Kim; Hyeongno

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kim; Hyeongno.The latest application filed is for "semiconductor package magazine".

Company Profile

0.4.9

Kim; Hyeongno - Kyunggi-Do KR
Kim; Hyeongno - Paju-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package Magazine App 20110259840 - Park; Jeeyong ; et al.	2011-10-27
EMI shielded semiconductor package Grant 7,576,415 - Cha , et al. August 18, 2	2009-08-18
Semiconductor package structure and method for manufacturing the same Grant 7,566,962 - Kim July 28, 2	2009-07-28
Chip Package Structure And Method Of Fabricating The Same App 20090127682 - Kim; Hyeongno ; et al.	2009-05-21
Emi Shielded Semiconductor Package App 20080308912 - Cha; Sang Jin ; et al.	2008-12-18
Package structure and manufacturing method thereof App 20080237821 - Kim; Hyeongno ; et al.	2008-10-02
Package structure and method of manufacturing the same App 20080237820 - Kim; Hyeongno ; et al.	2008-10-02
Package structure and manufacturing method thereof App 20080197468 - Kim; Hyeongno ; et al.	2008-08-21
Semiconductor package structure and method for manufacturing the same App 20080150110 - Kim; Hyeongno	2008-06-26
Process and lead frame for making leadless semiconductor packages Grant 7,169,651 - Park , et al. January 30, 2	2007-01-30
Process and lead frame for making leadless semiconductor packages Grant 7,087,461 - Park , et al. August 8, 2	2006-08-08
Process and lead frame for making leadless semiconductor packages App 20060035414 - Park; HyungJun ; et al.	2006-02-16
Singulation Method Used In Leadless Packaging Process App 20020197826 - Kim, Hyeongno ; et al.	2002-12-26

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