KIM; Jichul

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIM; Jichul.The latest application filed is for "electronic device including rollable display".

Company Profile

7.28.35

KIM; Jichul - Suwon-si KR
KIM; JICHUL - SEOUL KR
Kim; Jichul - Yongin-si KR
Kim; Jichul - Hwasung KR
KIM; Jichul - Hwasung-City KR
Kim; Jichul - Daejeon N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic Device Including Rollable Display App 20220171434 - PARK; Jinyong ; et al.	2022-06-02
Semiconductor Package App 20210202462 - KIM; JICHUL ; et al.	2021-07-01
Semiconductor package Grant 10,985,152 - Kim , et al. April 20, 2	2021-04-20
Semiconductor packages Grant 10,937,771 - Kim , et al. March 2, 2	2021-03-02
Thermoelectric cooling packages and thermal management methods thereof Grant 10,658,266 - Kim , et al.	2020-05-19
Semiconductor package Grant 10,510,737 - Kim , et al. Dec	2019-12-17
Semiconductor Package App 20190348407 - KIM; JICHUL ; et al.	2019-11-14
Semiconductor Packages App 20190287951 - KIM; JICHUL ; et al.	2019-09-19
Semiconductor packages having redistribution substrate Grant 10,347,611 - Kim , et al. July 9, 2	2019-07-09
Surface temperature management method of mobile device and memory thermal management method of multichip package Grant 10,198,049 - Kwon , et al. Fe	2019-02-05
Semiconductor Package App 20180301443 - KIM; JICHUL ; et al.	2018-10-18
Semiconductor Packages And Methods Of Fabricating The Same App 20180269126 - Im; Yunhyeok ; et al.	2018-09-20
Packaged semiconductor chips having heat dissipation layers and ground contacts therein Grant 9,978,661 - Im , et al. May 22, 2	2018-05-22
Integrated circuit for estimating power of at least one node using temperature and a system including the same Grant 9,903,764 - Lee , et al. February 27, 2	2018-02-27
Thermoelectric Cooling Packages And Thermal Management Methods Thereof App 20170229373 - KIM; JAE CHOON ; et al.	2017-08-10
Semiconductor Packages App 20170207205 - KIM; Jichul ; et al.	2017-07-20
Surface Temperature Management Method Of Mobile Device And Memory Thermal Management Method Of Multichip Package App 20170185119 - KWON; Heungkyu ; et al.	2017-06-29
Semiconductor package and semiconductor device including the same Grant 9,679,874 - Bae , et al. June 13, 2	2017-06-13
Thermoelectric cooling packages and thermal management methods thereof Grant 9,671,141 - Kim , et al. June 6, 2	2017-06-06
Semiconductor package and method of estimating surface temperature of semiconductor device including the same Grant 9,651,431 - Kim , et al. May 16, 2	2017-05-16
Surface temperature management method of mobile device and memory thermal management method of multichip package Grant 9,606,591 - Kwon , et al. March 28, 2	2017-03-28
Package-on-package device Grant 9,583,430 - Park , et al. February 28, 2	2017-02-28
Semiconductor Packages And Methods Of Fabricating The Same App 20170047264 - IM; YUNHYEOK ; et al.	2017-02-16
Semiconductor packages including heat exhaust part Grant 9,391,009 - Jang , et al. July 12, 2	2016-07-12
Semiconductor Package And Semiconductor Device Including The Same App 20160133605 - BAE; Jin-Kwon ; et al.	2016-05-12
Integrated Circuit For Estimating Power Of At Least One Node Using Temperature And A System Including The Same App 20160092617 - Lee; Kyungsoo ; et al.	2016-03-31
Thermoelectric Cooling Packages And Thermal Management Methods Thereof App 20160084542 - KIM; JAE CHOON ; et al.	2016-03-24
Thermoelectric cooling packages and thermal management methods thereof Grant 9,228,763 - Kim , et al. January 5, 2	2016-01-05
Chip-on-film packages and device assemblies including the same Grant 9,030,826 - Kim , et al. May 12, 2	2015-05-12
Package-on-package Device App 20150115467 - PARK; Kyol ; et al.	2015-04-30
Semiconductor packages including heat diffusion vias and interconnection vias Grant 9,013,031 - Im , et al. April 21, 2	2015-04-21
Display devices Grant 8,988,645 - Kim , et al. March 24, 2	2015-03-24
Semiconductor Packages Including Heat Diffusion Vias And Interconnection Vias App 20140367860 - IM; YUNHYEOK ; et al.	2014-12-18
Semiconductor Package And Method Of Estimating Surface Temperature Of Semiconductor Device Including The Same App 20140247859 - KIM; Jae Choon ; et al.	2014-09-04
Robot cleaner Grant 8,733,796 - Lee , et al. May 27, 2	2014-05-27
Electronic Device And Temperature Control Method Thereof App 20130166093 - Kim; Jae Choon ; et al.	2013-06-27
Thermoelectric Cooling Packages And Thermal Management Methods Thereof App 20130139524 - KIM; Jae Choon ; et al.	2013-06-06
Surface Temperature Management Method Of Mobile Device And Memory Thermal Management Method Of Multichip Package App 20130091348 - KWON; Heungkyu ; et al.	2013-04-11
Display Devices App 20130057559 - KIM; Jichul ; et al.	2013-03-07
Chip-on-film Packages And Device Assemblies Including The Same App 20130021768 - KIM; Jichul ; et al.	2013-01-24
Robot Cleaner App 20110239382 - LEE; Jeihun ; et al.	2011-10-06

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