Kim; Hui Tae
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kim; Hui Tae.The latest application filed is for "semiconductor package with reduced thickness".
- Kim; Hui Tae - Chungcheongbuk-do KR
- Kim; Hui Tae - Gyeonggi-do KR
- Kim; Hui-Tae - Gyeongsangnam-do KR
| Patent | Date |
|---|---|
| Semiconductor device and manufacturing method thereof Grant 9,449,946 - Sung , et al. September 20, 2 | 2016-09-20 |
| Semiconductor Package with Reduced Thickness App 20150041980 - Ahn; Seo Yeon ; et al. | 2015-02-12 |
| Semiconductor Device And Manufacturing Method Thereof App 20140284785 - Sung; Pil Je ; et al. | 2014-09-25 |
| Method of forming thin film pattern for semiconductor device and apparatus for the same Grant 8,293,651 - Kim , et al. October 23, 2 | 2012-10-23 |
| Photosensor Package App 20100289104 - RA; Jeong Seok ; et al. | 2010-11-18 |
| Method Of Forming Thin Film Pattern For Semiconductor Device And Apparatus For The Same App 20090286403 - KIM; Hui-Tae ; et al. | 2009-11-19 |
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