| Patent | Date |
|---|
Fan-out semiconductor package and method of manufacturing same
Grant 10,340,153 - Kim , et al. | 2019-07-02 |
Metrology system and stage control device using the same
Grant 10,139,249 - Kim , et al. Nov | 2018-11-27 |
Metrology System And Stage Control Device Using The Same
App 20180106645 - KIM; Hong Won ; et al. | 2018-04-19 |
Fan-out Semiconductor Package And Method Of Manufacturing Same
App 20170263573 - KIM; Hong Won ; et al. | 2017-09-14 |
Robot
Grant 9,751,216 - Kim , et al. September 5, 2 | 2017-09-05 |
Dialogue system using extended domain and natural language recognition method and computer-readable medium thereof
Grant 9,495,958 - Kim , et al. November 15, 2 | 2016-11-15 |
Coil Component And Method Of Manufacturing The Same
App 20160276090 - KIM; Jin-Gu ; et al. | 2016-09-22 |
Coil Component
App 20160254086 - KIM; Jin-Gu ; et al. | 2016-09-01 |
Method For Manufacturing Electronic Component Embedding Substrate And Electronic Component Embedding Substrate
App 20160212856 - KIM; Hong Won ; et al. | 2016-07-21 |
Coil-embedded Substrate And Method Of Manufacturing The Same
App 20160196906 - KIM; Hong-Won ; et al. | 2016-07-07 |
Coil Component And Method Of Manufacturing The Same
App 20160196913 - KIM; Hong-Won ; et al. | 2016-07-07 |
Electronic component embedded substrate
Grant 9,237,654 - Kim , et al. January 12, 2 | 2016-01-12 |
Electronic Component Embedded Substrate
App 20150189757 - KIM; Hong-Won ; et al. | 2015-07-02 |
Electronic Component-embedded Substrate And Manufacturing Method Thereof
App 20150085455 - KIM; Hong Won ; et al. | 2015-03-26 |
Method For Manufacturing Electronic Component Embedding Substrate And Electronic Component Embedding Substrate
App 20150049445 - KIM; Hong Won ; et al. | 2015-02-19 |
Method of manufacturing a capacitor-embedded printed circuit board
Grant 8,943,685 - Kweon , et al. February 3, 2 | 2015-02-03 |
Robot
App 20140366676 - KIM; Hong Won ; et al. | 2014-12-18 |
Method of manufacturing a chip embedded printed circuit board
Grant 8,893,380 - Kim , et al. November 25, 2 | 2014-11-25 |
Electronic Component-embedded Printed Circuit Board And Method Of Manufacturing The Same
App 20140298648 - KIM; Hong Won ; et al. | 2014-10-09 |
Dialogue System Using Extended Domain And Natural Language Recognition Method And Computer-readable Medium Thereof
App 20140095152 - KIM; Hong Won ; et al. | 2014-04-03 |
Dialogue system using extended domain and natural language recognition method and computer-readable medium thereof
Grant 8,626,490 - Kim , et al. January 7, 2 | 2014-01-07 |
Robot
Grant 8,554,367 - Kim , et al. October 8, 2 | 2013-10-08 |
Die Package Including Encapsulated Die And Method Of Manufacturing The Same
App 20130056141 - KANG; Joon Seok ; et al. | 2013-03-07 |
Method of manufacturing a chip embedded printed circuit board
Grant 8,351,215 - Kim , et al. January 8, 2 | 2013-01-08 |
Die package including encapsulated die and method of manufacturing the same
Grant 8,334,602 - Kang , et al. December 18, 2 | 2012-12-18 |
Method of manufacturing capacitor-embedded PCB
Grant 8,302,270 - Kim , et al. November 6, 2 | 2012-11-06 |
Robot
App 20110162477 - KIM; Hong Won ; et al. | 2011-07-07 |
Dialogue System Using Extended Domain And Natural Language Recognition Method And Computer-readable Medium Thereof
App 20110166852 - KIM; Hong Won ; et al. | 2011-07-07 |
Electronic Component-embedded Printed Circuit Board And Method Of Manufacturing The Same
App 20110127076 - KIM; Hong Won ; et al. | 2011-06-02 |
Method of manufacturing capacitor-embedded PCB
App 20110099779 - Kim; Woon-Chun ; et al. | 2011-05-05 |
Method Of Manufacturing Wafer Level Package
App 20110097856 - KIM; Hong Won ; et al. | 2011-04-28 |
Method of manufacturing a capacitor-embedded printed circuit board
App 20110035938 - Kweon; Young Do ; et al. | 2011-02-17 |
Method of manufacturing capacitor-embedded PCB
Grant 7,886,414 - Kim , et al. February 15, 2 | 2011-02-15 |
Die Package Including Encapsulated Die And Method Of Manufacturing The Same
App 20100320624 - KANG; Joon Seok ; et al. | 2010-12-23 |
Manufacturing method for multilayer core board
App 20100291488 - Jung; Soon-Oh ; et al. | 2010-11-18 |
Robot
App 20100191373 - Kim; Hong Won ; et al. | 2010-07-29 |
Robot and control method thereof
App 20100185328 - Kim; Hong Won ; et al. | 2010-07-22 |
Robot
App 20100175496 - Kim; Hong Won ; et al. | 2010-07-15 |
Wheel assembly and robot cleaner having the same
App 20100139029 - Kim; Hong Won | 2010-06-10 |
Chip embedded printed circuit board and manufacturing method thereof
App 20100142170 - Kim; Hong Won ; et al. | 2010-06-10 |
Chip embedded printed circuit board and manufacturing method thereof
App 20100134991 - Kim; Hong Won ; et al. | 2010-06-03 |
CMOS image sensor package
App 20090045441 - Kweon; Young Do ; et al. | 2009-02-19 |
Capacitor-embedded printed circuit board and manufacturing method thereof
App 20090046409 - Kweon; Young Do ; et al. | 2009-02-19 |
Method of manufacturing capacitor-embedded PCB
App 20090025195 - Kim; Woon-Chun ; et al. | 2009-01-29 |
Printed circuit board having embedded resistors and method of manufacturing the same
App 20080110669 - Park; Hwa Sun ; et al. | 2008-05-15 |
Core board comprising nickel layer, multilayer board and manufacturing method thereof
App 20070201214 - Jung; Soon-Oh ; et al. | 2007-08-30 |
Printed circuit board, flip chip ball grid array board and method of fabricating the same
App 20060191709 - Kim; Hong Won ; et al. | 2006-08-31 |
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