Kim; Hui-Jae
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kim; Hui-Jae.The latest application filed is for "bonding apparatus".
- Kim; Hui-Jae - Seoul KR
| Patent | Date |
|---|---|
| Bonding apparatus Grant 10,784,130 - Lee , et al. Sept | 2020-09-22 |
| Bonding stage and bonding apparatus comprising the same Grant 10,058,952 - Seok , et al. August 28, 2 | 2018-08-28 |
| Bonding Apparatus App 20180174871 - LEE; Joong-Ha ; et al. | 2018-06-21 |
| Bonding Stage and Bonding Apparatus Comprising the Same App 20170136570 - Seok; Seung Dae ; et al. | 2017-05-18 |
| Semiconductor manufacturing apparatuses comprising bonding heads Grant 9,508,577 - Lee , et al. November 29, 2 | 2016-11-29 |
| Apparatus for bonding semiconductor chips Grant 9,431,365 - Seok , et al. August 30, 2 | 2016-08-30 |
| Apparatus For Bonding Semiconductor Chips App 20160079199 - SEOK; Seung-dae ; et al. | 2016-03-17 |
| Semiconductor Manufacturing Apparatuses And Methods Thereof App 20150155210 - LEE; Byung Joon ; et al. | 2015-06-04 |
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