Kim; Hyung Wan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kim; Hyung Wan.The latest application filed is for "polyamic acid solution, polyimide resin and flexible metal clad laminate using the same".
- Kim; Hyung Wan - Yongin-si N/A KR
- Kim; Hyung-wan - Suwon-si N/A KR
- Kim; Hyung-wan - Seongnam KR
- Kim, Hyung-Wan - Seongnam-city KR
| Patent | Date |
|---|---|
| Polyamic acid solution, polyimide resin and flexible metal clad laminate using the same Grant 8,809,688 - Kim , et al. August 19, 2 | 2014-08-19 |
| Step-down converter maintaining stable operation at start up Grant 8,421,436 - Kim , et al. April 16, 2 | 2013-04-16 |
| Polyamic Acid Solution, Polyimide Resin And Flexible Metal Clad Laminate Using The Same App 20120085570 - Kim; Yang Seob ; et al. | 2012-04-12 |
| Step-down Converter And Power Supply App 20100141227 - KIM; Hyung-wan ; et al. | 2010-06-10 |
| Power supply capable of protecting electric device circuit Grant 6,975,523 - Kim , et al. December 13, 2 | 2005-12-13 |
| Power supply capable of protecting electric device circuit App 20040080961 - Kim, Hyung-Wan ; et al. | 2004-04-29 |
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