loadpatents
name:-0.037103891372681
name:-0.02814793586731
name:-0.0096158981323242
Kim; Jong Mun Patent Filings

Kim; Jong Mun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Jong Mun.The latest application filed is for "spin-orbit torque mram structure and manufacture thereof".

Company Profile
9.25.43
  • Kim; Jong Mun - San Jose CA
  • Kim; Jong Mun - Sunnyvale CA
  • Kim; Jong-Mun - Chungcheongbuk-do KR
  • Kim; Jong Mun - Seoul KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Carbon layer covered mask in 3D applications
Grant 11,384,428 - Ling , et al. July 12, 2
2022-07-12
Damage free metal conductor formation
Grant 11,289,342 - Ren , et al. March 29, 2
2022-03-29
Spin-orbit Torque Mram Structure And Manufacture Thereof
App 20210351342 - YUI; Minrui ;   et al.
2021-11-11
Methods for etching a structure for MRAM applications
Grant 11,145,808 - Kim , et al. October 12, 2
2021-10-12
Magnetic Memory And Method Of Fabrication
App 20210234091 - Kim; Jong Mun ;   et al.
2021-07-29
Methods for etching a structure for MRAM Applications
App 20210143323 - KIM; Jong Mun ;   et al.
2021-05-13
Residual removal
Grant 10,964,527 - Kim , et al. March 30, 2
2021-03-30
Method of etching copper indium gallium selenide (CIGS) material
Grant 10,957,548 - Ling , et al. March 23, 2
2021-03-23
Carbon Layer Covered Mask In 3d Applications
App 20210017641 - LING; Mang-Mang ;   et al.
2021-01-21
Damage Free Metal Conductor Formation
App 20200350178 - Ren; He ;   et al.
2020-11-05
Methods of patterning nickel silicide layers on a semiconductor device
Grant 10,692,734 - Kim , et al.
2020-06-23
Damage free metal conductor formation
Grant 10,685,849 - Ren , et al.
2020-06-16
Method Of Etching Copper Indium Gallium Selenide (cigs) Material
App 20200152470 - LING; MANG-MANG ;   et al.
2020-05-14
Silicon dioxide-polysilicon multi-layered stack etching with plasma etch chamber employing non-corrosive etchants
Grant 10,643,854 - Shimizu , et al.
2020-05-05
Methods Of Patterning Nickel Silicide Layers On A Semiconductor Device
App 20200135492 - KIM; JONG MUN ;   et al.
2020-04-30
Residual Removal
App 20190393024 - KIM; Jong Mun ;   et al.
2019-12-26
Recursive Pumping For Symmetrical Gas Exhaust To Control Critical Dimension Uniformity In Plasma Reactors
App 20180142354 - SHOJI; Sergio Fukuda ;   et al.
2018-05-24
Recursive pumping for symmetrical gas exhaust to control critical dimension uniformity in plasma reactors
Grant 9,909,213 - Shoji , et al. March 6, 2
2018-03-06
Etching oxide-nitride stacks using C.sub.4F.sub.6H.sub.2
Grant 9,748,366 - Kim , et al. August 29, 2
2017-08-29
Maintaining mask integrity to form openings in wafers
Grant 9,589,832 - Shimizu , et al. March 7, 2
2017-03-07
Plasma etch processes for opening mask layers
Grant 9,305,804 - Kim , et al. April 5, 2
2016-04-05
Silicon dioxide-polysilicon multi-layered stack etching with plasma etch chamber employing non-corrosive etchants
Grant 9,299,574 - Shimizu , et al. March 29, 2
2016-03-29
Silicon Dioxide-polysilicon Multi-layered Stack Etching With Plasma Etch Chamber Employing Non-corrosive Etchants
App 20160086771 - Shimizu; Daisuke ;   et al.
2016-03-24
Methods for etching materials using synchronized RF pulses
Grant 9,269,587 - Shimizu , et al. February 23, 2
2016-02-23
Boron-doped carbon-based hardmask etch processing
Grant 9,129,911 - Doan , et al. September 8, 2
2015-09-08
Etching Oxide-nitride Stacks Using C4f6h2
App 20150097276 - Kim; Jong Mun ;   et al.
2015-04-09
Plasma Etch Processes For Opening Mask Layers
App 20150099367 - KIM; Jong Mun ;   et al.
2015-04-09
Methods For Etching Materials Using Synchronized Rf Pulses
App 20150072530 - KIM; Jong Mun ;   et al.
2015-03-12
Recursive Pumping For Symmetrical Gas Exhaust To Control Critical Dimension Uniformity In Plasma Reactors
App 20150041061 - SHOJI; Sergio Fukuda ;   et al.
2015-02-12
Process Kit For Edge Critical Dimension Uniformity Control
App 20150001180 - DOAN; Kenny Linh ;   et al.
2015-01-01
Etch Process Having Adaptive Control With Etch Depth Of Pressure And Power
App 20140342570 - Doan; Kenny Linh ;   et al.
2014-11-20
Boron-doped Carbon-based Hardmask Etch Processing
App 20140213059 - Doan; Kenny Linh ;   et al.
2014-07-31
Silicon Dioxide-polysilicon Multi-layered Stack Etching With Plasma Etch Chamber Employing Non-corrosive Etchants
App 20140213062 - SHIMIZU; Daisuke ;   et al.
2014-07-31
Plasma etch processes for boron-doped carbonaceous mask layers
Grant 8,778,207 - Kim , et al. July 15, 2
2014-07-15
Method for etching substrate
Grant 8,668,837 - Doan , et al. March 11, 2
2014-03-11
Maintaining Mask Integrity To Form Openings In Wafers
App 20140065824 - Shimizu; Daisuke ;   et al.
2014-03-06
Rotational Clap Suction/pressure Device
App 20140056747 - Kim; Jong-Mun
2014-02-27
Maintaining mask integrity to form openings in wafers
Grant 8,603,921 - Shimizu , et al. December 10, 2
2013-12-10
Methods For Etching Oxide Layers Using Process Gas Pulsing
App 20130224960 - Payyapilly; Jairaj ;   et al.
2013-08-29
Methods Of Polymers Deposition For Forming Reduced Critical Dimensions
App 20130122707 - Shimizu; Daisuke ;   et al.
2013-05-16
Method Of Etching High Aspect Ratio Features In A Dielectric Layer
App 20130122712 - KIM; Jong Mun ;   et al.
2013-05-16
Plasma Etch Processes For Boron-doped Carbonaceous Mask Layers
App 20130109188 - KIM; Jong Mun ;   et al.
2013-05-02
Method For Etching Substrate
App 20130092656 - Doan; Kenny Linh ;   et al.
2013-04-18
Maintaining Mask Integrity To Form Openings In Wafers
App 20130029484 - Shimizu; Daisuke ;   et al.
2013-01-31
Plasma etch reactor with distribution of etch gases across a wafer surface and a polymer oxidizing gas in an independently fed center gas zone
Grant 8,187,415 - Kim , et al. May 29, 2
2012-05-29
Halogen-free amorphous carbon mask etch having high selectivity to photoresist
Grant 7,807,064 - Kim , et al. October 5, 2
2010-10-05
Process Kit Having Reduced Erosion Sensitivity
App 20100101729 - KIM; JONG MUN ;   et al.
2010-04-29
Method of controlling sidewall profile by using intermittent, periodic introduction of cleaning species into the main plasma etching species
App 20080286979 - Shin; Taeho ;   et al.
2008-11-20
Halogen-free Amorphous Carbon Mask Etch Having High Selectivity To Photoresist
App 20080230511 - Kim; Jong Mun ;   et al.
2008-09-25
Plasma etch reactor with distribution of etch gases across a wafer surface and a polymer oxidizing gas in an independently fed center gas zone
App 20070247075 - Kim; Jong Mun ;   et al.
2007-10-25
Plasma etch process using etch uniformity control by using compositionally independent gas feed
App 20070249173 - Kim; Jong Mun ;   et al.
2007-10-25
Method of controlling silicon-containing polymer build up during etching by using a periodic cleaning step
App 20070243714 - Shin; Taeho ;   et al.
2007-10-18
Pharmacologically active isolated or purified dauer pheromone compound for controlling aging and stress and method for isolating and characterizing the same
Grant 7,119,213 - Paik , et al. October 10, 2
2006-10-10

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