KIM; Jae-Choon

Patent Applications and Registrations

Patent applications and USPTO patent grants for KIM; Jae-Choon.The latest application filed is for "chip on film package and display device including the same".

Company Profile

21.34.53

KIM; Jae-Choon - Incheon KR
KIM; JAE CHOON - YEONSU-GU KR
KIM; JAE CHOON - Hwasung-si KR
Kim; Jae-Choon - lncheon KR
Kim; Jae-Choon - Yongin-si KR
Kim; Jae Choon - Hwasung KR
KIM; Jae Choon - Hwasung-City KR
KIM; Jae Choon - Hwaseong-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Chip On Film Package And Display Device Including The Same App 20210398870 - HWANG; Seung-Tae ; et al.	2021-12-23
Semiconductor package including a thermal conductive layer and method of manufacturing the same Grant 11,205,604 - Kim , et al. December 21, 2	2021-12-21
Chip on film package and display device including the same Grant 11,107,743 - Hwang , et al. August 31, 2	2021-08-31
Semiconductor Package App 20210202462 - KIM; JICHUL ; et al.	2021-07-01
Chip structure operating method including heating elements to reduce temperature variation Grant 11,004,760 - Park , et al. May 11, 2	2021-05-11
Semiconductor package Grant 10,985,152 - Kim , et al. April 20, 2	2021-04-20
Semiconductor packages Grant 10,937,771 - Kim , et al. March 2, 2	2021-03-02
Semiconductor package and method of manufacturing semiconductor package Grant 10,879,225 - Kim , et al. December 29, 2	2020-12-29
Image sensor package having multi-level stack structure Grant 10,879,294 - Kim , et al. December 29, 2	2020-12-29
Semiconductor Package Including A Thermal Pillar And Heat Transfer Film App 20200335480 - HWANG; HEEJUNG ; et al.	2020-10-22
Heat radiation device, semiconductor package comprising the same, and semiconductor device comprising the same Grant 10,790,213 - Kim , et al. September 29, 2	2020-09-29
Chip On Film Package And Display Device Including The Same App 20200303276 - Hwang; Seung-Tae ; et al.	2020-09-24
Electronic device and method of manufacturing the electronic device Grant 10,707,196 - Kim , et al.	2020-07-07
Chip Structure Including Heating Element App 20200161201 - Park; Woo Hyun ; et al.	2020-05-21
Thermoelectric cooling packages and thermal management methods thereof Grant 10,658,266 - Kim , et al.	2020-05-19
Semiconductor Package And Method Of Manufacturing Semiconductor Package App 20200135710 - KIM; Won-Keun ; et al.	2020-04-30
Image Sensor Package App 20200135790 - KIM; Yong-hoon ; et al.	2020-04-30
Chip structure including heating element Grant 10,553,513 - Park , et al. Fe	2020-02-04
Stack package and method of manufacturing the stack package Grant 10,546,844 - Kim , et al. Ja	2020-01-28
Image sensor package having multi-level stack structure Grant 10,541,263 - Kim , et al. Ja	2020-01-21
Semiconductor package Grant 10,510,737 - Kim , et al. Dec	2019-12-17
Semiconductor Package App 20190348407 - KIM; JICHUL ; et al.	2019-11-14
Semiconductor Packages App 20190287951 - KIM; JICHUL ; et al.	2019-09-19
Heat Radiation Device, Semiconductor Package Comprising The Same, And Semiconductor Device Comprising The Same App 20190287877 - KIM; JAE CHOON ; et al.	2019-09-19
Semiconductor Package Including A Thermal Conductive Layer And Method Of Manufacturing The Same App 20190237382 - KIM; Jae Choon ; et al.	2019-08-01
Semiconductor packages having redistribution substrate Grant 10,347,611 - Kim , et al. July 9, 2	2019-07-09
Electronic Device And Method Of Manufacturing The Electronic Device App 20190198489 - KIM; Jae-Choon ; et al.	2019-06-27
Chip Structure Including Heating Element App 20190057918 - PARK; Woo Hyun ; et al.	2019-02-21
Surface temperature management method of mobile device and memory thermal management method of multichip package Grant 10,198,049 - Kwon , et al. Fe	2019-02-05
Semiconductor Package App 20180301443 - KIM; JICHUL ; et al.	2018-10-18
Semiconductor packages with heat dissipation layers and pillars and methods for fabricating the same Grant 9,991,245 - Kim , et al. June 5, 2	2018-06-05
Image Sensor Package App 20180138225 - KIM; Yong-hoon ; et al.	2018-05-17
Thermoelectric Cooling Packages And Thermal Management Methods Thereof App 20170229373 - KIM; JAE CHOON ; et al.	2017-08-10
Semiconductor Packages App 20170207205 - KIM; Jichul ; et al.	2017-07-20
Package substrate and semiconductor package including the same Grant 9,704,815 - Choi , et al. July 11, 2	2017-07-11
Surface Temperature Management Method Of Mobile Device And Memory Thermal Management Method Of Multichip Package App 20170185119 - KWON; Heungkyu ; et al.	2017-06-29
Semiconductor package and semiconductor device including the same Grant 9,679,874 - Bae , et al. June 13, 2	2017-06-13
Thermoelectric cooling packages and thermal management methods thereof Grant 9,671,141 - Kim , et al. June 6, 2	2017-06-06
Stack Package And Method Of Manufacturing The Stack Package App 20170154878 - Kim; Jae-Choon ; et al.	2017-06-01
Semiconductor package including heat spreader and method for manufacturing the same Grant 9,653,373 - Kim , et al. May 16, 2	2017-05-16
Semiconductor package and method of estimating surface temperature of semiconductor device including the same Grant 9,651,431 - Kim , et al. May 16, 2	2017-05-16
Surface temperature management method of mobile device and memory thermal management method of multichip package Grant 9,606,591 - Kwon , et al. March 28, 2	2017-03-28
Electronic systems including heterogeneous multi-core processors and methods of operating same Grant 9,588,577 - Ahn , et al. March 7, 2	2017-03-07
Semiconductor package and method of fabricating the same Grant 9,589,842 - Choi , et al. March 7, 2	2017-03-07
Package Substrate And Semiconductor Package Including The Same App 20160372423 - CHOI; Mi-Na ; et al.	2016-12-22
Semiconductor Package Including Heat Spreader And Method For Manufacturing The Same App 20160300774 - Kim; Jae Choon ; et al.	2016-10-13
Semiconductor Package And Method Of Fabricating The Same App 20160225669 - CHOI; Inho ; et al.	2016-08-04
Semiconductor Packages And Methods For Fabricating The Same App 20160204080 - KIM; Jae Choon ; et al.	2016-07-14
Semiconductor Packages App 20160197057 - Umemoto; Mitsuo ; et al.	2016-07-07
Semiconductor Package And Semiconductor Device Including The Same App 20160133605 - BAE; Jin-Kwon ; et al.	2016-05-12
Thermoelectric Cooling Packages And Thermal Management Methods Thereof App 20160084542 - KIM; JAE CHOON ; et al.	2016-03-24
Thermoelectric cooling packages and thermal management methods thereof Grant 9,228,763 - Kim , et al. January 5, 2	2016-01-05
Chip-on-film packages and device assemblies including the same Grant 9,030,826 - Kim , et al. May 12, 2	2015-05-12
Electronic Systems Including Heterogeneous Multi-core Processors And Methods Of Operating Same App 20150121105 - AHN; MIN SEON ; et al.	2015-04-30
Application Processor And Dynamic Thermal Management Method Thereof App 20140324245 - KWON; HEUNG-KYU ; et al.	2014-10-30
Semiconductor Package And Method Of Estimating Surface Temperature Of Semiconductor Device Including The Same App 20140247859 - KIM; Jae Choon ; et al.	2014-09-04
Semiconductor Package App 20140239434 - KIM; Jae Choon ; et al.	2014-08-28
Semiconductor Devices And Methods Of Controlling Temperature Thereof App 20140184312 - KIM; Jae Choon ; et al.	2014-07-03
Mobile Device And Data Communication Method Of Semiconductor Integrated Circuit Of Mobile Device App 20140136827 - CHO; EUNSEOK ; et al.	2014-05-15
Semiconductor devices and methods of controlling temperature thereof Grant 8,692,349 - Kim , et al. April 8, 2	2014-04-08
Semiconductor Package Having Heat Spreader And Method Of Forming The Same App 20130208426 - Kim; Jae-Choon ; et al.	2013-08-15
Electronic Device And Temperature Control Method Thereof App 20130166093 - Kim; Jae Choon ; et al.	2013-06-27
Thermoelectric Cooling Packages And Thermal Management Methods Thereof App 20130139524 - KIM; Jae Choon ; et al.	2013-06-06
Surface Temperature Management Method Of Mobile Device And Memory Thermal Management Method Of Multichip Package App 20130091348 - KWON; Heungkyu ; et al.	2013-04-11
Chip-on-film Packages And Device Assemblies Including The Same App 20130021768 - KIM; Jichul ; et al.	2013-01-24
Semiconductor Devices And Methods Of Controlling Temperature Thereof App 20120133427 - Kim; Jae Choon ; et al.	2012-05-31

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