Patent | Date |
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Carbon layer covered mask in 3D applications Grant 11,384,428 - Ling , et al. July 12, 2 | 2022-07-12 |
Damage free metal conductor formation Grant 11,289,342 - Ren , et al. March 29, 2 | 2022-03-29 |
Spin-orbit Torque Mram Structure And Manufacture Thereof App 20210351342 - YUI; Minrui ;   et al. | 2021-11-11 |
Methods for etching a structure for MRAM applications Grant 11,145,808 - Kim , et al. October 12, 2 | 2021-10-12 |
Magnetic Memory And Method Of Fabrication App 20210234091 - Kim; Jong Mun ;   et al. | 2021-07-29 |
Methods for etching a structure for MRAM Applications App 20210143323 - KIM; Jong Mun ;   et al. | 2021-05-13 |
Residual removal Grant 10,964,527 - Kim , et al. March 30, 2 | 2021-03-30 |
Method of etching copper indium gallium selenide (CIGS) material Grant 10,957,548 - Ling , et al. March 23, 2 | 2021-03-23 |
Carbon Layer Covered Mask In 3d Applications App 20210017641 - LING; Mang-Mang ;   et al. | 2021-01-21 |
Damage Free Metal Conductor Formation App 20200350178 - Ren; He ;   et al. | 2020-11-05 |
Methods of patterning nickel silicide layers on a semiconductor device Grant 10,692,734 - Kim , et al. | 2020-06-23 |
Damage free metal conductor formation Grant 10,685,849 - Ren , et al. | 2020-06-16 |
Method Of Etching Copper Indium Gallium Selenide (cigs) Material App 20200152470 - LING; MANG-MANG ;   et al. | 2020-05-14 |
Silicon dioxide-polysilicon multi-layered stack etching with plasma etch chamber employing non-corrosive etchants Grant 10,643,854 - Shimizu , et al. | 2020-05-05 |
Methods Of Patterning Nickel Silicide Layers On A Semiconductor Device App 20200135492 - KIM; JONG MUN ;   et al. | 2020-04-30 |
Residual Removal App 20190393024 - KIM; Jong Mun ;   et al. | 2019-12-26 |
Recursive Pumping For Symmetrical Gas Exhaust To Control Critical Dimension Uniformity In Plasma Reactors App 20180142354 - SHOJI; Sergio Fukuda ;   et al. | 2018-05-24 |
Recursive pumping for symmetrical gas exhaust to control critical dimension uniformity in plasma reactors Grant 9,909,213 - Shoji , et al. March 6, 2 | 2018-03-06 |
Etching oxide-nitride stacks using C.sub.4F.sub.6H.sub.2 Grant 9,748,366 - Kim , et al. August 29, 2 | 2017-08-29 |
Maintaining mask integrity to form openings in wafers Grant 9,589,832 - Shimizu , et al. March 7, 2 | 2017-03-07 |
Plasma etch processes for opening mask layers Grant 9,305,804 - Kim , et al. April 5, 2 | 2016-04-05 |
Silicon dioxide-polysilicon multi-layered stack etching with plasma etch chamber employing non-corrosive etchants Grant 9,299,574 - Shimizu , et al. March 29, 2 | 2016-03-29 |
Silicon Dioxide-polysilicon Multi-layered Stack Etching With Plasma Etch Chamber Employing Non-corrosive Etchants App 20160086771 - Shimizu; Daisuke ;   et al. | 2016-03-24 |
Methods for etching materials using synchronized RF pulses Grant 9,269,587 - Shimizu , et al. February 23, 2 | 2016-02-23 |
Boron-doped carbon-based hardmask etch processing Grant 9,129,911 - Doan , et al. September 8, 2 | 2015-09-08 |
Etching Oxide-nitride Stacks Using C4f6h2 App 20150097276 - Kim; Jong Mun ;   et al. | 2015-04-09 |
Plasma Etch Processes For Opening Mask Layers App 20150099367 - KIM; Jong Mun ;   et al. | 2015-04-09 |
Methods For Etching Materials Using Synchronized Rf Pulses App 20150072530 - KIM; Jong Mun ;   et al. | 2015-03-12 |
Recursive Pumping For Symmetrical Gas Exhaust To Control Critical Dimension Uniformity In Plasma Reactors App 20150041061 - SHOJI; Sergio Fukuda ;   et al. | 2015-02-12 |
Process Kit For Edge Critical Dimension Uniformity Control App 20150001180 - DOAN; Kenny Linh ;   et al. | 2015-01-01 |
Etch Process Having Adaptive Control With Etch Depth Of Pressure And Power App 20140342570 - Doan; Kenny Linh ;   et al. | 2014-11-20 |
Boron-doped Carbon-based Hardmask Etch Processing App 20140213059 - Doan; Kenny Linh ;   et al. | 2014-07-31 |
Silicon Dioxide-polysilicon Multi-layered Stack Etching With Plasma Etch Chamber Employing Non-corrosive Etchants App 20140213062 - SHIMIZU; Daisuke ;   et al. | 2014-07-31 |
Plasma etch processes for boron-doped carbonaceous mask layers Grant 8,778,207 - Kim , et al. July 15, 2 | 2014-07-15 |
Method for etching substrate Grant 8,668,837 - Doan , et al. March 11, 2 | 2014-03-11 |
Maintaining Mask Integrity To Form Openings In Wafers App 20140065824 - Shimizu; Daisuke ;   et al. | 2014-03-06 |
Rotational Clap Suction/pressure Device App 20140056747 - Kim; Jong-Mun | 2014-02-27 |
Maintaining mask integrity to form openings in wafers Grant 8,603,921 - Shimizu , et al. December 10, 2 | 2013-12-10 |
Methods For Etching Oxide Layers Using Process Gas Pulsing App 20130224960 - Payyapilly; Jairaj ;   et al. | 2013-08-29 |
Methods Of Polymers Deposition For Forming Reduced Critical Dimensions App 20130122707 - Shimizu; Daisuke ;   et al. | 2013-05-16 |
Method Of Etching High Aspect Ratio Features In A Dielectric Layer App 20130122712 - KIM; Jong Mun ;   et al. | 2013-05-16 |
Plasma Etch Processes For Boron-doped Carbonaceous Mask Layers App 20130109188 - KIM; Jong Mun ;   et al. | 2013-05-02 |
Method For Etching Substrate App 20130092656 - Doan; Kenny Linh ;   et al. | 2013-04-18 |
Maintaining Mask Integrity To Form Openings In Wafers App 20130029484 - Shimizu; Daisuke ;   et al. | 2013-01-31 |
Plasma etch reactor with distribution of etch gases across a wafer surface and a polymer oxidizing gas in an independently fed center gas zone Grant 8,187,415 - Kim , et al. May 29, 2 | 2012-05-29 |
Halogen-free amorphous carbon mask etch having high selectivity to photoresist Grant 7,807,064 - Kim , et al. October 5, 2 | 2010-10-05 |
Process Kit Having Reduced Erosion Sensitivity App 20100101729 - KIM; JONG MUN ;   et al. | 2010-04-29 |
Method of controlling sidewall profile by using intermittent, periodic introduction of cleaning species into the main plasma etching species App 20080286979 - Shin; Taeho ;   et al. | 2008-11-20 |
Halogen-free Amorphous Carbon Mask Etch Having High Selectivity To Photoresist App 20080230511 - Kim; Jong Mun ;   et al. | 2008-09-25 |
Plasma etch reactor with distribution of etch gases across a wafer surface and a polymer oxidizing gas in an independently fed center gas zone App 20070247075 - Kim; Jong Mun ;   et al. | 2007-10-25 |
Plasma etch process using etch uniformity control by using compositionally independent gas feed App 20070249173 - Kim; Jong Mun ;   et al. | 2007-10-25 |
Method of controlling silicon-containing polymer build up during etching by using a periodic cleaning step App 20070243714 - Shin; Taeho ;   et al. | 2007-10-18 |
Pharmacologically active isolated or purified dauer pheromone compound for controlling aging and stress and method for isolating and characterizing the same Grant 7,119,213 - Paik , et al. October 10, 2 | 2006-10-10 |