KIM; Jeong Ik

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIM; Jeong Ik.The latest application filed is for "joining structure of different kinds of conductors, joining method of different kinds of conductors, and joint of power cables".

Company Profile

4.11.12

KIM; Jeong Ik - Seongnam-si KR
Kim; Jeong-Ik - Seoul KR
Kim; Jeong-Ik - Suwon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Joining Structure Of Different Kinds Of Conductors, Joining Method Of Different Kinds Of Conductors, And Joint Of Power Cables App 20220172864 - KIM; Jeong Ik ; et al.	2022-06-02
Semiconductor Device App 20220130970 - KANG; Ji Won ; et al.	2022-04-28
Semiconductor devices with shaped portions of elevated source/drain regions Grant 10,840,374 - Shin , et al. November 17, 2	2020-11-17
Semiconductor device and method of manufacturing the same Grant 10,269,629 - Choi , et al.	2019-04-23
Semiconductor device including contact plug and method of manufacturing the same Grant 10,134,856 - Eom , et al. November 20, 2	2018-11-20
Semiconductor devices with shaped portions of elevated source/drain regions Grant 10,043,902 - Shin , et al. August 7, 2	2018-08-07
Semiconductor Device And Method Of Manufacturing The Same App 20180068889 - CHOI; Junghun ; et al.	2018-03-08
Semiconductor Devices and Methods of Manufacturing the Same App 20170365555 - Choi; Jung-Hun ; et al.	2017-12-21
Semiconductor Device Including Contact Plug And Method Of Manufacturing The Same App 20170077248 - EOM; Da-Il ; et al.	2017-03-16
Semiconductor Devices With Shaped Portions Of Elevated Source/drain Regions App 20160233334 - Shin; Chung-Hwan ; et al.	2016-08-11
Methods of forming semiconductor devices with metal silicide using pre-amorphization implants Grant 9,240,323 - Shin , et al. January 19, 2	2016-01-19
Electrical transmission line Grant 8,658,902 - Kim , et al. February 25, 2	2014-02-25
Methods Of Forming Semiconductor Devices With Metal Silicide Using Pre-amorphization Implants And Devices So Formed App 20130316535 - Shin; Chung-Hwan ; et al.	2013-11-28
Electrical Transmission Line App 20110226509 - KIM; Jeong-Ik ; et al.	2011-09-22
Method and apparatus for making very low roughness copper foil Grant 7,112,271 - Jo , et al. September 26, 2	2006-09-26
Method and apparatus for making very low roughness copper foil App 20040108216 - Jo, Cha Jae ; et al.	2004-06-10
Method for manufacturing very low roughness electrodeposited copper foil and electrodeposited copper foil manufactured thereby App 20040104118 - Kim, Sangyum ; et al.	2004-06-03

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