loadpatents
Patent applications and USPTO patent grants for Kim; Jea Won.The latest application filed is for "flexible semiconductor package and method of manufacturing the same".
Patent | Date |
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Flexible semiconductor package formed by roll-to-roll process Grant 11,139,220 - Kim , et al. October 5, 2 | 2021-10-05 |
Flexible Semiconductor Package And Method Of Manufacturing The Same App 20210057301 - KIM; Jea Won ;   et al. | 2021-02-25 |
Method Of Manufacturing Semiconductor Package Substrate And Semiconductor Package Substrate Manufactured Using The Same App 20200411362 - KANG; Sung Il ;   et al. | 2020-12-31 |
Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same Grant 10,811,302 - Kang , et al. October 20, 2 | 2020-10-20 |
Method Of Manufacturing Semiconductor Package Substrate And Semiconductor Package Substrate Manufactured Using The Same App 20190067082 - KANG; Sung Il ;   et al. | 2019-02-28 |
Image interpolation apparatus and method thereof App 20070081743 - Kim; Jea-won | 2007-04-12 |
Apparatus and method of controlling saturation of color image App 20050270427 - Kim, Jea-won ;   et al. | 2005-12-08 |
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