Device Coupled To A Capacitor Structure Comprising A Trench Capacitor
App 20210098567 - KIM; Jonghae ; et al. | 2021-04-01 |
Hybrid passive-on-glass (POG) acoustic filter
Grant 10,944,379 - Berdy , et al. March 9, 2 | 2021-03-09 |
Integrated circuits (ICs) on a glass substrate
Grant 10,903,240 - Gu , et al. January 26, 2 | 2021-01-26 |
Stacked Circuits Of Iii-v Devices Over Silicon With High Quality Integrated Passives With Hybrid Bonding
App 20200381398 - LAN; Je-Hsiung ; et al. | 2020-12-03 |
Bulk acoustic wave (BAW) and passive-on-glass (POG) filter co-integration
Grant 10,840,884 - Song , et al. November 17, 2 | 2020-11-17 |
Integration Of Heterogeneous Transistors On Diamond Substrate
App 20200350425 - DUTTA; Ranadeep ; et al. | 2020-11-05 |
Electronic Device With Coating For Protection Of Window
App 20200310494 - AHN; Sungho ; et al. | 2020-10-01 |
Wideband Filter With Resonators And Inductors
App 20200266512 - LIU; Kai ; et al. | 2020-08-20 |
Method And System Apparatus For Vertical Installation Of Solar Cell Panel
App 20200244211 - KIM; Michael J. ; et al. | 2020-07-30 |
Solenoid structure with conductive pillar technology
Grant 10,693,432 - Park , et al. | 2020-06-23 |
Inductors formed with through glass vias
Grant 10,614,942 - Yun , et al. | 2020-04-07 |
Passive-on-glass (POG) device and method
Grant 10,607,980 - Lan , et al. | 2020-03-31 |
Integrated Filter Technology With Embedded Devices
App 20200091094 - YUN; Changhan Hobie ; et al. | 2020-03-19 |
Integration of through glass via (TGV) filter and acoustic filter
Grant 10,582,609 - Yun , et al. | 2020-03-03 |
3D pillar inductor
Grant 10,553,671 - Zuo , et al. Fe | 2020-02-04 |
Inductors Formed With Through Glass Vias
App 20200020473 - YUN; Changhan Hobie ; et al. | 2020-01-16 |
Glass substrate including passive-on-glass device and semiconductor die
Grant 10,523,253 - Yun , et al. Dec | 2019-12-31 |
Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductor
Grant 10,498,307 - Velez , et al. De | 2019-12-03 |
Bulk Acoustic Wave (baw) And Passive-on-glass (pog) Filter Co-integration
App 20190363694 - SONG; Stanley Seungchul ; et al. | 2019-11-28 |
Integrated Passive Device Transmission-Line Resonator
App 20190363748 - Gavryliuk; Oleksandr ; et al. | 2019-11-28 |
Close proximity tunable inductive elements
Grant 10,490,621 - Thadesar , et al. Nov | 2019-11-26 |
Two-dimensional structure to form an embedded three-dimensional structure
Grant 10,490,348 - Velez , et al. Nov | 2019-11-26 |
Solenoid Structure With Conductive Pillar Technology
App 20190356294 - PARK; Nosun ; et al. | 2019-11-21 |
Three-dimensional high quality passive structure with conductive pillar technology
Grant 10,433,425 - Liu , et al. O | 2019-10-01 |
Integrated Circuits (ics) On A Glass Substrate
App 20190259780 - GU; Shiqun ; et al. | 2019-08-22 |
Land grid array (LGA) packaging of passive-on-glass (POG) structure
Grant 10,361,149 - Zuo , et al. | 2019-07-23 |
Varying thickness inductor
Grant 10,354,795 - Kim , et al. July 16, 2 | 2019-07-16 |
Integrated circuits (ICs) on a glass substrate
Grant 10,332,911 - Gu , et al. | 2019-06-25 |
Solenoid inductor
Grant 10,332,671 - Velez , et al. | 2019-06-25 |
Backside drill embedded die substrate
Grant 10,325,855 - Kim , et al. | 2019-06-18 |
Semiconductor assembly and method of making same
Grant 10,319,694 - Kim , et al. | 2019-06-11 |
Inductor with metal-insulator-metal (MIM) capacitor
Grant 10,292,269 - Mudakatte , et al. | 2019-05-14 |
Substrate comprising an embedded inductor and a thin film magnetic core
Grant 10,290,414 - Yun , et al. | 2019-05-14 |
Skewed co-spiral inductor structure
Grant 10,283,257 - Kim , et al. | 2019-05-07 |
Integration Of Through Glass Via (tgv) Filter And Acoustic Filter
App 20190132942 - YUN; Changhan Hobie ; et al. | 2019-05-02 |
Stacked substrate inductor
Grant 10,249,580 - Kim , et al. | 2019-04-02 |
Compartment shielding in flip-chip (FC) module
Grant 10,242,957 - Kim , et al. | 2019-03-26 |
Integrated Device Comprising A Capacitor And Inductor Structure Comprising A Shared Interconnect For A Capacitor And An Inductor
App 20190081607 - VELEZ; Mario Francisco ; et al. | 2019-03-14 |
Shaped Circuit Wafers
App 20190035621 - YUN; Changhan Hobie ; et al. | 2019-01-31 |
Tunable matching network
Grant 10,187,031 - Ma , et al. Ja | 2019-01-22 |
RF multiplexer with integrated directional couplers
Grant 10,171,112 - Ma , et al. J | 2019-01-01 |
Interposer device including at least one transistor and at least one through-substrate via
Grant 10,163,771 - Zuo , et al. Dec | 2018-12-25 |
Passive device assembly for accurate ground plane control
Grant 10,154,591 - Zuo , et al. Dec | 2018-12-11 |
Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance
Grant 10,141,908 - Mudakatte , et al. Nov | 2018-11-27 |
Passive components implemented on a plurality of stacked insulators
Grant 10,141,353 - Yun , et al. Nov | 2018-11-27 |
Glass Substrate Including Passive-on-glass Device And Semiconductor Die
App 20180316374 - Yun; Changhan ; et al. | 2018-11-01 |
Integration of a replica circuit and a transformer above a dielectric substrate
Grant 10,116,285 - Lan , et al. October 30, 2 | 2018-10-30 |
Incorporation of passives and fine pitch through via for package on package
Grant 10,115,671 - Shenoy , et al. October 30, 2 | 2018-10-30 |
Double-sided circuit
Grant 10,103,703 - Yun , et al. October 16, 2 | 2018-10-16 |
Open-passivation ball grid array pads
Grant 10,103,116 - Kim , et al. October 16, 2 | 2018-10-16 |
Backside ground plane for integrated circuit
Grant 10,103,135 - Zuo , et al. October 16, 2 | 2018-10-16 |
Wafer level package (WLP) ball support using cavity structure
Grant 10,074,625 - Velez , et al. September 11, 2 | 2018-09-11 |
Encapsulation of acoustic resonator devices
Grant 10,069,474 - Yun , et al. September 4, 2 | 2018-09-04 |
Embedded layered inductor
Grant 10,051,741 - Song , et al. August 14, 2 | 2018-08-14 |
Nested through glass via transformer
Grant 10,049,815 - Kim , et al. August 14, 2 | 2018-08-14 |
Glass substrate including passive-on-glass device and semiconductor die
Grant 10,044,390 - Yun , et al. August 7, 2 | 2018-08-07 |
Two-stage power delivery architecture
Grant 10,039,188 - Yun , et al. July 31, 2 | 2018-07-31 |
Single-chip multi-frequency film bulk acoustic-wave resonators
Grant 10,038,422 - Yun , et al. July 31, 2 | 2018-07-31 |
Apparatus with 3D wirewound inductor integrated within a substrate
Grant 10,026,546 - Yun , et al. July 17, 2 | 2018-07-17 |
Passive Device Assembly For Accurate Ground Plane Control
App 20180177052 - Zuo; Chengjie ; et al. | 2018-06-21 |
Vertical-coupling transformer with an air-gap structure
Grant 10,002,700 - Lan , et al. June 19, 2 | 2018-06-19 |
Hybrid Passive-on-glass (pog) Acoustic Filter
App 20180167054 - BERDY; David Francis ; et al. | 2018-06-14 |
Passive-on-glass (pog) Device And Method
App 20180145062 - Lan; Je-Hsiung Jeffrey ; et al. | 2018-05-24 |
Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications
Grant 9,966,426 - Mudakatte , et al. May 8, 2 | 2018-05-08 |
Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications
Grant 9,959,964 - Yun , et al. May 1, 2 | 2018-05-01 |
Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter
Grant 9,954,267 - Yun , et al. April 24, 2 | 2018-04-24 |
Capacitor with a dielectric between a via and a plate of the capacitor
Grant 9,935,166 - Lan , et al. April 3, 2 | 2018-04-03 |
Backside Ground Plane For Integrated Circuit
App 20180090475 - ZUO; Chengjie ; et al. | 2018-03-29 |
Passive device assembly for accurate ground plane control
Grant 9,930,783 - Zuo , et al. March 27, 2 | 2018-03-27 |
Face-to-face Multiplexer Circuit Layout
App 20180083589 - YUN; Changhan Hobie ; et al. | 2018-03-22 |
Electrode Wrap-around Capacitors For Radio Frequency (rf) Applications
App 20180083588 - YUN; Changhan Hobie ; et al. | 2018-03-22 |
Passives In Thin Film
App 20180077803 - YUN; Changhan Hobie ; et al. | 2018-03-15 |
Single-chip Multi-frequency Film Bulk Acoustic-wave Resonators
App 20180062617 - Yun; Changhan Hobie ; et al. | 2018-03-01 |
LOW PROFILE PASSIVE ON GLASS (PoG) DEVICE COMPRISING A DIE
App 20180061775 - Velez; Mario ; et al. | 2018-03-01 |
Frequency multiplexer
Grant 9,906,318 - Zuo , et al. February 27, 2 | 2018-02-27 |
Multi-density Mim Capacitor For Improved Passive On Glass (pog) Multiplexer Performance
App 20180054177 - MUDAKATTE; Niranjan Sunil ; et al. | 2018-02-22 |
Land Grid Array (lga) Packaging Of Passive-on-glass (pog) Structure
App 20180047660 - ZUO; Chengjie ; et al. | 2018-02-15 |
Semiconductor Assembly And Method Of Making Same
App 20180047687 - KIM; Daeik Daniel ; et al. | 2018-02-15 |
Passive-on-glass (POG) device and method
Grant 9,893,048 - Lan , et al. February 13, 2 | 2018-02-13 |
Interposer Device Including At Least One Transistor And At Least One Through-substrate Via
App 20180040547 - Zuo; Chengjie ; et al. | 2018-02-08 |
Glass Substrate Including Passive-on-glass Device And Semiconductor Die
App 20180026666 - Yun; Changhan ; et al. | 2018-01-25 |
MIM capacitor and method of making the same
Grant 9,875,848 - Berdy , et al. January 23, 2 | 2018-01-23 |
Exposed Side-wall And Lga Assembly
App 20170372989 - KIM; Daeik Daniel ; et al. | 2017-12-28 |
Stacked Substrate Inductor
App 20170373025 - KIM; Daeik Daniel ; et al. | 2017-12-28 |
Inline Kerf Probing Of Passive Devices
App 20170372975 - KIM; Daeik Daniel ; et al. | 2017-12-28 |
Two-dimensional Structure To Form An Embedded Three-dimensional Structure
App 20170372831 - VELEZ; Mario Francisco ; et al. | 2017-12-28 |
Device Comprising A Substrate That Includes An Irradiated Portion On A Surface Of The Substrate
App 20170365570 - Kim; Daeik ; et al. | 2017-12-21 |
Apparatus With 3d Wirewound Inductor Integrated Within A Substrate
App 20170338034 - Yun; Changhan Hobie ; et al. | 2017-11-23 |
Passive Components Implemented On A Plurality Of Stacked Insulators
App 20170338255 - YUN; Changhan Hobie ; et al. | 2017-11-23 |
Double-sided Circuit
App 20170338788 - YUN; Changhan Hobie ; et al. | 2017-11-23 |
Tunable Matching Network
App 20170331445 - Ma; Yunfei ; et al. | 2017-11-16 |
Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods
Grant 9,813,043 - Zuo , et al. November 7, 2 | 2017-11-07 |
Density-optimized module-level inductor ground structure
Grant 9,807,882 - Berdy , et al. October 31, 2 | 2017-10-31 |
Solenoid inductor in a substrate
Grant 9,806,144 - Kim , et al. October 31, 2 | 2017-10-31 |
Side-assembled passive devices
Grant 9,780,048 - Berdy , et al. October 3, 2 | 2017-10-03 |
Passive Device Assembly For Accurate Ground Plane Control
App 20170280562 - Zuo; Chengjie ; et al. | 2017-09-28 |
Rf Multiplexer With Integrated Directional Couplers
App 20170279469 - Ma; Yunfei ; et al. | 2017-09-28 |
High quality factor capacitors and methods for fabricating high quality factor capacitors
Grant 9,773,862 - Yun , et al. September 26, 2 | 2017-09-26 |
Backside Drill Embedded Die Substrate
App 20170271266 - Kim; Daeik ; et al. | 2017-09-21 |
Integrated circuits (ICS) on a glass substrate
Grant 9,768,109 - Gu , et al. September 19, 2 | 2017-09-19 |
Open-passivation Ball Grid Array Pads
App 20170221846 - KIM; Daeik Daniel ; et al. | 2017-08-03 |
Backside coupled symmetric varactor structure
Grant 9,721,946 - Kim , et al. August 1, 2 | 2017-08-01 |
Skewed Co-spiral Inductor Structure
App 20170200550 - KIM; Daeik Daniel ; et al. | 2017-07-13 |
Multiplexer Design Using A 2d Passive On Glass Filter Integrated With A 3d Through Glass Via Filter
App 20170187345 - YUN; Changhan Hobie ; et al. | 2017-06-29 |
Three-dimensional wire bond inductor
Grant 9,692,386 - Zuo , et al. June 27, 2 | 2017-06-27 |
Mim Capacitor And Method Of Making The Same
App 20170178810 - BERDY; David Francis ; et al. | 2017-06-22 |
Rotary device and electronic device having the same
Grant 9,684,335 - Kim , et al. June 20, 2 | 2017-06-20 |
Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuits
Grant 9,673,275 - Kim , et al. June 6, 2 | 2017-06-06 |
Superposed structure 3D orthogonal through substrate inductor
Grant 9,666,362 - Berdy , et al. May 30, 2 | 2017-05-30 |
Thin Film Magnet Inductor Structure For High Quality (q)-factor Radio Frequency (rf) Applications
App 20170140862 - YUN; Changhan Hobie ; et al. | 2017-05-18 |
Acoustic Resonator Devices
App 20170141756 - Yun; Changhan Hobie ; et al. | 2017-05-18 |
Integration Of A Replica Circuit And A Transformer Above A Dielectric Substrate
App 20170134007 - Lan; Je-Hsiung ; et al. | 2017-05-11 |
Metal-insulator-metal (mim) Array For Integrated Radio Frequency (rf) Filter
App 20170133996 - Kim; Daeik Daniel ; et al. | 2017-05-11 |
Solenoid Inductor
App 20170133148 - VELEZ; Mario Francisco ; et al. | 2017-05-11 |
High Quality Factor Capacitors And Methods For Fabricating High Quality Factor Capacitors
App 20170125512 - YUN; Changhan Hobie ; et al. | 2017-05-04 |
Isolated Complementary Metal-oxide Semiconductor (cmos) Devices For Radio-frequency (rf) Circuits
App 20170117358 - Kim; Daeik Daniel ; et al. | 2017-04-27 |
Integration of a replica circuit and a transformer above a dielectric substrate
Grant 9,634,645 - Lan , et al. April 25, 2 | 2017-04-25 |
Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods
Grant 9,634,640 - Zuo , et al. April 25, 2 | 2017-04-25 |
High Performance Inductors
App 20170110237 - KIM; Daeik Daniel ; et al. | 2017-04-20 |
Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)
Grant 9,620,463 - Kim , et al. April 11, 2 | 2017-04-11 |
Integrated Circuits (ics) On A Glass Substrate
App 20170098663 - Gu; Shiqun ; et al. | 2017-04-06 |
Wafer Level Package (wlp) Ball Support Using Cavity Structure
App 20170084565 - VELEZ; Mario Francisco ; et al. | 2017-03-23 |
On-package Connector
App 20170084523 - FU; Jie ; et al. | 2017-03-23 |
Integrated Circuits (ics) On A Glass Substrate
App 20170084531 - Gu; Shiqun ; et al. | 2017-03-23 |
Substrate-transferred, Deep Trench Isolation Silicon-on-insulator (soi) Semiconductor Devices Formed From Bulk Semiconductor Wafers
App 20170084628 - Kim; Daeik Daniel ; et al. | 2017-03-23 |
Dual mode transistor
Grant 9,601,607 - Li , et al. March 21, 2 | 2017-03-21 |
Augmented Capacitor Structure For High Quality (q)-factor Radio Frequency (rf) Applications
App 20170077214 - MUDAKATTE; Niranjan Sunil ; et al. | 2017-03-16 |
Backside Coupled Symmetric Varactor Structure
App 20170077093 - KIM; Daeik Daniel ; et al. | 2017-03-16 |
Passive-on-glass (pog) Device And Method
App 20170077079 - Lan; Je-Hsiung Jeffrey ; et al. | 2017-03-16 |
Substrate Comprising An Embedded Inductor And A Thin Film Magnetic Core
App 20170062120 - Yun; Changhan Hobie ; et al. | 2017-03-02 |
Tunable Cavity Resonator
App 20170033429 - Berdy; David Francis ; et al. | 2017-02-02 |
Devices and methods to reduce stress in an electronic device
Grant 9,560,745 - Kim , et al. January 31, 2 | 2017-01-31 |
Electronic device including flexible display
Grant 9,557,771 - Park , et al. January 31, 2 | 2017-01-31 |
Method, system and program product for deploying and allocating an autonomic sensor network ecosystem
Grant 9,552,262 - Amanuddin , et al. January 24, 2 | 2017-01-24 |
High quality factor capacitors and methods for fabricating high quality factor capacitors
Grant 9,548,350 - Yun , et al. January 17, 2 | 2017-01-17 |
Face-up Substrate Integration With Solder Ball Connection In Semiconductor Package
App 20160381809 - KIM; Daeik Daniel ; et al. | 2016-12-29 |
Head-mounted display apparatus
Grant 9,529,194 - Yoo , et al. December 27, 2 | 2016-12-27 |
Varying Thickness Inductor
App 20160358709 - Kim; Daeik Daniel ; et al. | 2016-12-08 |
Backside coupled symmetric varactor structure
Grant 9,502,586 - Kim , et al. November 22, 2 | 2016-11-22 |
Stacked CMOS chipset having an insulating layer and a secondary layer and method of forming same
Grant 9,496,255 - Zuo , et al. November 15, 2 | 2016-11-15 |
Vertical spiral inductor
Grant 9,478,348 - Kim , et al. October 25, 2 | 2016-10-25 |
Face-up substrate integration with solder ball connection in semiconductor package
Grant 9,468,098 - Kim , et al. October 11, 2 | 2016-10-11 |
Silicon-on-insulator (soi) Wafers Employing Molded Substrates To Improve Insulation And Reduce Current Leakage
App 20160293477 - Kim; Daeik Daniel ; et al. | 2016-10-06 |
Asymmetric unbalanced acoustically coupled resonators for spurious mode suppression
Grant 9,461,614 - Yun , et al. October 4, 2 | 2016-10-04 |
3d Pillar Inductor
App 20160284789 - ZUO; Chengjie ; et al. | 2016-09-29 |
Nested Through Glass Via Transformer
App 20160276101 - KIM; Daeik Daniel ; et al. | 2016-09-22 |
Varying thickness inductor
Grant 9,449,753 - Kim , et al. September 20, 2 | 2016-09-20 |
Compartment Shielding In Flip-chip (fc) Module
App 20160254236 - KIM; Daeik Daniel ; et al. | 2016-09-01 |
Radio-frequency (rf) Shielding In Fan-out Wafer Level Package (fowlp)
App 20160254237 - KIM; Daeik Daniel ; et al. | 2016-09-01 |
Metal-semiconductor wafer bonding for high-Q devices
Grant 9,431,510 - Yun , et al. August 30, 2 | 2016-08-30 |
Hybrid transformer structure on semiconductor devices
Grant 9,431,473 - Lo , et al. August 30, 2 | 2016-08-30 |
Three Dimensional (3d) Antenna Structure
App 20160248149 - Kim; Daeik Daniel ; et al. | 2016-08-25 |
High pass filters and low pass filters using through glass via technology
Grant 9,425,761 - Zuo , et al. August 23, 2 | 2016-08-23 |
Composite piezoelectric laterally vibrating resonator
Grant 9,406,865 - Zuo , et al. August 2, 2 | 2016-08-02 |
Tunable Diplexers In Three-dimensional (3d) Integrated Circuits (ic) (3dic) And Related Components And Methods
App 20160204758 - Zuo; Chengjie ; et al. | 2016-07-14 |
Nested through glass via transformer
Grant 9,384,883 - Kim , et al. July 5, 2 | 2016-07-05 |
Resonator with a staggered electrode configuration
Grant 9,379,686 - Yun , et al. June 28, 2 | 2016-06-28 |
Radio frequency switch for diversity receiver
Grant 9,379,802 - Zuo , et al. June 28, 2 | 2016-06-28 |
Metal-insulator-metal (mim) Capacitors Arranged In A Pattern To Reduce Inductance, And Related Methods
App 20160181233 - Yun; Changhan Hobie ; et al. | 2016-06-23 |
Low package parasitic inductance using a thru-substrate interposer
Grant 9,370,103 - Yun , et al. June 14, 2 | 2016-06-14 |
Package on package (PoP) integrated device comprising a capacitor in a substrate
Grant 9,368,566 - Lee , et al. June 14, 2 | 2016-06-14 |
3D pillar inductor
Grant 9,368,564 - Zuo , et al. June 14, 2 | 2016-06-14 |
Superposed Structure 3d Orthogonal Through Substrate Inductor
App 20160163450 - BERDY; David Francis ; et al. | 2016-06-09 |
Three-dimensional multilayer solenoid transformer
Grant 9,363,902 - Lo , et al. June 7, 2 | 2016-06-07 |
Integrated passive device (IPD) on substrate
Grant 9,362,218 - Kim , et al. June 7, 2 | 2016-06-07 |
Stress compensation patterning
Grant 9,355,967 - Kim , et al. May 31, 2 | 2016-05-31 |
Thick conductive stack plating process with fine critical dimension feature size for compact passive on glass technology
Grant 9,343,399 - Lan , et al. May 17, 2 | 2016-05-17 |
Stress mitigation structure for wafer warpage reduction
Grant 9,343,403 - Lan , et al. May 17, 2 | 2016-05-17 |
Selective tuning of acoustic devices
Grant 9,337,799 - Stephanou , et al. May 10, 2 | 2016-05-10 |
Composite dilation mode resonators
Grant 9,331,666 - Zuo , et al. May 3, 2 | 2016-05-03 |
Toroid inductor in an integrated device
Grant 9,324,779 - Song , et al. April 26, 2 | 2016-04-26 |
Varactor Device With Backside Contact
App 20160093750 - Kim; Daeik Daniel ; et al. | 2016-03-31 |
Devices And Methods To Reduce Stress In An Electronic Device
App 20160095208 - Kim; Daeik Daniel ; et al. | 2016-03-31 |
Rotary Device And Electronic Device Having The Same
App 20160060926 - KIM; Jonghae ; et al. | 2016-03-03 |
Cross-sectional dilation mode resonators and resonator-based ladder filters
Grant 9,270,254 - Zuo , et al. February 23, 2 | 2016-02-23 |
Load balancing scheme in multiple channel DRAM systems
Grant 9,268,720 - Wang , et al. February 23, 2 | 2016-02-23 |
Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods
Grant 9,264,013 - Zuo , et al. February 16, 2 | 2016-02-16 |
Selective fabrication of high-capacitance insulator for a metal-oxide-metal capacitor
Grant 9,245,881 - Kang , et al. January 26, 2 | 2016-01-26 |
Superposed Structure 3d Orthogonal Through Substrate Inductor
App 20160020013 - BERDY; David Francis ; et al. | 2016-01-21 |
PACKAGE ON PACKAGE (PoP) INTEGRATED DEVICE COMPRISING A CAPACITOR IN A SUBSTRATE
App 20160020193 - Lee; Jong-Hoon ; et al. | 2016-01-21 |
Vertical Spiral Inductor
App 20150371751 - KIM; Daeik Daniel ; et al. | 2015-12-24 |
Electronic Device Including Flexible Display
App 20150366089 - PARK; Jihoon ; et al. | 2015-12-17 |
Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package
Grant 9,202,789 - Kim , et al. December 1, 2 | 2015-12-01 |
Diplexer design using through glass via technology
Grant 9,203,373 - Zuo , et al. December 1, 2 | 2015-12-01 |
Two-stage Power Delivery Architecture
App 20150334847 - Yun; Changhan ; et al. | 2015-11-19 |
Adaptive real-time power and performance optimization of multi-core processors
Grant 9,189,057 - Kim , et al. November 17, 2 | 2015-11-17 |
Frequency Multiplexer
App 20150304059 - Zuo; Chengjie ; et al. | 2015-10-22 |
Die Package Comprising Die-to-wire Connector And A Wire-to-die Connector Configured To Couple To A Die Package
App 20150303148 - Kim; Daeik Daniel ; et al. | 2015-10-22 |
Stress Mitigation Structure For Wafer Warpage Reduction
App 20150287677 - LAN; Je-Hsiung Jeffrey ; et al. | 2015-10-08 |
3d Pillar Inductor
App 20150279920 - ZUO; Chengjie ; et al. | 2015-10-01 |
Face-up Substrate Integration With Solder Ball Connection In Semiconductor Package
App 20150271920 - KIM; Daeik Daniel ; et al. | 2015-09-24 |
Compact 3-D coplanar transmission lines
Grant 9,136,574 - Kim , et al. September 15, 2 | 2015-09-15 |
Resonator With A Staggered Electrode Configuration
App 20150256143 - YUN; Changhan Hobie ; et al. | 2015-09-10 |
Multi-frequency reconfigurable voltage controlled oscillator (VCO) and method of providing same
Grant 9,130,505 - Zuo , et al. September 8, 2 | 2015-09-08 |
Low-profile Package With Passive Device
App 20150237732 - Velez; Mario Francisco ; et al. | 2015-08-20 |
High Quality Factor Capacitors And Methods For Fabricating High Quality Factor Capacitors
App 20150228712 - YUN; Changhan Hobie ; et al. | 2015-08-13 |
Cross-sectional dilation mode resonators
Grant 9,099,986 - Zuo , et al. August 4, 2 | 2015-08-04 |
Two-stage power delivery architecture
Grant 9,101,068 - Yun , et al. August 4, 2 | 2015-08-04 |
Radio Frequency Switch For Diversity Receiver
App 20150215026 - Zuo; Chengjie ; et al. | 2015-07-30 |
Stacked Conductive Interconnect Inductor
App 20150201495 - KIM; Daeik Daniel ; et al. | 2015-07-16 |
Nested Through Glass Via Transformer
App 20150200049 - KIM; Daeik Daniel ; et al. | 2015-07-16 |
Lateral Metal Insulator Metal (mim) Capacitor With High-q And Reduced Area
App 20150200245 - YUN; Changhan Hobie ; et al. | 2015-07-16 |
Electromechanical systems piezoelectric contour mode differential resonators and filters
Grant 9,083,300 - Lo , et al. July 14, 2 | 2015-07-14 |
Three-dimensional Wire Bond Inductor
App 20150180437 - Zuo; Chengjie ; et al. | 2015-06-25 |
Dual Mode Transistor
App 20150145592 - Li; Xia ; et al. | 2015-05-28 |
Head-mounted Display Apparatus
App 20150138645 - YOO; Chungkeun ; et al. | 2015-05-21 |
Multi Spiral Inductor
App 20150130579 - Kim; Daeik Daniel ; et al. | 2015-05-14 |
Solonoid Inductor In A Substrate
App 20150130021 - Kim; Daeik Daniel ; et al. | 2015-05-14 |
Embedded Layered Inductor
App 20150124418 - Song; Young Kyu ; et al. | 2015-05-07 |
Metal-semiconductor Wafer Bonding For High-q Devices
App 20150118819 - YUN; Changhan Hobie ; et al. | 2015-04-30 |
Asymmetric Unbalanced Acoustically Coupled Resonators For Spurious Mode Suppression
App 20150115777 - YUN; Changhan Hobie ; et al. | 2015-04-30 |
Toroid Inductor In An Integrated Device
App 20150115403 - Song; Young Kyu ; et al. | 2015-04-30 |
Location tracking of mobile phone using GPS function
Grant 9,020,530 - Kim , et al. April 28, 2 | 2015-04-28 |
Circuit structure and method of fabrication for facilitating radio frequency identification (RFID)
Grant 9,013,310 - Cho , et al. April 21, 2 | 2015-04-21 |
Radio frequency switch for diversity receiver
Grant 9,008,602 - Zuo , et al. April 14, 2 | 2015-04-14 |
Complex passive design with special via implementation
Grant 9,001,031 - Lo , et al. April 7, 2 | 2015-04-07 |
Connector Placement For A Substrate Integrated With A Toroidal Inductor
App 20150092314 - Kim; Daeik Daniel ; et al. | 2015-04-02 |
Method and apparatus for providing through silicon via (TSV) redundancy
Grant 8,988,130 - Kim , et al. March 24, 2 | 2015-03-24 |
Piezoelectric resonator having combined thickness and width vibrational modes
Grant 8,987,976 - Zuo , et al. March 24, 2 | 2015-03-24 |
Low Package Parasitic Inductance Using A Thru-substrate Interposer
App 20150070863 - YUN; Changhan Hobie ; et al. | 2015-03-12 |
Varying Thickness Inductor
App 20150061813 - Kim; Daeik Daniel ; et al. | 2015-03-05 |
Integrated passives and power amplifier
Grant 8,970,516 - Black , et al. March 3, 2 | 2015-03-03 |
Integrated Passive Device (ipd) On Subtrate
App 20150048480 - Kim; Daeik Daniel ; et al. | 2015-02-19 |
Inductive Device That Includes Conductive Via And Metal Layer
App 20150035162 - Lan; Je-Hsiung ; et al. | 2015-02-05 |
Striped on-chip inductor
Grant 8,937,355 - Cho , et al. January 20, 2 | 2015-01-20 |
Thick Conductive Stack Plating Process With Fine Critical Dimension Feature Size For Compact Passive On Glass Technology
App 20150014812 - LAN; Je-Hsiung ; et al. | 2015-01-15 |
Stress Compensation Patterning
App 20140374914 - Kim; Daeik D. ; et al. | 2014-12-25 |
Compact 3-d Coplanar Transmission Lines
App 20140361854 - Kim; Daeik Daniel ; et al. | 2014-12-11 |
Metal-semiconductor wafer bonding for high-Q devices
Grant 8,907,450 - Yun , et al. December 9, 2 | 2014-12-09 |
Systems For Reducing Magnetic Coupling In Integrated Circuits (ics), And Related Components And Methods
App 20140354372 - Zuo; Chengjie ; et al. | 2014-12-04 |
Design For High Pass Filters And Low Pass Filters Using Through Glass Via Technology
App 20140354378 - ZUO; Chengjie ; et al. | 2014-12-04 |
High breakdown voltage embedded MIM capacitor structure
Grant 8,889,522 - Kang , et al. November 18, 2 | 2014-11-18 |
Inductor Tunable By A Variable Magnetic Flux Density Component
App 20140327508 - Kim; Daeik D. ; et al. | 2014-11-06 |
Electronic Device Having Asymmetrical Through Glass Vias
App 20140327510 - Kim; Daeik D. ; et al. | 2014-11-06 |
Tunable Diplexers In Three-dimensional (3d) Integrated Circuits (ic) (3dic) And Related Components And Methods
App 20140327496 - Zuo; Chengjie ; et al. | 2014-11-06 |
Three-dimensional Multilayer Solenoid Transformer
App 20140322435 - Lo; Chi Shun ; et al. | 2014-10-30 |
Two-stage Power Delivery Architecture
App 20140268615 - Yun; Changhan ; et al. | 2014-09-18 |
Integration Of A Replica Circuit And A Transformer Above A Dielectric Substrate
App 20140266494 - Lan; Je-Hsiung ; et al. | 2014-09-18 |
Capacitor With A Dielectric Between A Via And A Plate Of The Capacitor
App 20140268616 - Lan; Je-Hsiung ; et al. | 2014-09-18 |
High Density, Low Loss 3-d Through-glass Inductor With Magnetic Core
App 20140247269 - Berdy; David Francis ; et al. | 2014-09-04 |
Vertical-coupling Transformer With An Air-gap Structure
App 20140240072 - Lan; Je-Hsiung ; et al. | 2014-08-28 |
Piezoelectric laterally vibrating resonator structure geometries for spurious frequency suppression
Grant 8,816,567 - Zuo , et al. August 26, 2 | 2014-08-26 |
Method, System And Program Product For Deploying And Allocating An Autonomic Sensor Network Ecosystem
App 20140229759 - Amanuddin; Riz S. ; et al. | 2014-08-14 |
Three-dimensional multilayer solenoid transformer
Grant 8,803,648 - Lo , et al. August 12, 2 | 2014-08-12 |
Transformer Signal Coupling For Flip-chip Integration
App 20140206105 - Kim; Jonghae ; et al. | 2014-07-24 |
Diplexer Design Using Through Glass Via Technology
App 20140197902 - Zuo; Chengjie ; et al. | 2014-07-17 |
Low Parasitic Package Substrate Having Embedded Passive Substrate Discrete Components And Method For Making Same
App 20140167273 - Kim; Jonghae ; et al. | 2014-06-19 |
Hybrid Transformer Structure On Semiconductor Devices
App 20140138792 - Lo; Chi Shun ; et al. | 2014-05-22 |
Acoustic wave and radio frequency identification device and method
Grant 8,723,646 - Cho , et al. May 13, 2 | 2014-05-13 |
Selective Tuning Of Acoustic Devices
App 20140125432 - Stephanou; Philip Jason ; et al. | 2014-05-08 |
Transformer signal coupling for flip-chip integration
Grant 8,717,118 - Kim , et al. May 6, 2 | 2014-05-06 |
Composite Dilation Mode Resonators
App 20140111064 - Zuo; Chengjie ; et al. | 2014-04-24 |
Widening resonator bandwidth using mechanical loading
Grant 8,704,428 - Yun , et al. April 22, 2 | 2014-04-22 |
High Breakdown Voltage Embedded Mim Capacitor Structure
App 20140065792 - Kang; Woo Tag ; et al. | 2014-03-06 |
Multi-mode Bandpass Filter
App 20140055214 - Joo; Sanghoon ; et al. | 2014-02-27 |
Hybrid Filter Including Lc- And Mems-based Resonators
App 20140035702 - Black; Justin Phelps ; et al. | 2014-02-06 |
Passives Via Bar
App 20140035935 - Shenoy; Ravindra V. ; et al. | 2014-02-06 |
Incorporation Of Passives And Fine Pitch Through Via For Package On Package
App 20140035892 - Shenoy; Ravindra V. ; et al. | 2014-02-06 |
Complex Passive Design With Special Via Implementation
App 20140028543 - Lo; Chi Shun ; et al. | 2014-01-30 |
Adaptive Real-time Power And Performance Optimization Of Multi-core Processors
App 20140025972 - Kim; Daeik ; et al. | 2014-01-23 |
Method and apparatus for load-based prefetch access
Grant 8,627,021 - Wang , et al. January 7, 2 | 2014-01-07 |
Apparatus and method for through silicon via impedance matching
Grant 08618629 - | 2013-12-31 |
Apparatus and method for through silicon via impedance matching
Grant 8,618,629 - Kim , et al. December 31, 2 | 2013-12-31 |
High breakdown voltage embedded MIM capacitor structure
Grant 8,604,586 - Kang , et al. December 10, 2 | 2013-12-10 |
Radio Frequency Switch For Diversity Receiver
App 20130295866 - Zuo; Chengjie ; et al. | 2013-11-07 |
Three-dimensional Multilayer Solenoid Transformer
App 20130293336 - Lo; Chi Shun ; et al. | 2013-11-07 |
High Quality Factor Planar Inductors
App 20130293337 - Lo; Chi Shun ; et al. | 2013-11-07 |
Apparatus, method and program product for adaptive real-time power and perfomance optimization of multi-core processors
Grant 8,578,193 - Kim , et al. November 5, 2 | 2013-11-05 |
Piezoelectric Resonator With Airgap
App 20130235001 - YUN; Changhan Hobie ; et al. | 2013-09-12 |
Mutually Coupled Matching Network
App 20130222060 - Lo; Chi Shun ; et al. | 2013-08-29 |
Method and system for manufacturing whole soy milk
Grant 8,518,464 - Kim , et al. August 27, 2 | 2013-08-27 |
Composite Piezoelectric Laterally Vibrating Resonator
App 20130214643 - Zuo; Chengjie ; et al. | 2013-08-22 |
Three dimensional inductor, transformer and radio frequency amplifier
Grant 8,508,301 - Kim , et al. August 13, 2 | 2013-08-13 |
High density metal-insulator-metal trench capacitor
Grant 8,492,874 - Lan , et al. July 23, 2 | 2013-07-23 |
Electromechanical systems oscillator with piezoelectric contour mode resonator for multiple frequency generation
Grant 8,471,643 - Kim , et al. June 25, 2 | 2013-06-25 |
Passive coupler between package substrate and system board
Grant 8,451,581 - Chandrasekaran , et al. May 28, 2 | 2013-05-28 |
Semiconductor die-based packaging interconnect
Grant 8,391,018 - Chandrasekaran , et al. March 5, 2 | 2013-03-05 |
Through via inductor or transformer in a high-resistance substrate with programmability
Grant 8,384,507 - Li , et al. February 26, 2 | 2013-02-26 |
Accessing a multi-channel memory system having non-uniform page sizes
Grant 8,375,173 - Wang , et al. February 12, 2 | 2013-02-12 |
Forming radio frequency integrated circuits
Grant 8,362,599 - Kim , et al. January 29, 2 | 2013-01-29 |
Partitioning a crossbar interconnect in a multi-channel memory system
Grant 8,359,421 - Wang , et al. January 22, 2 | 2013-01-22 |
Techniques for placement of active and passive devices within a chip
Grant 8,350,358 - Kim , et al. January 8, 2 | 2013-01-08 |
Transformer signal coupling for flip-chip integration
Grant 8,350,639 - Kim , et al. January 8, 2 | 2013-01-08 |
Techniques for placement of active and passive devices within a chip
Grant 8,324,066 - Kim , et al. December 4, 2 | 2012-12-04 |
Circuit structures and methods with BEOL layers configured to block electromagnetic edge interference
Grant 8,273,648 - Cho , et al. September 25, 2 | 2012-09-25 |
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