Kim; JinGwan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; JinGwan.The latest application filed is for "semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die".

Company Profile

1.20.15

Kim; JinGwan - Seoul KR
Kim; JinGwan - Kyoungki-do KR
Kim; JinGwan - Icheon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV Grant 9,401,347 - Lee , et al. July 26, 2	2016-07-26
Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die Grant 9,379,064 - Oh , et al. June 28, 2	2016-06-28
Semiconductor Device and Method of Mounting Semiconductor Die to Heat Spreader on Temporary Carrier and Forming Polymer Layer and Conductive Layer Over the Die App 20150228590 - Oh; JiHoon ; et al.	2015-08-13
Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die Grant 9,048,209 - Oh , et al. June 2, 2	2015-06-02
Semiconductor Device and Method of Forming a Shielding Layer Over a Semiconductor Die Disposed in a Cavity of an Interconnect Structure and Grounded Through the Die TSV App 20150137334 - Lee; SinJae ; et al.	2015-05-21
Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV Grant 8,937,371 - Lee , et al. January 20, 2	2015-01-20
Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die Grant 8,932,908 - Lee , et al. January 13, 2	2015-01-13
Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers Grant 8,836,114 - Oh , et al. September 16, 2	2014-09-16
Semiconductor Device and Method of Forming a Shielding Layer over a Semiconductor Die Disposed in a Cavity of an Interconnect Structure and Grounded Through the Die TSV App 20130292804 - Lee; SinJae ; et al.	2013-11-07
Semiconductor Device and Method of Forming Partially-Etched Conductive Layer Recessed Within Substrate for Bonding to Semiconductor Die App 20130249090 - Lee; KyuWon ; et al.	2013-09-26
Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV Grant 8,531,012 - Lee , et al. September 10, 2	2013-09-10
Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die Grant 8,502,392 - Lee , et al. August 6, 2	2013-08-06
Integrated circuit packaging system with vertical interconnects and method of manufacture thereof Grant 8,476,135 - Kim , et al. July 2, 2	2013-07-02
Integrated circuit packaging system with package-on-package and method of manufacture thereof Grant 8,432,028 - Kim , et al. April 30, 2	2013-04-30
Semiconductor Device and Method of Forming FO-WLCSP Having Conductive Layers and Conductive Vias Separated by Polymer Layers App 20130075919 - Oh; JiHoon ; et al.	2013-03-28
Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers Grant 8,343,810 - Oh , et al. January 1, 2	2013-01-01
Semiconductor Device and Method of Forming Partially-Etched Conductive Layer Recessed Within Substrate for Bonding to Semiconductor Die App 20120326303 - Lee; KyuWon ; et al.	2012-12-27
Integrated Circuit Packaging System With Vertical Interconnects And Method Of Manufacture Thereof App 20120299168 - Kim; JinGwan ; et al.	2012-11-29
Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof Grant 8,310,038 - Kim , et al. November 13, 2	2012-11-13
Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die Grant 8,288,202 - Lee , et al. October 16, 2	2012-10-16
Integrated Circuit Packaging System With Embedded Conductive Structure And Method Of Manufacture Thereof App 20120241967 - Kim; JinGwan ; et al.	2012-09-27
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof App 20120241936 - Kim; JinGwan ; et al.	2012-09-27
Semiconductor Device and Method of Forming Partially-Etched Conductive Layer Recessed Within Substrate for Bonding to Semiconductor Die App 20120126416 - Lee; KyuWon ; et al.	2012-05-24
Semiconductor Device and Method of Forming FO-WLCSP Having Conductive Layers and Conductive Vias Separated by Polymer Layers App 20120038053 - Oh; JiHoon ; et al.	2012-02-16
Semiconductor Device and Method of Mounting Semiconductor Die to Heat Spreader on Temporary Carrier and Forming Polymer Layer and Conductive Layer Over the Die App 20110278705 - Oh; JiHoon ; et al.	2011-11-17
Integrated circuit package stacking system Grant 8,004,093 - Oh , et al. August 23, 2	2011-08-23
Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die Grant 8,003,496 - Oh , et al. August 23, 2	2011-08-23
Semiconductor Device and Method of Forming a Shielding Layer over a Semiconductor Die Disposed in a Cavity of an Interconnect Structure and Grounded through the Die TSV App 20110095403 - Lee; SinJae ; et al.	2011-04-28
Semiconductor Device and Method of Mounting Semiconductor Die to Heat Spreader on Temporary Carrier and Forming Polymer Layer and Conductive Layer Over the Die App 20110037165 - Oh; JiHoon ; et al.	2011-02-17
Integrated Circuit Package Stacking System App 20100025835 - Oh; JiHoon ; et al.	2010-02-04

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