Patent | Date |
---|
Main unit and distributed antenna system including the same Grant 11,206,599 - Kim , et al. December 21, 2 | 2021-12-21 |
Multi-path communication device for sharing feedback path for digital pre-distortion Grant 10,763,795 - Seo , et al. Sep | 2020-09-01 |
Multi-path Communication Device For Sharing Feedback Path For Digital Pre-distortion App 20200119700 - Seo; Kwang Nam ;   et al. | 2020-04-16 |
Multi-path communication device for sharing feedback path for digital pre-distortion Grant 10,536,120 - Seo , et al. Ja | 2020-01-14 |
Multi-path Communication Device For Sharing Feedback Path For Digital Pre-distortion App 20190052235 - SEO; Kwang Nam ;   et al. | 2019-02-14 |
Main Unit And Distributed Antenna System Including The Same App 20180310226 - KIM; Do Yoon ;   et al. | 2018-10-25 |
Method of manufacturing non-shrinking multilayer ceramic substrate Grant 8,753,462 - Cho , et al. June 17, 2 | 2014-06-17 |
Chip on film (COF) package having test line for testing electrical function of chip and method for manufacturing same Grant 8,709,832 - Kim , et al. April 29, 2 | 2014-04-29 |
Chip On Film (cof) Package Having Test Line For Testing Electrical Function Of Chip And Method For Manufacturing Same App 20120061669 - Kim; Hyoung-ho ;   et al. | 2012-03-15 |
LED package and fabricating method thereof Grant 8,012,778 - Kim , et al. September 6, 2 | 2011-09-06 |
Variable Directional Microphone Assembly And Method Of Making The Microphone Assembly App 20110188694 - Lee; Sang-Ho ;   et al. | 2011-08-04 |
Method Of Manufacturing Non-shrinking Multilayer Ceramic Substrate App 20100101701 - CHO; Beom Joon ;   et al. | 2010-04-29 |
Method for manufacturing multilayer chip capacitor Grant 7,644,480 - Kim , et al. January 12, 2 | 2010-01-12 |
Manufacturing Method Of Multi-layer Ceramic Substrate App 20090107616 - Lyoo; Soo Hyun ;   et al. | 2009-04-30 |
Led Package And Fabricating Method Thereof App 20090061550 - KIM; Yong Suk ;   et al. | 2009-03-05 |
Chip On Film (cof) Package Having Test Pad For Testing Electrical Function Of Chip And Method For Manufacturing Same App 20090050887 - Kim; Hyoung-ho ;   et al. | 2009-02-26 |
Apparatus for Necklace Type Radio Headset App 20080317274 - Kim; Hyoung Ho | 2008-12-25 |
LED package and fabricating method thereof Grant 7,453,093 - Kim , et al. November 18, 2 | 2008-11-18 |
Chip on film (COF) package having test pad for testing electrical function of chip and method for manufacturing same Grant 7,442,968 - Kim , et al. October 28, 2 | 2008-10-28 |
Method of fabricating light emitting diode package Grant 7,371,603 - Kim , et al. May 13, 2 | 2008-05-13 |
Method for manufacturing multilayer ceramic capacitor Grant 7,338,854 - Choo , et al. March 4, 2 | 2008-03-04 |
Multilayer chip capacitor and method for manufacturing the same App 20070251066 - Kim; Hyoung Ho ;   et al. | 2007-11-01 |
Multilayer chip capacitor and method for manufacturing the same Grant 7,251,119 - Kim , et al. July 31, 2 | 2007-07-31 |
Method of manufacturing multilayered ceramic capacitor by spin coating and multilayered ceramic capacitor Grant 7,203,055 - Shin , et al. April 10, 2 | 2007-04-10 |
LED package and fabricating method thereof App 20070018190 - Kim; Yong Suk ;   et al. | 2007-01-25 |
Method of fabricating light emitting diode package App 20060270078 - Kim; Yong Suk ;   et al. | 2006-11-30 |
Multilayer chip capacitor and method for manufacturing the same App 20060139848 - Kim; Hyoung Ho ;   et al. | 2006-06-29 |
Sol composition for dielectric ceramic, and dielectric ceramic and multilayered ceramic capacitor using the same App 20060121258 - Kim; Yong Suk ;   et al. | 2006-06-08 |
Method for manufacturing multilayer ceramic capacitor App 20050132548 - Choo, Ho Sung ;   et al. | 2005-06-23 |
Method of manufacturing multilayered ceramic capacitor by spin coating and multilayered ceramic capacitor App 20050128680 - Shin, Hyo Soon ;   et al. | 2005-06-16 |
TAB tape for semiconductor package Grant 6,853,090 - Kim , et al. February 8, 2 | 2005-02-08 |
High frequency composite component App 20040116089 - Lee, Chang Yong ;   et al. | 2004-06-17 |
TAB tape for semiconductor package App 20030197200 - Kim, Dong Han ;   et al. | 2003-10-23 |
Chip on film (COF) package having test pad for testing electrical function of chip and method for manufacturing same App 20020139567 - Kim, Hyoung-ho ;   et al. | 2002-10-03 |