Kim; Jong Kook
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kim; Jong Kook.The latest application filed is for "shark fin antenna for vehicle".
Company Profile
2.25.33
- Kim; Jong Kook - Gyeonggi-do KR
- KIM; Jong-Kook - Gwangyang-si KR
- Kim; Jong-Kook - Hwaseong-si N/A KR
- KIM; Jong-Kook - Gwangyang-si Jeollanam-do KR
- Kim; Jong Kook - Jungja-dong N/A KR
- KIM; Jong-Kook - Incheon KR
- Kim; Jong Kook - Suwon N/A KR
- Kim; Jong-Kook - Seoul KR
- Kim; Jong Kook - Suwon City KR
- Kim; Jong-Kook - Chungcheongnam-do KR
- Kim; Jong Kook - Suwon-si KR
- Kim; Jong Kook - Singapore SG
- Kim, Jong-Kook - Osan-si KR
- Kim; Jong-Kook - Kyeonggi-do KR
Patent Activity
| Patent | Date |
|---|---|
| Shark fin antenna for vehicle Grant 11,063,346 - Yang , et al. July 13, 2 | 2021-07-13 |
| Shark Fin Antenna For Vehicle App 20210057805 - Yang; Tae Hoon ; et al. | 2021-02-25 |
| Coating Composition Having Excellent Corrosion Resistance And Fingerprint Resistance, Stainless Steel Sheet Having Etching Patte App 20200255687 - Kind Code | 2020-08-13 |
| Method for manufacturing transparent pattern print steel plate Grant 10,391,518 - Kim , et al. A | 2019-08-27 |
| Semiconductor package and method for routing the package Grant 10,056,321 - Kwon , et al. August 21, 2 | 2018-08-21 |
| Method For Manufacturing Transparent Pattern Print Steel Plate App 20170354991 - KIM; Jin-Tae ; et al. | 2017-12-14 |
| Semiconductor Packages And Methods Of Manufacturing Semiconductor Packages App 20170012025 - KWON; Heung-Kyu ; et al. | 2017-01-12 |
| Semiconductor package stack structure having interposer substrate Grant 9,349,713 - Kim , et al. May 24, 2 | 2016-05-24 |
| Semiconductor Package Stack Structure Having Interposer Substrate App 20160027764 - KIM; Jong-Kook ; et al. | 2016-01-28 |
| Epoxy bump for overhang die Grant 9,129,826 - Lee , et al. September 8, 2 | 2015-09-08 |
| Detecting Method Of Abnormality Of Machine Tool Operation App 20150051728 - KIM; Byung-Hak ; et al. | 2015-02-19 |
| Flip-chip Semiconductor Package App 20140312489 - IM; HO-HYEUK ; et al. | 2014-10-23 |
| Semiconductor Package And Method For Routing The Package App 20140159237 - KWON; Heung-Kyu ; et al. | 2014-06-12 |
| Semiconductor Packages And Methods Of Manufacturing Semiconductor Packages App 20130256916 - KWON; Heung-Kyu ; et al. | 2013-10-03 |
| Semiconductor system with fine pitch lead fingers and method of manufacturing thereof Grant 8,519,517 - Lee , et al. August 27, 2 | 2013-08-27 |
| Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof Grant 8,256,660 - Lee , et al. September 4, 2 | 2012-09-04 |
| Wire bond interconnection and method of manufacture thereof Grant 8,129,263 - Lee , et al. March 6, 2 | 2012-03-06 |
| Functional Shoe App 20110289798 - JUNG; HYUN-YOUNG ; et al. | 2011-12-01 |
| Semiconductor System With Fine Pitch Lead Fingers And Method Of Manufacturing Thereof App 20110285000 - Lee; Hun Teak ; et al. | 2011-11-24 |
| Wire Bond Interconnection And Method Of Manufacture Thereof App 20110266700 - Lee; Hun-Teak ; et al. | 2011-11-03 |
| Wire bond interconnection Grant 7,986,047 - Lee , et al. July 26, 2 | 2011-07-26 |
| Semiconductor Package System With Fine Pitch Lead Fingers And Method Of Manufacturing Thereof App 20110169149 - Lee; Hun Teak ; et al. | 2011-07-14 |
| Interposer chip and multi-chip package having the interposer chip Grant 7,928,435 - Park , et al. April 19, 2 | 2011-04-19 |
| Method of manufacturing a semiconductor package with fine pitch lead fingers Grant 7,909,233 - Lee , et al. March 22, 2 | 2011-03-22 |
| Wire Bond Interconnection App 20100225008 - Lee; Hun-Teak ; et al. | 2010-09-09 |
| Semiconductor System With Fine Pitch Lead Fingers And Method Of Manufacture Thereof App 20100203683 - Lee; Hun Teak ; et al. | 2010-08-12 |
| Wire bond interconnection Grant 7,745,322 - Lee , et al. June 29, 2 | 2010-06-29 |
| Semiconductor system with fine pitch lead fingers Grant 7,731,078 - Lee , et al. June 8, 2 | 2010-06-08 |
| Micro chip-scale-package system Grant 7,652,382 - Kim , et al. January 26, 2 | 2010-01-26 |
| Interposer chip and multi-chip package having the interposer chip App 20090272974 - Park; Sung-Yong ; et al. | 2009-11-05 |
| Wire bond interconnection Grant 7,453,156 - Lee , et al. November 18, 2 | 2008-11-18 |
| Integrated circuit package-in-package system Grant 7,429,798 - Kim September 30, 2 | 2008-09-30 |
| Flash memory and method for checking status register by block unit App 20080225598 - Jung; Jin-Sung ; et al. | 2008-09-18 |
| Wire bond capillary tip Grant 7,407,080 - Lee , et al. August 5, 2 | 2008-08-05 |
| Wire Bond Interconnection App 20080135997 - Lee; Hun-Teak ; et al. | 2008-06-12 |
| Micro Chip-scale-package System App 20080029861 - Kim; Jong Kook ; et al. | 2008-02-07 |
| Micro chip-scale-package system Grant 7,298,052 - Kim , et al. November 20, 2 | 2007-11-20 |
| Integrated circuit package-in-package system Grant 7,271,496 - Kim September 18, 2 | 2007-09-18 |
| Flash memory test system and method capable of test time reduction Grant 7,254,757 - Park , et al. August 7, 2 | 2007-08-07 |
| Integrated Circuit Package-in-package System App 20070158813 - Kim; Jong Kook | 2007-07-12 |
| GPON system and method for bandwidth allocation in GPON system App 20070133988 - Kim; Yu-Gun ; et al. | 2007-06-14 |
| GPON system and method for bandwidth allocation in GPON system App 20070133989 - Kim; Yu-Gun ; et al. | 2007-06-14 |
| Micro Chip-scale-package System App 20070111389 - Kim; Jong Kook ; et al. | 2007-05-17 |
| Bump For Overhang Device App 20070001296 - Lee; Hun Teak ; et al. | 2007-01-04 |
| Epoxy Bump for Overhang Die App 20060267609 - Lee; Hun-Teak ; et al. | 2006-11-30 |
| Integrated Circuit Package-in-package System App 20060189033 - Kim; Jong Kook | 2006-08-24 |
| Wire bond interconnection App 20060113665 - Lee; Hun-Teak ; et al. | 2006-06-01 |
| Semiconductor system with fine pitch lead fingers App 20060102694 - Lee; Hun Teak ; et al. | 2006-05-18 |
| Chemical vapor deposition method App 20050271830 - Park, Yun-Soo ; et al. | 2005-12-08 |
| Wire bond capillary Tip App 20050218188 - Lee, Kenny ; et al. | 2005-10-06 |
| Flash memory test system and method capable of test time reduction App 20050102589 - Park, Dong-Kyoo ; et al. | 2005-05-12 |
| Connector for prefabricated structures Grant 6,637,970 - Kim , et al. October 28, 2 | 2003-10-28 |
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